公开(公告)号：US08692339B2

公开(公告)日：2014-04-08

申请号：US12737521

申请日：2009-06-03

申请人： Jochen Reinmuth ,  Michael Saettler ,  Stefan Weiss ,  Arnim Hoechst

发明人： Jochen Reinmuth ,  Michael Saettler ,  Stefan Weiss ,  Arnim Hoechst

IPC分类号： H04R17/00

CPC分类号： H04R19/005 ,  B81B2201/0257 ,  B81B2203/0315 ,  B81B2203/0392 ,  B81C1/00047 ,  B81C1/00103 ,  H04R31/00

摘要： In a method for manufacturing a micromechanical component, a cavity is produced in the substrate from an opening at the rear of a monocrystalline semiconductor substrate. The etching process used for this purpose and the monocrystalline semiconductor substrate used are controlled in such a way that a largely rectangular cavity is formed.

摘要翻译： 在微机械部件的制造方法中，从单晶半导体基板的背面的开口在基板中产生空腔。 用于此目的的蚀刻工艺和所使用的单晶半导体衬底以这样的方式被控制，使得形成了大致矩形的空腔。

公开(公告)号：US08691611B2

公开(公告)日：2014-04-08

申请号：US13290905

申请日：2011-11-07

申请人： Arnim Hoechst ,  Jochen Reinmuth ,  Brett Diamond

发明人： Arnim Hoechst ,  Jochen Reinmuth ,  Brett Diamond

IPC分类号： H01L21/3065

CPC分类号： B81C1/00595 ,  B81B2201/0235 ,  B81B2203/0127 ,  B81B2203/0181 ,  B81B2203/053 ,  B81C2201/0112 ,  B81C2201/0133 ,  B81C2201/0136

摘要： In a method for manufacturing a micromechanical membrane structure, a doped area is created in the front side of a silicon substrate, the depth of which doped area corresponds to the intended membrane thickness, and the lateral extent of which doped area covers at least the intended membrane surface area. In addition, in a DRIE (deep reactive ion etching) process applied to the back side of the silicon substrate, a cavity is created beneath the doped area, which DRIE process is aborted before the cavity reaches the doped area. The cavity is then deepened in a KOH etching process in which the doped substrate area functions as an etch stop, so that the doped substrate area remains as a basic membrane over the cavity.

摘要翻译： 在制造微机械膜结构的方法中，在硅衬底的前侧产生掺杂区域，其掺杂区域的深度对应于所需的膜厚度，并且其掺杂区域的横向范围至少覆盖预期的 膜表面积。 另外，在施加到硅衬底的背侧的DRIE（深反应离子蚀刻）工艺中，在掺杂区域之下产生空腔，在空腔到达掺杂区域之前DRIE工艺被中止。 然后在KOH蚀刻工艺中加深空腔，其中掺杂衬底区域用作蚀刻停止层，使得掺杂衬底区域保持为空腔上的基本膜。

公开(公告)号：US20130341766A1

公开(公告)日：2013-12-26

申请号：US13915353

申请日：2013-06-11

申请人： Jochen REINMUTH ,  Heribert WEBER ,  Timo SCHARY ,  Yvonne BERGMANN

发明人： Jochen REINMUTH ,  Heribert WEBER ,  Timo SCHARY ,  Yvonne BERGMANN

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/7682 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for producing a component having a semiconductor substrate with through-hole plating is provided, the through-plating being surrounded by a recess, and the semiconductor substrate having a first layer on one side, which covers the recess on the first side. The semiconductor substrate has a second layer on a second side, which covers the recess on the second side, and the through-hole plating is surrounded by a ring structure which is produced from the semiconductor substrate. The recess surrounding the ring structure is produced in the same process step or at the same time as the recess for the through-hole plating.

