公开(公告)号：US11644178B2

公开(公告)日：2023-05-09

申请号：US17082912

申请日：2020-10-28

Applicant: NICHIA CORPORATION

Inventor： Soichiro Miura

IPC: F21V13/00 ,  F21V5/04 ,  F21V7/00 ,  F21V13/04 ,  H01S5/00 ,  H01S5/40 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02255 ,  H01S5/02315 ,  F21Y115/30

CPC classification number: F21V5/04 ,  F21V5/045 ,  F21V7/0066 ,  F21V13/04 ,  H01S5/005 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02255 ,  H01S5/02315 ,  H01S5/4093 ,  F21Y2115/30

Abstract: A light emitting device includes a base, a first light emitting element and a first light reflecting member disposed on the base and a lens member. The first light reflecting member is positioned with respect to the first light emitting element so that emitted light from the first light emitting element is divided into a portion of the emitted light from the first light emitting element irradiating onto the light reflecting face and a portion of the emitted light from the first light emitting element traveling outside of the light reflecting face by having an edge of the light reflecting face serve as a boundary. The lens member includes a reflected light passing region having a first lens shape configured to control the travelling direction of reflected light, and a non-reflected light passing region having a second lens shape configured to control a travelling direction of non-reflected light.

公开(公告)号：US20230012665A1

公开(公告)日：2023-01-19

申请号：US17787199

申请日：2020-12-09

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Yoshiharu NAGAE ,  Kiyoshi ENOMOTO ,  Shota MURAKAMI

IPC: H01S5/02325 ,  H01L23/00 ,  H01S5/40 ,  H01S5/02315 ,  H01S5/02255 ,  H01S5/02208 ,  H01S5/0683

Abstract: A light detecting element is realized in which a length thereof is reduced in a direction perpendicular to a direction in which light detecting regions are disposed side by side. A light detecting element includes a light detecting surface provided with a plurality of light detecting regions disposed side by side in a first direction and a plurality of wiring regions electrically connected to the plurality of light detecting regions. Of the plurality of wiring regions, a plurality of the wiring regions connected to a plurality of the light detecting regions are provided in an end region that is a region excluding a central region at the light detecting surface.

公开(公告)号：US11545813B2

公开(公告)日：2023-01-03

申请号：US16710186

申请日：2019-12-11

Applicant: NICHIA CORPORATION

Inventor： Kazuma Kozuru ,  Takuya Hashimoto

IPC: H01S5/40 ,  G03B21/20 ,  H01S5/0237 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325

Abstract: A method of manufacturing a light emitting module comprising at least one light emitting device in which a plurality of light emitting elements are mounted, includes: providing a plurality of light emitting devices including one or more first light emitting devices and one or more second light emitting devices, wherein a number of the light emitting elements mounted in the first light emitting device is different from a number of the light emitting elements mounted in the second light emitting device; providing a first mounting substrate having a mounting surface provided with a plurality of connection patterns having the same pattern, each of the connection patterns corresponding to a respective one of the light emitting devices; and mounting at least some of the plurality of light emitting devices, selected from the one or more first light emitting devices and one or more second light emitting devices, on the connection patterns.

公开(公告)号：US11527864B2

公开(公告)日：2022-12-13

申请号：US17148843

申请日：2021-01-14

Applicant: NICHIA CORPORATION

Inventor： Tadayuki Kitajima ,  Soichiro Miura

IPC: F21V7/10 ,  H01S5/02255 ,  F21K9/64 ,  F21V13/10 ,  F21V11/16 ,  H01S5/02257 ,  H01S5/00 ,  F21Y115/30 ,  H01S5/02216 ,  H01S5/40

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base, the first light reflecting member having a first light reflecting face including a plane configured to reflect the first light; a second semiconductor laser element disposed on an upper surface of the base and configured to emit second light; a second light reflecting member disposed on the upper surface of the base, the second light reflecting member having a second light reflecting face including a plane configured to reflect the second light; and a phosphor member onto which the first light reflected from the first light reflecting member and the second light reflected from the second light reflecting member are irradiated.

