公开(公告)号：USD785057S1

公开(公告)日：2017-04-25

申请号：US29491482

申请日：2014-05-21

Applicant: Brewer Science Inc.

Designer： Jim Strothmann ,  Roger A. Ruesing ,  Brandon Wilson ,  Kirk Emory

公开(公告)号：US09580294B2

公开(公告)日：2017-02-28

申请号：US14559423

申请日：2014-12-03

Applicant: Brewer Science Inc.

Inventor： Adam Lewis ,  Kevin Edwards

IPC: B67D7/34 ,  B65B57/00 ,  B67D7/02 ,  B67D7/32

CPC classification number: B67D7/348 ,  B65B57/00 ,  B67D7/02 ,  B67D7/3209 ,  B67D7/344 ,  B67D7/346

Abstract: A system for verifying a container of a material before the material is transferred to a process. The system includes a conduit that extends through a mouth of the container. The conduit is supported by an arm that moves between a first position in which the conduit extends through the mouth, and a second position in which the conduit is removed and moved away from the mouth. A reading device extracts information about the container from an information storage element. A computer program receives input regarding the extracted information, receives input regarding the process, and determining whether the container is correct for the process. The program prevents the arm from moving to the first position, and only if the container is determined to be correct does the program allow the arm to move to the first position so that the material can be transferred.

Abstract translation: 一种用于在将材料转移到过程之前验证材料的容器的系统。 该系统包括延伸穿过容器口部的导管。 导管由臂支撑，臂在其中管道延伸穿过嘴的第一位置和第二位置之间移动，在第二位置，导管被移除并远离口。 读取装置从信息存储元件提取关于容器的信息。 计算机程序接收关于提取的信息的输入，接收关于处理的输入，以及确定容器是否对于处理是正确的。 该程序防止臂移动到第一位置，并且只有当容器被确定为正确时，程序允许臂移动到第一位置，使得材料可以被传送。

公开(公告)号：US20160372326A1

公开(公告)日：2016-12-22

申请号：US15188620

申请日：2016-06-21

Applicant: Brewer Science Inc.

Inventor： Xing-Fu Zhong ,  Runhui Huang ,  Boyu Zhang

IPC: H01L21/033 ,  C09D179/08 ,  C09D131/02

CPC classification number: H01L21/0337 ,  C09D125/08 ,  C09D131/02 ,  C09D179/08 ,  H01L21/02118 ,  H01L21/02282

Abstract: Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.

Abstract translation: 提供了在单个薄层涂覆工艺中平坦化表面的同时在基板上填充过孔和/或沟槽的平面化和旋涂碳（SOC）组合物。 组合物可以通过具有约20nm至约220nm宽和高达约700nm深的通孔或沟槽来平坦化宽范围的衬底。 这些非凡的性质来自材料中使用的聚合物的低分子量，聚合物上的热不稳定保护基团和延迟的交联反应。

公开(公告)号：US09496164B2

公开(公告)日：2016-11-15

申请号：US14590531

申请日：2015-01-06

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine

IPC: H01L21/00 ,  H01L21/683 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

Abstract translation: 本发明广泛地涉及单独或一起使用的环烯烃聚合物粘合组合物和释放组合物，其能够在微电子制造期间实现薄晶片处理，特别是在全晶片机械剥离过程中。 释放组合物包含由硅氧烷聚合物和共聚物在极性溶剂中共混制成的组合物，并且在室温下稳定长达一个月以上。 环状烯烃聚合物粘合组合物提供高热稳定性，可以结合到完全处理的载体晶片上，可以在高温热处理后机械或激光脱粘，并且易于用工业上可接受的溶剂除去。 根据本发明结合的晶片与其他商业粘合材料相比表现出更低的整体后研磨堆叠TTV，并且可以在200℃下进行PECVD处理。

公开(公告)号：US09472436B2

公开(公告)日：2016-10-18

申请号：US14273369

申请日：2014-05-08

Applicant: Brewer Science Inc.

Inventor： Rama Puligadda ,  Xing-Fu Zhong ,  Tony D. Flaim ,  Jeremy McCutcheon

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/20 ,  H01L23/00 ,  B32B38/00 ,  B32B38/10 ,  B32B43/00

CPC classification number: H01L21/6835 ,  B32B38/0008 ,  B32B38/10 ,  B32B43/006 ,  H01L21/2007 ,  H01L21/6836 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T156/10 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31935 ,  Y10T428/31938 ,  H01L2924/00

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

公开(公告)号：US20160177128A1

公开(公告)日：2016-06-23

申请号：US14968058

申请日：2015-12-14

Applicant: Brewer Science Inc.

Inventor： Robert Christian Cox ,  Raymond Devaughn

IPC: C09D181/02 ,  C09D5/00 ,  C08G75/04

CPC classification number: C09D181/02 ,  C08G73/0644 ,  C08G73/065 ,  C08G75/0227 ,  C08G75/0231 ,  C08G75/0236 ,  C08G75/025 ,  C09D5/004 ,  C09D179/04

Abstract: Novel hyper-branched, dense, high-refractive-index polymers, and compositions utilizing those polymers are provided, along with methods of forming high refractive index films with those compositions. The refractive index of the material is at least about 1.8 at 400 nm. Further, it can be made into optically transparent thin films of only a couple hundred angstroms thickness to thick films of several micrometers thick, as well as into “bulk” solids. The use of a thermal acid or a photo acid generator facilitates crosslinking after the coating process.

