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公开(公告)号：US11670276B2
公开(公告)日：2023-06-06
申请号：US17420111
申请日：2020-01-03
发明人： Geon-Seok Kim
IPC分类号： G10K11/178 , H04R1/04 , H04R1/08 , H04R1/22
CPC分类号： G10K11/17825 , H04R1/04 , H04R1/08 , G10K2210/12821 , G10K2210/3226 , H04R1/222 , H04R2201/003
摘要： Noise signals are captured from one or more physical error microphones located at first locations within the vehicle. High-frequency noise signals are captured from a feedforward system sensor. A virtual microphone algorithm is utilized to estimate noise signals at a virtual location based on the noise signals, the estimation utilizing a transfer function that estimates a signal that would have been received by the one or more physical error microphones at the virtual location. The virtual microphone algorithm is utilized to estimate noise signals at the virtual location based on the high-frequency noise signal. A noise-cancelling signal is provided to cancel noise at the virtual location, the noise-cancelling signal accounting for the noise captured by both the feedforward system sensor and the one or more physical error microphones, the ANC system utilizing a working frequency for the ANC of at least 2 kHz.
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公开(公告)号：US20190069062A1
公开(公告)日：2019-02-28
申请号：US15908178
申请日：2018-02-28
摘要： According to one embodiment, a microphone cooperation device includes a first device including a first microphone and a first speaker, and a second device including a second microphone and a second speaker. The first device and the second device are capable of a first action of joining a group of devices when the second microphone receives a first sound wave emitted from the first speaker.
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公开(公告)号：US20190045284A1
公开(公告)日：2019-02-07
申请号：US15984534
申请日：2018-05-21
申请人： James J. Fallon
发明人： James J. Fallon
CPC分类号： H04R1/025 , H04R1/222 , H04R1/2803 , H04R3/04 , H04R5/02 , H04R29/003 , H04R2420/07 , H04R2420/09
摘要： Systems, methods, and apparatus are provided for recording high output power levels of sound at low sound pressure levels. For example, an apparatus comprises an enclosure, a speaker disposed within the enclosure, a microphone disposed within the enclosure, and an evacuation port. The evacuation port is configured to connect to a system that reduces a pressure level within the enclosure to a level that is less than an ambient air pressure level outside the enclosure. The enclosure is sealed or otherwise configured to provide a sealed enclosure, to maintain the reduced air pressure within the enclosure. The speaker can be driven by an amplifier at high output power levels to generate a distorted sound of an amplified electric musical instrument for recording purposes, while the reduced pressure level within the enclosure serves to attenuate the sound pressure level and perceived loudness which emanates from the speaker.
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公开(公告)号：US20180376239A1
公开(公告)日：2018-12-27
申请号：US16000876
申请日：2018-06-05
CPC分类号： H04R1/222 , H04R1/245 , H04R1/406 , H04R3/005 , H04R2201/401 , H04R2201/405 , H04R2203/12
摘要： A sound collecting apparatus capable of effectively suppressing sounds other than a target sound is provided. The sound collecting apparatus includes a plurality of microphones. A total number of effective microphone pairs in which a distance between two microphones is smaller than a distance D is larger than a total number of the plurality of microphones. The distance D is represented by D=c/2f, where the frequency of the target sound acquired from each of the plurality of microphones is f and sound velocity is c. When an angle formed by a straight line connecting two microphones configuring an effective microphone pair and a predetermined straight line is θ, the angles θ of all effective microphone pairs acquired from the plurality of microphones are different from each other.
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公开(公告)号：US20180184212A1
公开(公告)日：2018-06-28
申请号：US15901830
申请日：2018-02-21
申请人： OMRON Corporation
发明人： Takashi Kasai , Yuki Uchida
CPC分类号： H04R19/04 , B81B3/00 , B81B2201/0257 , B81B2201/0264 , H01L29/84 , H04R1/222 , H04R19/005 , H04R2201/003
摘要： A capacitive transducer includes a substrate having an opening in a surface thereof, a back plate facing the opening in the substrate, a vibration electrode film facing the back plate across a space, the vibration electrode film being displaceable to have a displacement converted into a change in capacitance between the vibration electrode film and the back plate, an airflow channel defined by a gap between a protrusion integral with the back plate and a part of the vibration electrode film, the airflow channel being configured to increase an area of air flow when the vibration electrode film deforms under pressure to move relative to the protrusion integral with the back plate and relieve the pressure applied to the vibration electrode film to serve as a pressure relief channel, and an extension formed at a periphery of a hole in the vibration electrode film defining the pressure relief channel.
