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    Microsystem Comprising A Deformable Bridge
    71.
    发明申请
    Microsystem Comprising A Deformable Bridge 失效
    包含变形桥的微系统

    公开(公告)号：US20070279831A1

    公开(公告)日：2007-12-06

    申请号：US11663737

    申请日：2005-10-11

    Applicant: Pierre-Louis Charvet

    Inventor： Pierre-Louis Charvet

    IPC: H01H59/00

    CPC classification number: B81B3/0086 ,  B81B2201/016 ,  H01H59/0009

    Abstract: The invention relates to a microsystem comprising a deformable bridge, the ends of which are connected to a substrate. According to the invention, at least one actuation electrode, which is solidly connected to the bridge, is disposed between the center of the bridge and one of the ends next to a counter electrode which is solidly connected to the substrate. The electrodes are intended to deform the deformable bridge such that a lower face of the bridge comes into contact with a contact element formed on the substrate.

    Abstract translation: 本发明涉及一种微系统，其包括可变形桥，其可变形桥的端部连接到基板。 根据本发明，至少一个牢固地连接到桥的致动电极设置在桥的中心和紧邻与基板牢固连接的对电极之间的一个端部之间。 电极旨在使可变形桥变形，使得桥的下表面与形成在基板上的接触元件接触。

    Microelectromechanical system able to switch between two stable positions
    72.
    发明授权
    Microelectromechanical system able to switch between two stable positions 有权
    微机电系统能够在两个稳定位置之间切换

    公开(公告)号：US07268653B2

    公开(公告)日：2007-09-11

    申请号：US11050482

    申请日：2005-02-03

    Applicant: Guillaume Bouche

    Inventor： Guillaume Bouche

    IPC: H01H51/22

    CPC classification number: B81B3/0054 ,  B81B2201/016 ,  H01G5/16 ,  H01H1/0036 ,  H01H50/005 ,  H01H57/00 ,  H01H59/0009 ,  H01H2001/0042 ,  H01H2057/006 ,  H01H2061/006 ,  Y10T307/74

    Abstract: A microelectromechanical system includes separate conducting elements. An electromechanically deformable element can be switched between a first stable position and a second stable position. Contact elements allow for electrical continuity to be established between the separate conducting elements. Switch control elements ensure that the first deformable element switches so as to establish electrical continuity between the separate conducting elements in the second stable position, by contact between the contact elements, and to break electrical continuity by separating the contact elements in the first stable position. The separate conducting elements and the contact elements are carried by the deformable element.

    Abstract translation: 微机电系统包括单独的导电元件。 机电可变形元件可以在第一稳定位置和第二稳定位置之间切换。 接触元件允许在单独的导电元件之间建立电连续性。 开关控制元件确保第一可变形元件切换以便通过接触元件之间的接触在第二稳定位置中的分开的导电元件之间建立电连续性，并且通过在第一稳定位置分离接触元件来断开电连续性。 单独的导电元件和接触元件由可变形元件承载。

    Micro-electro mechanical systems switch and method of fabricating the same
    73.
    发明申请
    Micro-electro mechanical systems switch and method of fabricating the same 有权
    微机电系统开关及其制造方法

    公开(公告)号：US20070170460A1

    公开(公告)日：2007-07-26

    申请号：US11440863

    申请日：2006-05-24

    Applicant: Jae Lee ,  Chang Je ,  Sung Kang

    Inventor： Jae Lee ,  Chang Je ,  Sung Kang

    IPC: H01L29/74 ,  H01L31/111 ,  H01L29/32

    CPC classification number: H01H59/0009 ,  B81B3/0013 ,  B81B3/0072 ,  B81B2201/016

    Abstract: A MEMS switch and a method of manufacturing the same are disclosed. The MEMS switch includes: a substrate including a trench, a ground line and a signal line having an opened portion; a moving plate separated from the substrate at a predetermined space and including a contact member for connecting an electrode plate and the opened portion and having a deep corrugate to insert the trench; and a supporting member for supporting the moving plate. Such a MEMS switch prevents the thermal expansion and the stiction problem.

