公开(公告)号：US20100134707A1

公开(公告)日：2010-06-03

申请号：US12508031

申请日：2009-07-23

Applicant: Sung-Woon KIM ,  Hwa-Sung WOO ,  Joo-Nyung JANG ,  Mi-Jeong SONG ,  Hyang-Yul KIM ,  Cheol SHIN ,  Dong-Chul SHIN ,  Hee-Seop KIM ,  Jung-Hyeon KIM

Inventor： Sung-Woon KIM ,  Hwa-Sung WOO ,  Joo-Nyung JANG ,  Mi-Jeong SONG ,  Hyang-Yul KIM ,  Cheol SHIN ,  Dong-Chul SHIN ,  Hee-Seop KIM ,  Jung-Hyeon KIM

IPC: G02F1/1343 ,  G09G3/36

CPC classification number: G02F1/133707 ,  G02F2001/133397 ,  G02F2001/134345 ,  G02F2001/13706 ,  G09G3/3614 ,  G09G3/3659 ,  G09G2300/0434 ,  G09G2300/0823 ,  G09G2320/0247 ,  G09G2320/0252 ,  G09G2320/028

Abstract: A liquid crystal display includes; first and second substrates facing each other, a liquid crystal layer interposed between the first and second substrates and including liquid crystal molecules, a first subpixel electrode disposed on the first substrate, the first subpixel electrode receiving a first data voltage, a second subpixel electrode disposed on the first substrate, the second subpixel electrode receiving a second data voltage; and a short protrusion disposed on the second substrate and simultaneously facing the first and second subpixel electrodes, wherein the liquid crystal layer is vertically aligned and has positive dielectric anisotropy.

Abstract translation: 液晶显示器包括： 第一和第二基板彼此面对，夹在第一和第二基板之间并包括液晶分子的液晶层，设置在第一基板上的第一子像素电极，第一子像素电极接收第一数据电压，第二子像素电极设置 在所述第一基板上，所述第二子像素电极接收第二数据电压; 以及设置在所述第二基板上并同时面对所述第一和第二子像素电极的短突起，其中所述液晶层垂直取向并具有正的介电各向异性。

公开(公告)号：US20100126191A1

公开(公告)日：2010-05-27

申请号：US12457807

申请日：2009-06-22

Applicant: Jeong Su Han ,  Sang Jun Lee ,  Kook Jeong Seo ,  Ho Yoon ,  Jung Hyeon Kim ,  Hyen Young Choi ,  O Do Ryu

Inventor： Jeong Su Han ,  Sang Jun Lee ,  Kook Jeong Seo ,  Ho Yoon ,  Jung Hyeon Kim ,  Hyen Young Choi ,  O Do Ryu

IPC: F25D21/02 ,  F25D21/06

CPC classification number: F25D21/02 ,  F25B2700/111

Abstract: An oscillatory wave generating unit and an oscillatory wave sensing unit are installed at both ends of a refrigerant pipe of an evaporator of the cooling system, an amount of frost formed on the refrigerant pipe is determined by comparing a wave form of an oscillatory wave generated from one end of the refrigerant through the oscillatory wave generating unit and a wave form of the oscillatory wave sensed by the other one end of the refrigerant through the oscillatory wave sensing unit, and whether or not a defrosting operation is performed is determined by a result of the determination. The cooling system increases the accuracy in sensing the amount of the frost formed on the evaporator of a refrigerator, a Kimchi refrigerator, or an air conditioner, and respectively starts and ends the defrosting operation at proper points of time, thus enhancing a heat-exchanging performance and increasing energy efficiency.

Abstract translation: 在冷却系统的蒸发器的制冷剂管的两端安装振荡波产生单元和振荡波感测单元，通过比较从制冷剂管道的蒸发器产生的振荡波的波形， 通过振荡波产生单元的制冷剂的一端和通过振荡波感测单元由制冷剂的另一端感测的振荡波的波形，以及是否执行除霜操作由以下结果确定： 决心。 冷却系统提高了感测冰箱，泡菜冰箱或空调器的蒸发器上形成的霜的量的精度，并分别在合适的时间点开始和结束除霜操作，从而增强了热交换 性能和提高能源效率。

公开(公告)号：US20100122984A1

公开(公告)日：2010-05-20

申请号：US12458160

申请日：2009-07-01

Applicant: Dong Jun Kim ,  Young Chal Heo ,  Yun Taeg Gong ,  Jung Hyeon Kim

Inventor： Dong Jun Kim ,  Young Chal Heo ,  Yun Taeg Gong ,  Jung Hyeon Kim

IPC: B65D21/02 ,  B65D81/02

CPC classification number: B65D5/0005 ,  B65D5/328

Abstract: A packing box for an electronic product to protect an electronic product from external impact. The packing box includes a first packing unit to pack an upper part of the product, a second packing unit passing through the first packing unit and joined to a lower part of the first packing unit, to pack a middle part of the product, and a third packing unit passing through the first and second packing units and joined to a lower part of the second packing unit, to pack a lower part of the product. The packing box is readily disassembled and allows the product to be easily repacked.

