Low resistance fill for deep trench capacitor
    86.
    发明授权
    Low resistance fill for deep trench capacitor 失效
    深沟槽电容器的低电阻填充

    公开(公告)号:US06258689B1

    公开(公告)日:2001-07-10

    申请号:US09626328

    申请日:2000-07-26

    IPC分类号: H01L2120

    CPC分类号: H01L27/10861 H01L29/66181

    摘要: Trench capacitors are fabricated utilizing a method which results in a metallic nitride as a portion of a node electrode in a lower region of the trench. The metallic nitride-containing trench electrode exhibits reduced series resistance compared to conventional trench electrodes of similar dimensions, thereby enabling reduced ground rule memory cell layouts and/or reduced cell access time. The trench capacitors of the invention are especially useful as components of DRAM memory cells having various trench configuration and design.

    摘要翻译: 使用导致在沟槽的下部区域中作为节点电极的一部分的金属氮化物的方法来制造沟槽电容器。 与具有类似尺寸的常规沟槽电极相比,含金属氮化物的沟槽电极显示出降低的串联电阻,从而能够减少接地规则存储器单元布局和/或降低的单元访问时间。 本发明的沟槽电容器特别可用作具有各种沟槽结构和设计的DRAM存储单元的组件。

    Buffer layer for improving control of layer thickness
    87.
    发明授权
    Buffer layer for improving control of layer thickness 失效
    缓冲层,用于改善层厚度的控制

    公开(公告)号:US6013937A

    公开(公告)日:2000-01-11

    申请号:US938196

    申请日:1997-09-26

    摘要: A pad layer disposed on a semiconductor substrate 102 and a buffer layer 108 disposed within the pad layer such that the pad layer is divided into a dielectric layer 106 below the buffer layer and a mask layer 110 above the buffer layer. A method of forming layers with uniform planarity and thickness on a semiconductor chip includes the steps of providing a substrate having a thermal pad 106 formed thereon, forming a dielectric layer 106 on the thermal pad, forming a buffer layer 108 on the dielectric layer wherein the buffer layer is made from a different material than the dielectric layer and forming a mask layer 110 on the buffer layer wherein the buffer layer is made from a different material than the mask layer.

    摘要翻译: 设置在半导体衬底102上的衬垫层和布置在焊盘层内的缓冲层108,使得衬垫层被分为缓冲层下面的介电层106和缓冲层上方的掩模层110。 在半导体芯片上形成具有均匀平坦度和厚度的层的方法包括以下步骤:提供具有形成在其上的热垫106的衬底,在热衬垫上形成电介质层106,在电介质层上形成缓冲层108,其中, 缓冲层由与电介质层不同的材料制成,并在缓冲层上形成掩模层110,其中缓冲层由与掩模层不同的材料制成。