公开(公告)号：US20210023535A1

公开(公告)日：2021-01-28

申请号：US17066149

申请日：2020-10-08

申请人： Sony Corporation

发明人： Hironori Iida ,  Seiichiro Tabata ,  Shinichiro Yamada ,  Tsutomu Noguchi ,  Shun Yamanoi

IPC分类号： B01J21/18 ,  A61K8/19 ,  A61L9/01 ,  A61L9/20 ,  A61Q19/08 ,  B01D53/02 ,  B01D53/88 ,  B01J20/02 ,  B01J20/06 ,  B01J20/20 ,  B01J20/28 ,  B01J20/32 ,  B01J35/00 ,  C02F1/28 ,  C01B32/00 ,  C01B32/30 ,  A61K8/9711 ,  A61K8/9739 ,  A61K8/9741 ,  A61K8/9789 ,  A61K8/9794 ,  C01B32/318 ,  A61K47/06 ,  B05D1/18 ,  B05D3/04 ,  B05D3/10 ,  C25D3/56 ,  C25D7/00 ,  H01B1/04 ,  H01F1/01 ,  H01L31/0264

摘要： A porous carbon material composite formed of a porous carbon material and a functional material and equipped with high functionality. The porous carbon material composite is formed of (A) a porous carbon material obtainable from a plant-derived material having a silicon (Si) content of 5 wt % or higher as a raw material; and (B) a functional material adhered on the porous carbon material, and has a specific surface area of 10 m2/g or greater as determined by the nitrogen BET method and a pore volume of 0.1 cm3/g or greater as determined by the BJH method and MP method.

公开(公告)号：US20210022261A1

公开(公告)日：2021-01-21

申请号：US17032956

申请日：2020-09-25

申请人： Apple Inc.

发明人： Bryan P. KIPLE ,  Charles B. WOODHULL ,  David A. PAKULA ,  Tang Y. TAN

IPC分类号： H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11

摘要： Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US10826203B2

公开(公告)日：2020-11-03

申请号：US14411766

申请日：2013-06-27

申请人： JX Nippon Mining & Metals Corporation

发明人： Yoshitaka Shibuya ,  Kazuhiko Fukamachi ,  Atsushi Kodama

IPC分类号： B32B15/01 ,  H01R13/03 ,  H05K1/18 ,  C23C22/07 ,  C25D5/10 ,  H01R4/58 ,  C25D7/00 ,  C22C5/06 ,  C25D5/12 ,  C25D5/50 ,  H01B1/02 ,  C25D5/48 ,  C25D11/36 ,  C23C28/02 ,  C25D9/02 ,  H01R43/00 ,  C25D3/56 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/30

摘要： The present invention provides metallic materials for electronic components, having low degree of whisker formation, low adhesive wear property and high durability, and connector terminals, connectors and electronic components using such metallic materials. The metallic material for electronic components includes: a base material; a lower layer formed on the base material, the lower layer being constituted with one or two or more selected from a constituent element group A, namely, the group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer formed on the lower layer, the intermediate layer being constituted with one or two or more selected from a constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir; and an upper layer formed on the intermediate layer, the upper layer being constituted with an alloy composed of one or two or more selected from the constituent element group B, namely, the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir and one or two selected from a constituent element group C, namely, the group consisting of Sn and In; wherein the thickness of the lower layer is 0.05 μm or more and less than 5.00 μm; the thickness of the intermediate layer is 0.01 μm or more and less than 0.50 μm; and the thickness of the upper layer is 0.02 μm or more and less than 0.80 μm.

公开(公告)号：US10822711B2

公开(公告)日：2020-11-03

申请号：US15028633

申请日：2014-10-10

申请人： Magna International Inc.

发明人： Ryan R. Case ,  Michael A. West ,  Lastawork Araya

IPC分类号： C25D7/00 ,  B32B3/04 ,  B32B3/26 ,  C25D5/02 ,  B29C45/00 ,  B29C45/16 ,  B29C37/00 ,  C25D3/04 ,  C25D5/54 ,  B29K69/00 ,  B29L31/00 ,  B29K255/02 ,  B29L9/00 ,  B29L31/30

摘要： A final injection molded assembly and process for making same that eliminates paint and reduces areas of wasted chrome material. The final injection molded assembly has at least one first injection molded part of a non-plateable first material, at least one overmolded part of plateable second material, at least one pathway through the assembly and integrated features operable for selectively applying an electric current. The pathway creates a predetermined surface path arrangement for applying chrome to desired predetermined plateable areas. A shot of each material is delivered to an injection molding rotary device to produce the injection molded assembly which is then affixed to a chroming process line where electric current is applied. As the electric current is applied and chrome is delivered only the plateable second material will accept the chrome.

公开(公告)号：US10811376B2

公开(公告)日：2020-10-20

申请号：US15509333

申请日：2014-09-09

申请人： Senju Metal Industry Co., Ltd.

