Self-aligned replacement metal gate process for QWFET devices
    77.
    发明授权
    Self-aligned replacement metal gate process for QWFET devices 有权
    用于QWFET器件的自对准替代金属栅极工艺

    公开(公告)号:US08093584B2

    公开(公告)日:2012-01-10

    申请号:US12317468

    申请日:2008-12-23

    IPC分类号: H01L29/12 H01L29/68 H01L29/78

    摘要: A self-aligned replacement metal gate QWFET device comprises a III-V quantum well layer formed on a substrate, a III-V barrier layer formed on the quantum well layer, a III-V etch stop layer formed on the III-V barrier layer, a III-V source extension region formed on the III-V etch stop layer and having a first sidewall, a source region formed on the III-V source extension region and having a second sidewall, a III-V drain extension region formed on the III-V etch stop layer and having a third sidewall, a drain region formed on the III-V drain extension region and having a fourth sidewall, a conformal high-k gate dielectric layer formed on the first, second, third, and fourth sidewalls and on a top surface of the etch stop layer, and a metal layer formed on the high-k gate dielectric layer.

    摘要翻译: 自对准替代金属栅极QWFET器件包括形成在衬底上的III-V量子阱层,形成在量子阱层上的III-V势垒层,形成在III-V势垒层上的III-V蚀刻停止层 ,III-V源延伸区,形成在III-V蚀刻停止层上,并具有第一侧壁,形成在III-V源极延伸区上并具有第二侧壁的源极区, III-V蚀刻停止层并具有第三侧壁,形成在III-V漏极延伸区上并具有第四侧壁的漏极区,形成在第一,第二,第三和第四上的共形高k栅介质层 侧壁和蚀刻停止层的顶表面,以及形成在高k栅极电介质层上的金属层。

    Self-aligned replacement metal gate process for QWFET devices
    79.
    发明申请
    Self-aligned replacement metal gate process for QWFET devices 有权
    用于QWFET器件的自对准替代金属栅极工艺

    公开(公告)号:US20100155701A1

    公开(公告)日:2010-06-24

    申请号:US12317468

    申请日:2008-12-23

    IPC分类号: H01L29/66

    摘要: A self-aligned replacement metal gate QWFET device comprises a III-V quantum well layer formed on a substrate, a III-V barrier layer formed on the quantum well layer, a III-V etch stop layer formed on the III-V barrier layer, a III-V source extension region formed on the III-V etch stop layer and having a first sidewall, a source region formed on the III-V source extension region and having a second sidewall, a III-V drain extension region formed on the III-V etch stop layer and having a third sidewall, a drain region formed on the III-V drain extension region and having a fourth sidewall, a conformal high-k gate dielectric layer formed on the first, second, third, and fourth sidewalls and on a top surface of the etch stop layer, and a metal layer formed on the high-k gate dielectric layer.

    摘要翻译: 自对准替代金属栅极QWFET器件包括形成在衬底上的III-V量子阱层,形成在量子阱层上的III-V势垒层,形成在III-V势垒层上的III-V蚀刻停止层 ,III-V源延伸区,形成在III-V蚀刻停止层上,并具有第一侧壁,形成在III-V源极延伸区上并具有第二侧壁的源极区, III-V蚀刻停止层并具有第三侧壁,形成在III-V漏极延伸区上并具有第四侧壁的漏极区,形成在第一,第二,第三和第四上的共形高k栅介质层 侧壁和蚀刻停止层的顶表面,以及形成在高k栅极电介质层上的金属层。