公开(公告)号：US20220376469A1

公开(公告)日：2022-11-24

申请号：US17765182

申请日：2020-09-29

Applicant: KYOCERA Corporation

Inventor： Akihiko KITAGAWA ,  Takashi KIMURA

IPC: H01S5/024 ,  H01S5/02255 ,  H01S5/02208 ,  H01S5/02315

Abstract: An optical-device-mounting package includes a base member having an upper surface and a slope, the slope being continuous with the upper surface and sloping downward in a direction away from the upper surface; and an optical component having a first face and a second face, the second face being positioned opposite the first face. At least a part of the optical component is at a position higher than the upper surface, with at least a part of the second face being bonded to the slope with a bonding material. The bonding material spreads from an area between the second face and the slope up to an area between the second face and the base member and higher than the upper surface.

公开(公告)号：US20220360039A1

公开(公告)日：2022-11-10

申请号：US17764912

申请日：2020-09-30

Applicant: OSRAM Opto Semiconductors GmbH ,  Lumus Ltd.

Inventor： Ann Russell ,  Yochay Danziger ,  Jörg Erich Sorg ,  Hubert Halbritter ,  Alan Lenef

IPC: H01S5/02255 ,  H01S5/023 ,  H01S5/40 ,  H01S5/02335 ,  H01S5/0234 ,  H01S5/02257

Abstract: A laser package is described, the laser package comprising a plurality of laser diodes separately attached to at least one sub-mount having respective connecting pads, wherein, during operation, each of the laser diodes emits light having a fast axis and a slow axis defining a fast axis plane and a slow axis plane, wherein the fast axis planes of all laser diodes are parallel to each other and the distance between the fast axis planes of at least two laser diodes is smaller than the lateral distance between these laser diodes. Furthermore, a system with at least two laser packages is described.

公开(公告)号：US20220295023A1

公开(公告)日：2022-09-15

申请号：US17200068

申请日：2021-03-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jörg Erich Sorg ,  Alan Lenef

IPC: H04N9/31 ,  H01S5/02255

Abstract: Provided is an optoelectronic light source that includes a plurality of semiconductor lasers each configured to emit a laser beam and arranged on a mounting platform, and a redirecting optical element configured to redirect the laser beams. The redirecting optical element includes for each one of the plurality of semiconductor lasers a separate reflection zone, the reflection zones are shaped differently from one another, and after passing the redirecting optical element, the laser beams run in a common plane.

公开(公告)号：US20220255292A1

公开(公告)日：2022-08-11

申请号：US17616277

申请日：2020-05-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Johann Ramchen ,  Andreas Fröhlich ,  Martin Haushalter ,  Jan Marfeld ,  Massimo Cataldo Mazzillo

IPC: H01S5/02325 ,  H01S5/02255 ,  H01S5/0683

Abstract: A semiconductor laser device is specified comprising an edge emitting semiconductor laser diode, which emits laser light along a horizontal direction during operation, a reflector element, which deflects a first part of the laser light in a vertical direction, while a second part of the laser light continues to propagate in the horizontal direction, and a detector element, which is arranged at least partly in a beam path of the second part of the laser light. An optoelectronic beam deflection element for a semiconductor laser device is furthermore specified.

公开(公告)号：US20220216668A1

公开(公告)日：2022-07-07

申请号：US17701312

申请日：2022-03-22

Applicant: Nichia Corporation

Inventor： Soichiro MIURA

IPC: H01S5/00 ,  H01S5/02255 ,  H01S5/024 ,  H01S5/028 ,  H01S5/40

Abstract: A light emitting device includes: a semiconductor laser element configured to emit light in a first direction; a light-reflecting part having a light-reflecting surface; and a base member including: a recess, an upper surface surrounding the recess, and a first wiring part and a second wiring part provided on the upper surface. The semiconductor laser element and the light-reflecting part are located in the recess, the light-reflecting part positioned separated from the semiconductor laser element in the first direction in a top view. The first wiring part and the second wiring part are disposed at a position separated from the semiconductor laser element in a direction opposite to the first direction, the first wiring part and the second wiring part being arranged in a second direction perpendicular to the first direction.

公开(公告)号：US20220158416A1

公开(公告)日：2022-05-19

申请号：US17590773

申请日：2022-02-01

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Kazuma KOZURU

IPC: H01S5/40 ,  H01S5/0225 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/02257

Abstract: A light emitting device includes a base, a lid portion, a plurality of semiconductor laser elements, and a collimate lens. The lid portion is fixed to the base to define a hermetically sealed space by the lid portion and the base. The semiconductor laser elements are provided in the hermetically sealed space. The collimate lens has a non-lens portion fixed to the lid portion, and a plurality of lens portions connected and aligned along one direction and surrounded by the non-lens portion when viewed from a light extracting surface side of the collimate lens.