Abstract translation: 用于电子产品的包装盒，用于保护电子产品免受外部影响。 包装箱包括：第一包装单元，用于包装产品的上部;通过第一包装单元并连接到第一包装单元的下部的第二包装单元，用于包装产品的中间部分;以及 第三包装单元穿过第一和第二包装单元并连接到第二包装单元的下部，以包装产品的下部。 包装盒易于拆卸，使产品容易重新包装。

公开(公告)号：US20100105201A1

公开(公告)日：2010-04-29

申请号：US12650093

申请日：2009-12-30

Applicant: Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

Inventor： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

IPC: H01L21/60

CPC classification number: H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract translation: 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

公开(公告)号：US20100091731A1

公开(公告)日：2010-04-15

申请号：US12578234

申请日：2009-10-13

Applicant: Sung Min KIM ,  Chul Jin Kim ,  Eun Hwa Lee ,  Jung Hyeon Kim ,  Ji Hye Hur

Inventor： Sung Min KIM ,  Chul Jin Kim ,  Eun Hwa Lee ,  Jung Hyeon Kim ,  Ji Hye Hur

IPC: H04W72/04

CPC classification number: H04W16/14 ,  H04W24/00 ,  H04W84/12 ,  H04W88/10

Abstract: A channel allocation method for use in a wireless communication environment, where Wireless Local Area Networks (WLANs) and Wireless Personal Area Networks (WPANs) coexist, includes collecting, at an access point, information on channels used by the WLANs and WPANs, determining available WLAN channels and available WPAN channels based on the channel information, allocating one of the available WLAN channels and one of the available WPAN channels to the access point, and informing the WLANs and WPANs of the allocated WLAN and WPAN channels.

Abstract translation: 一种在无线局域网（WLAN）和无线个人区域网络（WPAN）共存的无线通信环境中使用的信道分配方法包括在接入点收集关于WLAN和WPAN使用的信道的信息，确定可用 WLAN信道和可用的WPAN信道，将可用WLAN信道之一和可用WPAN信道中的一个分配给接入点，并向WLAN和WPAN通知所分配的WLAN和WPAN信道。

公开(公告)号：US20100071847A1

公开(公告)日：2010-03-25

申请号：US12461933

申请日：2009-08-28

Applicant: Jae Bong Shin ,  Byung Joon Lee ,  Seung Dae Seok ,  Seung Woo Choi ,  Jung Hyeon Kim ,  Sang il Hong

Inventor： Jae Bong Shin ,  Byung Joon Lee ,  Seung Dae Seok ,  Seung Woo Choi ,  Jung Hyeon Kim ,  Sang il Hong

IPC: B29C65/00

CPC classification number: H01L21/67092 ,  H01L21/2007

Abstract: It is an aspect of the present invention to provide a wafer bonding apparatus having a pressing apparatus configured to press wafers fixed in a fixing apparatus, wherein the fixing apparatus is configured to allow the pressing apparatus to press the wafers without interference. The wafer bonding apparatus may include an upper wafer and a lower wafer, a support member configured to support the upper wafer and the lower wafer, a push member on the upper wafer, and a fixing apparatus configured to fix the push member to the support member, wherein the push member includes a fixing part extending outward from a periphery of the upper wafer, and the fixing apparatus is coupled to the fixing part. It is also an aspect of the present invention to provide a method for bonding wafers.

Abstract translation: 本发明的一个方面是提供一种具有按压装置的晶片接合装置，所述加压装置构造成将固定在定影装置中的晶片按压，其中所述定影装置构造成允许所述按压装置不干扰地挤压所述晶片。 晶片接合装置可以包括上晶片和下晶片，构造成支撑上晶片和下晶片的支撑构件，在上晶片上的推动构件，以及定影装置，其构造成将推动构件固定到支撑构件 ，其中所述推动构件包括从所述上晶片的周边向外延伸的固定部，并且所述定影装置联接到所述固定部。 本发明的另一方面是提供一种接合晶片的方法。

公开(公告)号：US20100020094A1

公开(公告)日：2010-01-28

申请号：US12410904

申请日：2009-03-25

Applicant: Se-Ki PARK ,  Dong-Min Yeo ,  Gi-Cherl Kim ,  Si-Joon Song ,  Jung-Hyeon Kim

Inventor： Se-Ki PARK ,  Dong-Min Yeo ,  Gi-Cherl Kim ,  Si-Joon Song ,  Jung-Hyeon Kim

IPC: G09G5/02

CPC classification number: G09G3/3426 ,  G09G3/2055 ,  G09G3/3648 ,  G09G2320/0233 ,  G09G2320/0238 ,  G09G2320/0276 ,  G09G2320/0646 ,  G09G2320/0673

Abstract: Controller unit includes local dimming logic board and controller board. Local dimming logic board generates local dimming signals in response to image data received from external device. When boost-worthy portion of image data is found to satisfy predefined boosting conditions, local dimming logic board increases luminance value of backlight dimming signal supplied for corresponding boost-worthy area portion of image data. Controller board receives image data from local dimming logic board, and gamma converts peripheral area data corresponding to peripheral area of image data into converted image data using compensating gamma conversion different than that used for image data of backlight boosted area so that luminance of peripheral area adjacent to boosting area is decreased by use of compensating gamma conversion in place of normal or reference gamma conversion. Decreased luminance substantially counter compensates for increased luminance due to light from spreading into peripheral area from adjacent boosted area.