    Abstract translation: 公开了一种MEMS开关及其制造方法。 MEMS开关包括：包括沟槽，接地线和具有开口部分的信号线的衬底; 移动板在预定的空间处与基板分离，并且包括用于连接电极板和开口部分并具有深波纹以便插入沟槽的接触构件; 以及用于支撑移动板的支撑构件。 这样的MEMS开关可防止热膨胀和静电问题。

    Micro electromechanical device with stress and stress gradient compensation
    74.
    发明申请
    Micro electromechanical device with stress and stress gradient compensation 审中-公开
    具有应力和应力梯度补偿的微机电装置

    公开(公告)号：US20070069605A1

    公开(公告)日：2007-03-29

    申请号：US11453697

    申请日：2006-06-15

    Applicant: Gerrit Klaasse ,  Hendrikus Tilmans

    Inventor： Gerrit Klaasse ,  Hendrikus Tilmans

    IPC: H02N1/00 ,  H01L41/00

    CPC classification number: B81B3/0072 ,  B81B2201/016 ,  H01L41/0933 ,  H02N1/002

    Abstract: Micro electromechanical devices and methods for designing such devices are disclosed. An example micro electromechanical device includes at least two anchors. The example device also includes a floating element. The floating element extends between the at least two anchors and includes a predetermined reference portion. In at least one predetermined state during operation of the device, the reference portion is located within a predetermined reference plane. The floating element includes at least two flexible sections, where the at least two flexible sections each extends between the reference portion and a respective one of the anchors. In the example device, at least two of the at least two flexible sections include respective stress relieving elements. The stress relieving elements enable deflection of the floating element as a result of a stress gradient. The stress relieving elements are provided at predetermined locations between the respective anchors and the reference portion, where the predetermined locations are selected such that the reference portion is substantially located within the predetermined reference plane in the at least one predetermined state of the device.

    Abstract translation: 公开了用于设计这种装置的微机电装置和方法。 示例性微机电装置包括至少两个锚。 示例设备还包括浮动元件。 浮动元件在至少两个锚固件之间延伸并且包括预定的参考部分。 在设备运行期间的至少一个预定状态下，参考部分位于预定的参考平面内。 浮动元件包括至少两个柔性部分，其中至少两个柔性部分各自在参考部分和相应的一个锚固件之间延伸。 在示例性装置中，至少两个柔性部分中的至少两个包括各自的应力释放元件。 应力消除元件使得浮动元件由于应力梯度而偏转。 应力消除元件设置在相应的锚固件和参考部分之间的预定位置处，其中预定位置被选择为使得参考部分在装置的至少一个预定状态中基本上位于预定参考平面内。

    Device having one or more contact structures interposed between a pair of electrodes
    76.
    发明授权
    Device having one or more contact structures interposed between a pair of electrodes 失效
    具有插入在一对电极之间的一个或多个接触结构的装置

    公开(公告)号：US06787438B1

    公开(公告)日：2004-09-07

    申请号：US09981610

    申请日：2001-10-16

    Applicant: Richard D. Nelson

    Inventor： Richard D. Nelson

    IPC: H01L2120

    CPC classification number: B81B3/0072 ,  B81B2201/016 ,  G02B26/0841 ,  G02B26/085 ,  G02B26/0858 ,  G02B26/0866 ,  H01H59/0009

    Abstract: A microelectromechanical device is provided which includes a contact structure interposed between a pair of electrodes arranged beneath a beam. In some embodiments, the device may include additional contact structures interposed between the pair of electrodes. For example, the device may include at least three contact structures between the pair of electrodes. In some embodiments, the beam may be suspended above the pair of electrodes by a support structure affixed to a first end of the beam. Such a device may further include an additional support structure affixed to a second end of the beam. In some cases, the device may be adapted to pass a signal from the first end to the second end of the beam. In addition or alternatively, the device may be adapted to pass the signal between one or both ends of the beam and one or more of the contact structures.

    Abstract translation: 提供了一种微电子机械装置，其包括插入在布置在梁下方的一对电极之间的接触结构。 在一些实施例中，该装置可以包括插入该对电极之间的附加接触结构。 例如，该装置可以包括在该对电极之间的至少三个接触结构。 在一些实施例中，梁可以通过固定到梁的第一端的支撑结构悬挂在一对电极之上。 这种装置还可以包括固定到梁的第二端的附加支撑结构。 在一些情况下，设备可以适于将信号从第一端传递到光束的第二端。 另外或替代地，该装置可以适于在横梁的一端或两端和一个或多个接触结构之间传递信号。

    METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SWITCHES ON CMOS COMPATIBLE SUBSTRATES
    77.
    发明申请
    METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SWITCHES ON CMOS COMPATIBLE SUBSTRATES 有权
    在CMOS兼容基板上制作微电子开关的方法

    公开(公告)号：US20030148550A1

    公开(公告)日：2003-08-07

    申请号：US10014660

    申请日：2001-11-07

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Richard P. Volant ,  John C. Bisson ,  Donna R. Cote ,  Timothy J. Dalton ,  Robert A. Groves ,  Kevin S. Petrarca ,  Kenneth J. Stein ,  Seshadri Subbanna