Abstract translation: 提供新的超支化，致密，高折射率聚合物和利用这些聚合物的组合物，以及用这些组合物形成高折射率膜的方法。 材料的折射率在400nm处至少约为1.8。 此外，其可以制成仅几百埃厚度的厚度为几微米的厚膜的光学透明薄膜以及“大块”固体。 使用热酸或光酸产生剂有助于在涂覆过程之后进行交联。

公开(公告)号：US20160050757A1

公开(公告)日：2016-02-18

申请号：US13865841

申请日：2013-04-18

Applicant: Brewer Science Inc.

Inventor： Liyong Diao ,  Wu-Sheng Shih ,  James E. Lamb III ,  Christopher Landorf

IPC: H05K1/16 ,  H01F27/28 ,  H05K1/03 ,  H01G4/008 ,  H01G4/14

CPC classification number: H05K1/162 ,  H01F5/003 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/14 ,  H01G4/40 ,  H05K1/0313 ,  H05K1/097 ,  H05K1/165 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: The present invention provides novel tank circuits that are totally passive, and they are made of conductive-grade carbon nanotubes (CNTs) on substrates, and preferably flexible substrates. These components and structures contain no traditional electronic materials such as silicon, metal oxides, or ceramics, and they are totally organic. They may be used in applications where the resonant frequency and amplitude of the sensor can be modulated by a thermal, mechanical, or chemical signal, such as temperature, strain, pressure, vibration, or humidity. All-organic, and consequently combustible, passive RF sensors have unique applications for defense and consumer industries.

Abstract translation: 本发明提供了完全无源的新颖的电路，它们由基片上的导电级碳纳米管（CNT）制成，最好是柔性基片。 这些组分和结构不包含传统的电子材料如硅，金属氧化物或陶瓷，它们是完全有机的。 它们可用于传感器的谐振频率和振幅可以通过热，机械或化学信号（如温度，应变，压力，振动或湿度）进行调制的应用场合。 全有机的，因此可燃的无源射频传感器具有独特的防御和消费行业应用。

公开(公告)号：US20160025517A1

公开(公告)日：2016-01-28

申请号：US14806238

申请日：2015-07-22

Applicant: Brewer Science Inc.

Inventor： Ryan E. Giedd ,  Vijaya Kayastha ,  Jonathan Fury ,  Robert Christian Cox

IPC: G01D5/16

CPC classification number: G01D5/16 ,  G01K7/16 ,  G01N27/125 ,  G01N27/127

Abstract: Printed resistive-based sensors and transducers comprising a thin, electronically “active” sensing layer within a dielectric and/or metallic layered structure are provided. The electronic resistance of the active sensing layer is measured during a change in the sensor environment. By utilizing a multi-layered architecture around the active sensing layer, the electronic signal of the sensing element can be improved. By carefully selecting the architecture and materials that surround the active sensing layer, the sensitivity, stability, and selectivity of the sensor to detect changes in the environment are improved. This design allows for a number of specific application areas for environmental sensing.

Abstract translation: 提供了在电介质和/或金属层状结构内包括薄的电子“活性”感测层的印刷电阻式传感器和换能器。 在传感器环境变化期间测量主动感测层的电子电阻。 通过利用主动感测层周围的多层结构，可以改善感测元件的电子信号。 通过仔细选择主动感测层周围的结构和材料，提高了传感器检测环境变化的灵敏度，稳定性和选择性。 该设计允许许多具体的应用领域进行环境感测。

公开(公告)号：US20150324106A1

公开(公告)日：2015-11-12

申请号：US14704153

申请日：2015-05-05

Applicant: Brewer Science Inc.

Inventor： Adam C. Lewis ,  Kevin Edwards

IPC: G06F3/0484 ,  G06Q40/00 ,  G06F3/0482

CPC classification number: G06F3/0482 ,  G06F3/04847

Abstract: A user interface for monitoring a number of parameters of a system includes an electronic display element and a display driver for controlling the electronic display element so as to display a data graph thereon. The data graph includes a bounded area divided into a plurality of segments, each segment representing one of the parameters; and a number of concentric portions formed in each segment, each concentric portion representing a state or value of the parameter represented by its corresponding segment. The display driver receives data representative of a current state or value of each of the parameters and indicates the current state or value of the parameters by marking the concentric portions that represent the current states or values.

Abstract translation: 用于监视系统的多个参数的用户界面包括电子显示元件和用于控制电子显示元件以便在其上显示数据图形的显示驱动器。 数据图形包括划分成多个段的有界区域，每个段代表参数之一; 以及形成在每个段中的多个同心部分，每个同心部分表示由其对应的段表示的参数的状态或值。 显示驱动器接收表示每个参数的当前状态或值的数据，并通过标记表示当前状态或值的同心部分来指示参数的当前状态或值。

公开(公告)号：US20150194331A1

公开(公告)日：2015-07-09

申请号：US14590531

申请日：2015-01-06

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine

IPC: H01L21/683 ,  H01L21/50

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

Abstract translation: 本发明广泛地涉及单独或一起使用的环烯烃聚合物粘合组合物和释放组合物，其能够在微电子制造期间实现薄晶片处理，特别是在全晶片机械剥离过程中。 释放组合物包含由硅氧烷聚合物和共聚物在极性溶剂中共混制成的组合物，并且在室温下稳定长达一个月以上。 环状烯烃聚合物粘合组合物提供高热稳定性，可以结合到完全处理的载体晶片上，可以在高温热处理后机械或激光脱粘，并且易于用工业上可接受的溶剂除去。 根据本发明结合的晶片与其他商业粘合材料相比表现出更低的整体后研磨堆叠TTV，并且可以在200℃下进行PECVD处理。