Abstract translation: 控制器单元包括局部调光逻辑板和控制板。 本地调光逻辑板响应于从外部设备接收到的图像数据产生局部调光信号。 当发现图像数据的升压部分满足预定的升压条件时，局部调光逻辑板增加为图像数据的相应升压区域部分提供的背光调光信号的亮度值。 控制器板从局部调光逻辑板接收图像数据，并且使用与用于背光升压区域的图像数据的补偿伽马转换不同的方式将对应于图像数据的外围区域的外围区域数据转换为转换的图像数据，使得相邻的外围区域的亮度 通过使用补偿γ转换来代替正常或参考γ转换来降低增压面积。 降低的亮度基本上计数器补偿由于从相邻增强区域扩展到周边区域的光而增加的亮度。

公开(公告)号：US20090129041A1

公开(公告)日：2009-05-21

申请号：US12232990

申请日：2008-09-26

Applicant: Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

Inventor： Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

IPC: H05K1/14 ,  H05K1/00 ,  H05K7/10

CPC classification number: H05K1/147 ,  H05K1/117 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/10159 ,  H05K2203/1572

Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

Abstract translation: 提供堆叠半导体模块，其制造方法和使用该模块的电子系统。 提供了具有安装在刚性印刷电路板（PCB）上的多个半导体器件和具有安装在柔性PCB上的多个其它半导体器件的第二半导体模块的第一半导体模块。 在刚性PCB上，可以在第一表面上设置数L个第一突出部，并且可以在刚性PCB的第二表面上设置数个K个第二突片。 柔性PCB可以在第三表面上具有数量M的第三突出部，并且在柔性PCB的第四表面上可以具有数目N的第四突出部。 第二突片可以使用导电粘合剂与第三突片组合。 第三突片可以电连接到相应的第二突片。

公开(公告)号：US20080157326A1

公开(公告)日：2008-07-03

申请号：US11872810

申请日：2007-10-16

Applicant: Hyun Joo HAN ,  Tao Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

Inventor： Hyun Joo HAN ,  Tao Sang Park ,  Se Yeong Jang ,  Young Jun Moon ,  Jung Hyeon Kim ,  Sung Wook Kang

IPC: H01L23/538 ,  H01L21/60

CPC classification number: H05K3/3436 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.

Abstract translation: 一种包括堆叠在印刷电路板上的多个BGA IC封装的IC封装及其制造方法。 IC封装包括印刷电路板，第一BGA IC封装，具有堆叠在印刷电路板上的多个第一焊球，第二BGA IC封装，具有堆叠在第一BGA IC上的多个第二焊球 封装件和具有多个通孔的插入件，其以熔融状态被第二焊球填充，使得第二焊球的长度增加，而第二焊球硬化，插入件接合到 第一个BGA IC封装。

公开(公告)号：US20080139024A1

公开(公告)日：2008-06-12

申请号：US11937342

申请日：2007-11-08

Applicant: Jae-Nam LEE ,  Jung-Hyeon KIM ,  Ju-Il KANG ,  Jin-Woo YANG

Inventor： Jae-Nam LEE ,  Jung-Hyeon KIM ,  Ju-Il KANG ,  Jin-Woo YANG

IPC: H01R13/62 ,  G01R31/26

CPC classification number: G01R31/2817 ,  G01R31/2863

Abstract: A burn-in board connection device includes a first connection unit to hold a burn-in board and move in a first direction perpendicular to the burn-in board that is inserted in a chamber of a burn-in test device, a second connection unit to move in a second direction parallel to the burn-in board to attach/detach the burn-in board that is held by the first connection unit to/from a connector disposed in the chamber. A burn-in board connection method includes coupling a finger to the burn-in board by moving the finger in a first direction, attaching the burn-in board to a connector by moving the finger in a second direction, and driving the finger by converting a rotation of a servo motor into a linear movement of the finger.

Abstract translation: 老化板连接装置包括：第一连接单元，用于保持老化板并且沿垂直于插入老化测试装置的室中的老化板的第一方向移动;第二连接单元 沿平行于老化板的第二方向移动以将由第一连接单元保持的老化板与设置在腔室中的连接器相连接/分离。 老化板连接方法包括通过沿第一方向移动手指将手指连接到老化板，通过沿第二方向移动手指将老化板附接到连接器，并且通过转换来驱动手指 伺服电动机旋转到手指的线性运动。