摘要翻译： 提供了具有带通孔电镀的半导体基板的部件的制造方法，所述贯通电镀被凹部包围，所述半导体基板在一侧具有覆盖所述第一侧的所述凹部的第一层。 半导体衬底在第二侧上具有覆盖第二侧的凹部的第二层，并且通孔电镀被由半导体衬底产生的环形结构包围。 围绕环结构的凹部在相同的工艺步骤中或与用于通孔电镀的凹槽同时产生。

公开(公告)号：US08481401B2

公开(公告)日：2013-07-09

申请号：US13134075

申请日：2011-05-26

申请人： Jochen Reinmuth

发明人： Jochen Reinmuth

IPC分类号： H01L21/311 ,  H01L21/44 ,  H01L21/461 ,  H01L21/4763

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/0345 ,  H01L2224/04042 ,  H01L2224/0508 ,  H01L2224/05624 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a component having a through-contact includes: providing a substrate; forming an insulating layer on the substrate; structuring the insulating layer, the insulating layer being removed at least in a predetermined trenching area surrounding a selected substrate area; performing an etching process in which the structured insulating layer functions as a mask to remove substrate material in the trenching area and to create a trench structure surrounding the selected substrate area; and forming a metallic layer on the insulating layer, the metallic layer sealing the trench structure.

摘要翻译： 一种具有贯通接触部件的制造方法包括：提供基板; 在所述基板上形成绝缘层; 构造绝缘层，绝缘层至少在围绕所选择的衬底区域的预定的沟槽区域中被去除; 执行蚀刻工艺，其中结构化绝缘层用作掩模以去除在沟槽区域中的衬底材料并且产生围绕所选择的衬底区域的沟槽结构; 以及在所述绝缘层上形成金属层，所述金属层密封所述沟槽结构。

公开(公告)号：US08436434B2

公开(公告)日：2013-05-07

申请号：US13298753

申请日：2011-11-17

申请人： Jochen Reinmuth

发明人： Jochen Reinmuth

IPC分类号： H01L29/84 ,  G01P15/125

CPC分类号： B81C1/00246 ,  B81B2201/0235 ,  B81B2203/053 ,  B81C2203/0735 ,  B81C2203/0742 ,  G01P15/0802 ,  G01P15/125

摘要： A micromechanical component includes: a substrate having a multitude of trench structures which separate a first and a second mass element of the substrate from a web element of the substrate, in such a way that the first and second mass elements enclose the web element along an extension direction of the main surface of the substrate and are disposed to allow movement relative to the substrate in the direction of a surface normal of the main surface; a first electrode layer applied on the main surface of the substrate and forms a first electrode on the web element between the first and second mass elements; and a second electrode layer applied on the first and second mass elements and forming a self-supporting second electrode above the first electrode in the area of the web element, the first and second electrode forming a capacitance.

摘要翻译： 微机械部件包括：具有多个沟槽结构的衬底，其将衬底的第一和第二质量元件与衬底的腹板元件分开，使得第一和第二质量元件沿着 并且被设置为允许在主表面的法线方向上相对于基板的移动; 施加在所述基板的主表面上的第一电极层，并且在所述网状元件上在所述第一和第二质量元件之间形成第一电极; 以及施加在所述第一和第二质量元件上的第二电极层，并且在所述网状元件的区域中在所述第一电极的上方形成自支撑的第二电极，所述第一和第二电极形成电容。

公开(公告)号：US20130043548A1

公开(公告)日：2013-02-21

申请号：US13586576

申请日：2012-08-15

申请人： Jochen Reinmuth ,  Heribert Weber

发明人： Jochen Reinmuth ,  Heribert Weber

IPC分类号： H01L29/84 ,  H01L21/02

CPC分类号： G01P15/0802 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00626 ,  B81C2201/0132 ,  B81C2203/0136 ,  G01C19/5783

摘要： A method for manufacturing a micromechanical structure includes: forming a first insulation layer above a substrate; forming a first micromechanical functional layer on the first insulation layer; forming multiple first trenches in the first micromechanical functional layer, which trenches extend as far as the first insulation layer; forming a second insulation layer on the first micromechanical functional layer, which second insulation layer fills up the first trenches; forming etch accesses in the second insulation layer, which etch accesses locally expose the first micromechanical functional layer; and etching the first micromechanical functional layer through the etch accesses, the filled first trenches and the first insulation layer acting as an etch stop.