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公开(公告)号：US09986319B2
公开(公告)日：2018-05-29
申请号：US15417184
申请日：2017-01-26
CPC分类号： H04R1/02 , B81B2201/0257 , H04R1/04 , H04R1/086 , H04R1/222 , H04R1/38 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2499/11
摘要： A MEMS sensor is disclosed. The MEMS sensor includes a housing having an acoustic port, a base plate forming an accommodation cavity together with the housing, a MEMS chip accommodated in the accommodation cavity, and a control mechanism having a first working position and a second working position. At the first working position, the acoustic port communicates the accommodation cavity with an external space of the housing, while at the second working position, the control mechanism isolates the accommodation cavity from the external space of the housing.
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公开(公告)号：US09980038B2
公开(公告)日：2018-05-22
申请号：US15606686
申请日：2017-05-26
发明人： Anthony D. Minervini
IPC分类号： H04R1/28 , B81B7/00 , H04R19/00 , H04R19/01 , H04R19/04 , H04R31/00 , B81C1/00 , H01L23/10 , H01L23/15 , H04R1/04 , H04R3/00 , B81C3/00 , B81B3/00 , H01L21/78 , H04R1/22 , H04R23/00
CPC分类号： H04R1/2892 , B81B3/0021 , B81B7/0038 , B81B7/0058 , B81B7/0061 , B81B7/0064 , B81B7/007 , B81B2201/0257 , B81B2207/092 , B81C1/00158 , B81C1/00301 , B81C3/00 , H01L21/78 , H01L23/10 , H01L23/15 , H01L2924/0002 , H01L2924/1461 , H04R1/04 , H04R1/222 , H04R3/00 , H04R19/005 , H04R19/016 , H04R19/04 , H04R23/00 , H04R31/006 , H04R2201/003 , H04R2225/49 , H04R2410/03 , Y10T29/49005 , Y10T29/4908 , Y10T29/49798 , H01L2924/00
摘要： A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.
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公开(公告)号：US20180139547A1
公开(公告)日：2018-05-17
申请号：US15868597
申请日：2018-01-11
申请人： OTICON A/S
发明人： Troels Holm PEDERSEN , Claus TIPSMARK , Michael Frank PETERSEN , Brian SPIDSBJERG , Lars MONROY , Lars PERSSON , Svend Oscar PETERSEN
CPC分类号： H04R25/48 , H04R1/222 , H04R1/28 , H04R25/604 , H04R25/608 , H04R25/65
摘要： The disclosure relates to an inlet member for a microphone system in a hearing instrument, such as a hearing aid, wherein the inlet member has a main body portion having a first portion and a second portion, the second portion being provided with a first recess for accommodating a microphone comprising a snout for conducting sound energy into the interior of the microphone, wherein the first recess is provided with a sound channel formed for engagement with the snout of the microphone, where the sound channel at the end hereof facing away from the microphone is acoustically coupled to a third recess in the first portion, the third recess being defined by wall portions that provide a seal to corresponding inner surface portions of a hearing instrument, in which the inlet member is mounted.
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公开(公告)号：US20180115810A1
公开(公告)日：2018-04-26
申请号：US15417184
申请日：2017-01-26
CPC分类号： H04R1/02 , B81B2201/0257 , H04R1/04 , H04R1/086 , H04R1/222 , H04R1/38 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2499/11
摘要： A MEMS sensor is disclosed. The MEMS sensor includes a housing having an acoustic port, a base plate forming an accommodation cavity together with the housing, a MEMS chip accommodated in the accommodation cavity, and a control mechanism having a first working position and a second working position. At the first working position, the acoustic port communicates the accommodation cavity with an external space of the housing, while at the second working position, the control mechanism isolates the accommodation cavity from the external space of the housing.
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公开(公告)号：US09854350B2
公开(公告)日：2017-12-26
申请号：US15126863
申请日：2015-02-18
申请人： Epcos AG
发明人： Wolfgang Pahl
CPC分类号： H04R1/222 , B81B7/0061 , B81B7/0064 , B81B2201/0257 , B81B2203/0127 , B81B2207/015 , B81C1/00309 , H01L2224/16225 , H01L2924/16151 , H01L2924/16152 , H04R1/04 , H04R1/2807 , H04R19/016 , H04R19/04 , H04R31/006 , H04R2201/003
摘要： For a microphone having an increased rear volume, a cavity housing is proposed, comprising at least a base plate and a covering, which define and enclose the cavity. On the base plate, a microphone transducer, usually an MEMS component, is mounted alongside a sound guiding element. The microphone transducer and the sound guiding element are sealed off with respect to the base plate by a partition and separate the front volume from a rear volume under the covering. The sound guiding element provides a sound channel, which connects an opening in the covering to the front volume. The sound guiding element finishes right up against the covering and thus seals off the sound channel with respect to the rear volume.
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