    IPC: H01L021/00

    CPC classification number: B81C1/00246 ,  B81B2201/016 ,  B81B2201/018 ,  B81B2203/0127 ,  B81B2207/07 ,  B81C1/00611 ,  B81C2201/0122 ,  B81C2203/0735 ,  H01G5/40 ,  H01H59/0009

    Abstract: A method of fabricating micro-electromechanical switches (MEMS) integrated with conventional semiconductor interconnect levels, using compatible processes and materials is described. The method is based upon fabricating a capacitive switch that is easily modified to produce various configurations for contact switching and any number of metal-dielectric-metal switches. The process starts with a copper damascene interconnect layer, made of metal conductors inlaid in a dielectric. All or portions of the copper interconnects are recessed to a degree sufficient to provide a capacitive air gap when the switch is in the closed state, as well as provide space for a protective layer of, e.g., Ta/TaN. The metal structures defined within the area specified for the switch act as actuator electrodes to pull down the movable beam and provide one or more paths for the switched signal to traverse. The advantage of an air gap is that air is not subject to charge storage or trapping that can cause reliability and voltage drift problems. Instead of recessing the electrodes to provide a gap, one may just add dielectric on or around the electrode. The next layer is another dielectric layer which is deposited to the desired thickness of the gap formed between the lower electrodes and the moveable beam that forms the switching device. Vias are fabricated through this dielectric to provide connections between the metal interconnect layer and the next metal layer which will also contain the switchable beam. The via layer is then patterned and etched to provide a cavity area which contains the lower activation electrodes as well as the signal paths. The cavity is then back-filled with a sacrificial release material. This release material is then planarized with the top of the dielectric, thereby providing a planar surface upon which the beam layer is constructed.

    Abstract translation: 描述了使用兼容工艺和材料制造与常规半导体互连级别集成的微机电开关（MEMS）的方法。 该方法基于制造容易修改以产生用于接触切换和任何数量的金属 - 介电金属开关的各种配置的电容开关。 该过程开始于铜镶嵌互连层，由金属导体嵌入电介质中。 铜互连的全部或部分凹陷到足以在开关处于闭合状态时提供电容气隙的程度，并为例如Ta / TaN的保护层提供空间。 在为开关指定的区域内限定的金属结构用作致动器电极以下拉可移动光束并且提供一个或多个路径用于开关信号横越。 气隙的优点是空气不会受到可能导致可靠性和电压漂移问题的电荷储存或捕集。 代替使电极凹陷以提供间隙，可以仅在电极上或周围添加电介质。 下一层是另一介质层，其被沉积到形成在下电极和形成开关器件的可移动梁之间的间隙的期望厚度上。 通过该电介质制造通孔以提供金属互连层和还包含可切换光束的下一个金属层之间的连接。 然后对通孔层进行图案化和蚀刻以提供包含下部激活电极以及信号路径的空腔区域。 然后用牺牲脱模材料填充空腔。 然后将该释放材料与电介质的顶部平坦化，由此提供构造波束层的平坦表面。

    Micromechanical device and method of manufacture thereof
    78.
    发明申请
    Micromechanical device and method of manufacture thereof 失效
    微机械装置及其制造方法

    公开(公告)号：US20030042561A1

    公开(公告)日：2003-03-06

    申请号：US10230200

    申请日：2002-08-29

    Inventor： Hideyuki Funaki

    IPC: H01L029/82

    CPC classification number: H03H9/462 ,  B81B3/0021 ,  B81B2201/016 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/051 ,  H01H13/80 ,  H01H59/0009 ,  H01H2001/0078 ,  H01H2201/008 ,  H03H3/0072

    Abstract: A micromechanical switch comprises a substrate, at least one pair of support members fixed to the substrate, at least one pair of beam members placed in proximity and parallel to each other above the substrate, and connected to one of the support members, respectively, each of the beam members having a moving portion which is movable with a gap with respect to the substrate, and a contact portion provided on the moving portion, and a driving electrode placed on the substrate between the pair of beam members to attract the moving portions of the beam members in a direction parallel to the substrate with electrostatic force so that the contact portions of the beam members which are opposed to each other are short-circuited.

    Abstract translation: 微机械开关包括基板，固定到基板的至少一对支撑构件，至少一对梁构件，其彼此靠近并平行放置在基板上方并分别连接到支撑构件之一 所述梁构件具有可相对于所述基板间隙移动的移动部分和设置在所述移动部分上的接触部分，以及设置在所述一对梁构件之间的所述基板上的驱动电极，以吸引所述移动部分的移动部分 梁构件在与静电力平行的方向上使得梁构件彼此相对的接触部分短路。

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