摘要翻译： 一种制造微机械结构的方法包括：在基板上形成第一绝缘层; 在所述第一绝缘层上形成第一微机械功能层; 在所述第一微机械功能层中形成多个第一沟槽，所述沟槽延伸到所述第一绝缘层; 在所述第一微机械功能层上形成第二绝缘层，所述第二绝缘层填充所述第一沟槽; 在所述第二绝缘层中形成蚀刻访问，所述蚀刻访问局部暴露所述第一微机械功能层; 并且通过蚀刻访问蚀刻第一微机械功能层，填充的第一沟槽和用作蚀刻停止层的第一绝缘层。

公开(公告)号：US20120189152A1

公开(公告)日：2012-07-26

申请号：US13388014

申请日：2010-06-02

申请人： Jochen Reinmuth

发明人： Jochen Reinmuth

IPC分类号： H04R19/04 ,  H04R31/00

CPC分类号： H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005

摘要： Measures are provided for improving the acoustic properties of a component (10) having a micromechanical microphone structure realized in a layer construction (20) over a substrate (1), and for simplifying the production method. The microphone structure of such a component (10) includes a diaphragm (11) deflectable by acoustic pressure, spanning a cavity (13) that acts as a rear-side volume in the rear side of the component, and includes a stationary, acoustically permeable counter-element (12) situated over the diaphragm (11). According to the invention, the layer construction (20) has, between the diaphragm (11) and the substrate (1), an enclosing layer (3) in which there is fashioned an acoustically transparent aperture (4). The diaphragm (11) is connected to the rear-side volume (13) via this aperture in the enclosing layer (3). Under the enclosing layer (3), the rear-side volume (13) extends laterally beyond this aperture (4).

摘要翻译： 提供了用于改善在衬底（1）上的层结构（20）中实现的具有微机械麦克风结构的部件（10）的声学特性的措施，并且用于简化生产方法。 这种部件（10）的麦克风结构包括通过声压可偏转的隔膜（11），跨过构件后侧的作为后侧容积的空腔（13），并且包括静止的，声透过的 位于隔膜（11）上方的相对元件（12）。 根据本发明，层结构（20）在隔膜（11）和基板（1）之间具有封闭层（3），其中形成有声透明的孔（4）。 隔膜（11）通过封闭层（3）中的该孔连接到后侧容积（13）。 在封闭层（3）下方，后侧容积（13）横向延伸越过该孔（4）。

公开(公告)号：US20120038372A1

公开(公告)日：2012-02-16

申请号：US13207822

申请日：2011-08-11

申请人： Jochen Reinmuth ,  Gary O'Brien

发明人： Jochen Reinmuth ,  Gary O'Brien

IPC分类号： G01R27/26 ,  H02K15/00 ,  H02N1/00

CPC分类号： G01L9/0042 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2203/053 ,  B81C1/00142 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0831

摘要： A micromechanical component is described having a substrate which has a movable mass which is connected via at least one spring to the substrate so that the movable mass is displaceable with respect to the substrate, and at least one fixedly mounted stator electrode. The movable mass and the at least one spring are structured from the substrate. At least one separating trench which at least partially surrounds the movable mass is formed in the substrate. The at least one stator electrode is situated adjacent to an outer surface of the movable mass which is at least partially surrounded by the separating trench, with the aid of at least one supporting connection which connects the at least one stator electrode to an anchor situated on the substrate and spans a section of the separating trench. Also described is a manufacturing method for a micromechanical component.