发明人： Hiroyoshi Kawasaki ,  Takahiro Roppongi ,  Daisuke Soma ,  Isamu Sato ,  Yuji Kawamata

IPC分类号： B23K35/00 ,  H01L23/00 ,  H01L23/522 ,  B22F1/00 ,  H01L23/50 ,  B23K35/26 ,  C22C13/00 ,  C25D5/12 ,  C22C9/00 ,  C25D7/00 ,  C25D5/10 ,  B23K35/30 ,  B23K35/02 ,  B23K35/36 ,  B32B15/01 ,  B32B15/20 ,  H01L23/48 ,  H05K3/40 ,  H01B1/02 ,  H01L21/288 ,  H01L21/768

摘要： Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 μm, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

公开(公告)号：US10804633B2

公开(公告)日：2020-10-13

申请号：US16341080

申请日：2017-10-11

申请人： AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Akihiro Kato ,  Hajime Watanabe ,  Yoshiyasu Tsuchiya

IPC分类号： H01R13/02 ,  H01R13/03 ,  C25D5/10 ,  C25D7/00 ,  C25D5/50 ,  H01R13/187

摘要： An electrical contact point including: a first contact and a second contact capable of forming an electrical contact each other, wherein: the first contact includes an alloy containing layer having alloy parts made of an alloy containing tin and palladium and a tin part made of tin or an alloy having a higher ratio of tin to palladium than the alloy parts with both the alloy parts and the tin part exposed on an outermost surface; and the second contact includes a dissimilar metal layer made of metal having a higher hardness than the alloy containing layer and containing neither tin nor palladium on an outermost surface.

公开(公告)号：US20200319038A1

公开(公告)日：2020-10-08

申请号：US16843659

申请日：2020-04-08

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Ralf Jakobskrueger MUENSTER ,  Sreenivasan Kalyani KODURI ,  Benjamin Stassen COOK

IPC分类号： G01L1/00 ,  G01L3/02 ,  C25D7/00

摘要： In examples, a system comprises a member to receive a mechanical force, and a sensor to sense the mechanical force. The sensor is mounted on the member using a set of nanoparticles and a set of nanowires coupled to the set of nanoparticles.

公开(公告)号：US20200300285A1

公开(公告)日：2020-09-24

申请号：US16896344

申请日：2020-06-09

申请人： Illinois Tool Works Inc.

发明人： Christopher A. Horst ,  Donald E. Bergstrom ,  Johnny Bertelsen ,  Signe Tolberg Andersen ,  Flemming Sørensen

IPC分类号： F16B15/00 ,  C23C4/02 ,  C23C4/18 ,  B21G5/00 ,  C23C4/131 ,  C23C2/06 ,  C23C2/26 ,  C25D5/48 ,  C25D7/06 ,  B21G3/00 ,  B05B13/02 ,  B05C11/06 ,  B05C5/02 ,  B05C9/14 ,  F16B33/00 ,  C23C2/04 ,  C23C4/08 ,  C23C4/12 ,  C25D3/22 ,  C25D7/00

摘要： A method of applying a corrosion-resistant coating to a fastener that includes preheating an area of the fastener to be coated to elevate a temperature of the area and spraying the preheated area of the fastener with a molten or semi-molten metal. In one embodiment, a corrosion-resistant coating applicator includes a support structure, a rotatable slotted fastener conveyer supported by the support structure, a feeder configured to feed fasteners to the rotatable slotted fastener conveyer, a fastener aligner configured to make head portions of the fasteners aligned with each other, a heater configured to heat head portions of the fasteners as the fasteners are being conveyed by the slotted fastener conveyer, and a sprayer configured to apply a corrosion-resistant coating to the heated head portions of the fasteners being conveyed by the slotted fastener conveyer. The present disclosure also provides corrosion-resistant coated fasteners made using the coating methods and/or coating apparatus.

公开(公告)号：US20200291780A1

公开(公告)日：2020-09-17

申请号：US16889281

申请日：2020-06-01

申请人： Raytheon Technologies Corporation

发明人： Lei Chen ,  William J. Brindley ,  Monika D. Kinstler

IPC分类号： F01D5/00 ,  C25D7/00 ,  C25D3/56 ,  C25D5/12 ,  C25D5/18 ,  C25D5/50 ,  C25D17/10 ,  F01D5/28 ,  C25D3/66 ,  C22C19/05 ,  C22F1/10 ,  F01D9/02

摘要： An cicctrodcposited nickel-chromium-aluminum (Ni—Cr—Al) composite including nickel- chromium alloy and aluminum, and alloys or compounds formed by Al, Cr and Ni applied on turbine components comprises from 2 to 50 wt % chromium, from 0.1 to 6 wt % aluminum, and a remaining balance of nickel, wherein the Ni—Cr—Al composite is heat-treated to form an aluminum compound and to restore materials lost during repair processes of the turbine components.

公开(公告)号：US10743625B2

公开(公告)日：2020-08-18

申请号：US16140852

申请日：2018-09-25

申请人： The Swatch Group Research and Development Ltd

发明人： Stewes Bourban ,  Pascal Grossenbacher ,  Jean-Claude Martin ,  Vladislav Spassov ,  Cecile Barron ,  Lionel Blaser ,  Yann Caloz ,  Cyrille Gernez ,  Stephane Lauper ,  Ahmad Odeh ,  Simon Springer

IPC分类号： G04B47/04 ,  A44C17/04 ,  C25D7/00 ,  C25D1/00 ,  C25D5/02 ,  A44C27/00

摘要： A method for assembling a stone on a setting support, the stone being cut to exhibit a table, a crown, a girdle and a pavilion. A substrate with a recess for the stone, the recess forming, between the substrate and the stone, a peripheral free space in the vicinity of the girdle and of the zones of the crown and of the pavilion contiguous to the girdle, the peripheral free space including a bottom having a conductive surface. Electroplating, in the peripheral free space, a metal layer in the vicinity of the girdle and of the zones of the crown and of the pavilion contiguous to the girdle, so as to confine the girdle in the metal layer to form, around the girdle, the setting support. The stone and its setting support are released from the substrate.