Semiconductor layers with roughness patterning
    73.
    发明授权
    Semiconductor layers with roughness patterning 有权
    具有粗糙图案化的半导体层

    公开(公告)号:US06969634B2

    公开(公告)日:2005-11-29

    申请号:US10669780

    申请日:2003-09-24

    申请人: Zhenan Bao

    发明人: Zhenan Bao

    摘要: A method for making an IC on a surface of a planar substrate includes forming a continuous first layer on the surface of the substrate and pressing a surface of a stamp into the first layer to produce a pattern of non-intersecting smooth regions on the surface. A rough region of the surface of the first layer laterally borders and laterally surrounds each smooth region of the surface of the first layer. The pattern of smooth and rough regions on the surface of the first layer copies a pattern of smooth and rough areas on the surface of the stamp. The method also includes forming a continuous second layer on the patterned first layer. The first layer is one of a dielectric layer and an organic semiconductor layer, and the second layer is the other of a dielectric layer and an organic semiconductor layer.

    摘要翻译: 在平面基板的表面上制造IC的方法包括在基板的表面上形成连续的第一层,并将印模的表面按压到第一层中,以在表面上产生不相交的平滑区域的图案。 第一层的表面的粗糙区横向地邻接并横向围绕第一层的表面的每个平滑区域。 在第一层表面上的平滑和粗糙区域的图案在印模的表面上复制了平滑和粗糙区域的图案。 该方法还包括在图案化的第一层上形成连续的第二层。 第一层是电介质层和有机半导体层之一,第二层是电介质层和有机半导体层中的另一层。

    Forming patterned thin film metal layers
    77.
    发明授权
    Forming patterned thin film metal layers 有权
    形成图案化的薄膜金属层

    公开(公告)号:US06770549B2

    公开(公告)日:2004-08-03

    申请号:US10141362

    申请日:2002-05-08

    IPC分类号: H01L2120

    摘要: The specification describes a pattern transfer technique for forming patterns of thin films of high resolution over large areas. It involves forming a pattern layer on a transfer substrate, patterning the pattern layer while on the transfer substrate, then contacting the transfer substrate with the receiving substrate. The surface of the receiving substrate is treated to activate the surface thereby improving adhesion of the transfer pattern to the receiving substrate. The activation treatment involves forming a layer of metal particles on the surface of the receiving substrate. The pattern layer is preferably of the same metal, or a similar metal or alloy, and is transferred from the transfer substrate to the receiving substrate by metallurgical bonding. The method of the invention is particularly useful for printing metal conductor patterns (metalization), and device features, on flexible polymer substrates in, for example, thin film transistor (TFT) technology.

    摘要翻译: 本说明书描述了用于在大面积上形成高分辨率薄膜图案的图案转印技术。 它涉及在转移基板上形成图案层,在转印衬底上图案化图案层,然后使转印衬底与接收衬底接触。 处理接收基板的表面以激活表面,从而改善转印图案对接收基板的粘附。 活化处理包括在接收基材的表面上形成一层金属颗粒。 图案层优选为相同的金属或类似的金属或合金,并且通过冶金结合从转印基板转移到接收基板。本发明的方法特别适用于印刷金属导体图案(金属化)和 在诸如薄膜晶体管(TFT)技术的柔性聚合物基板上的器件特征。

    Polarizable photoactive and electroactive polymers and light emitting devices
    80.
    发明授权
    Polarizable photoactive and electroactive polymers and light emitting devices 失效
    可极化的光敏和电活性聚合物和发光器件

    公开(公告)号:US06383665B1

    公开(公告)日:2002-05-07

    申请号:US09377879

    申请日:1999-08-19

    IPC分类号: C08G1840

    摘要: The invention relates to poly(phenylene vinylene) polymers substituted with dendritic sidechains to enhance main-chain separation in the solid state. The polymers are synthesized by the Heck polymerization and have a weight-average molecular weight of 20,000 to 60,000 Daltons. The polymers are self-ordering in the solid state and have thermotropic liquid crystalline phases. The polymers show enhanced photoconductivity, better charge transport capability and improved polarized light emission.

    摘要翻译: 本发明涉及用树枝状侧链取代的聚(亚苯基亚乙烯基)聚合物,以增强固态中的主链分离。 聚合物通过Heck聚合合成,重均分子量为20,000至60,000道尔顿。 聚合物在固态下是自排序的并具有热致液晶相。 聚合物显示增强的光电导性,更好的电荷传输能力和改进的偏振光发射。