摘要翻译： 描述了一种微机械部件，其具有基板，该基板具有通过至少一个弹簧连接到基板的可移动质量块，使得可移动质量块可相对于基板移动，以及至少一个固定安装的定子电极。 可移动块体和至少一个弹簧由衬底构成。 在衬底中形成至少部分地围绕可移动块的至少一个分离沟槽。 所述至少一个定子电极位于所述可移动块的外表面附近，所述外表面至少部分地被所述分离沟槽包围，借助于至少一个支撑连接，所述至少一个支撑连接将所述至少一个定子电极连接到位于 衬底并且跨越分离沟槽的一部分。 还描述了一种用于微机械部件的制造方法。

公开(公告)号：US20110296919A1

公开(公告)日：2011-12-08

申请号：US13134020

申请日：2011-05-25

申请人： Jochen Reinmuth

发明人： Jochen Reinmuth

IPC分类号： G01P15/00 ,  H01S4/00

CPC分类号： G01P15/125 ,  B81B3/007 ,  B81B2201/0235 ,  B81B2203/0118 ,  B81B2203/0307 ,  G01P15/0802 ,  G01P2015/0811 ,  G01P2015/0871

摘要： In a micromechanical system having a substrate and an electrode situated over the substrate, the electrode is connected to the substrate via a vertical spring. The vertical spring is sectionally provided in a first conductive layer and sectionally provided in a second conductive layer, the second conductive layer being situated over the first conductive layer and the first conductive layer being situated over the substrate. The electrode is provided in a third conductive layer, which is situated over the second conductive layer.

摘要翻译： 在具有衬底和位于衬底上方的电极的微机械系统中，电极通过垂直弹簧连接到衬底。 垂直弹簧被剖面地设置在第一导电层中并且分段地设置在第二导电层中，第二导电层位于第一导电层之上，第一导电层位于衬底之上。 电极设置在位于第二导电层之上的第三导电层中。

公开(公告)号：US20060085011A1

公开(公告)日：2006-04-20

申请号：US11250317

申请日：2005-10-13

申请人： Michael Filippi ,  Guido Casutt ,  Jochen Reinmuth ,  Mathias Heller

发明人： Michael Filippi ,  Guido Casutt ,  Jochen Reinmuth ,  Mathias Heller

IPC分类号： A61F2/34

CPC分类号： A61F2/4684 ,  A61B17/1757 ,  A61B17/8875 ,  A61B2017/0256 ,  A61B2090/034 ,  A61F2/4611 ,  A61F2002/30112 ,  A61F2002/443 ,  A61F2002/4622 ,  A61F2002/4628 ,  A61F2002/4629 ,  A61F2002/4662 ,  A61F2230/0004

摘要： The invention relates to an instrument system for the insertion of intervertebral disk implants including two implant plates and one implant core comprising at least one trial unit including two trial elements of preferably plate shape for the determination of an implant suitable for the respective patient, at least one machining unit for the preparation of the surfaces of the bodies of the vertebra of the patient which includes operating elements having two sections of preferably forked shape and at least one holding unit which can be coupled to the implant plates for the insertion of the implant, with the trial unit, the machining unit and the holding unit each being able to be coupled to a traction instrument in particular in the manner of forceps for the pressing apart of the trial elements, the operating elements or the implant elements.

摘要翻译： 本发明涉及一种用于插入椎间盘植入物的器械系统，包括两个植入物板和一个植入物芯，其包括至少一个试验单元，其包括优选板形的两个试验元件，用于确定适合于相应患者的植入物，至少 一个加工单元，用于制备患者的椎体的表面的表面，其包括具有优选分叉形状的两个部分的操作元件和至少一个可连接到植入物板以用于插入植入物的保持单元， 与试验单元一起，加工单元和保持单元各自能够特别地以用于分开试验元件，操作元件或植入元件的镊子的方式联接到牵引仪器。