公开(公告)号：US20120069549A1

公开(公告)日：2012-03-22

申请号：US12972552

申请日：2010-12-20

申请人： Po-Chun Hsu ,  Hung-Ling Yang ,  Chih-Wei Chang

发明人： Po-Chun Hsu ,  Hung-Ling Yang ,  Chih-Wei Chang

IPC分类号： F21V29/00

CPC分类号： G02F1/13471 ,  G02F2001/133628

摘要： A heat-dissipating structure, a backlight module, and a display apparatus for standing use are disclosed. The heat-dissipating structure includes a back plate and a heat pipe which is coupled to the back plate and includes a heat-absorbing portion at a side portion of the back plate and a heat-dissipating portion bent upward from the heat-absorbing portion to extend toward a center portion of the back plate. The backlight module includes the heat-dissipating structure, a light-guiding plate disposed above the back plate and the heat pipe, and a light source module disposed on the heat-absorbing portion at a side of the light-guiding plate. The display apparatus includes the backlight module and a panel above the light-guiding plate. Thereby, working fluid in the heat pipe can flow back to the heat-absorbing portion by use of gravity after dissipating heat at the heat-dissipating portion, which improves the whole efficiency of heat dissipation.

摘要翻译： 公开了一种散热结构，背光模块和用于站立的显示装置。 散热结构包括背板和热管，该热管与背板联接，并且在背板的侧部包括吸热部分和从吸热部分向上弯曲的散热部分 延伸到背板的中心部分。 背光模块包括散热结构，设置在背板和热管上方的导光板，以及设置在导光板一侧的吸热部上的光源模块。 显示装置包括背光模块和导光板上方的面板。 由此，散热部分后的热管中的工作流体可以利用重力流向吸热部，从而提高散热效率。

公开(公告)号：US08002454B2

公开(公告)日：2011-08-23

申请号：US12390510

申请日：2009-02-23

申请人： Ming-Lung Chen ,  Chih-Kang Tung ,  Chih-Wei Chang

发明人： Ming-Lung Chen ,  Chih-Kang Tung ,  Chih-Wei Chang

IPC分类号： F21V7/04

CPC分类号： G02B6/0055 ,  G02B6/0016 ,  G02B6/0045 ,  G02B6/008 ,  G02B6/0091

摘要： Backlight assembly includes a plurality of light guide plates, a plurality of light modules, and a plurality of driving units separately in control of corresponding light modules which are configured at the incident sides of the LGPs. Each light module faces two adjacent LGPs such that the driving unit drives the light module to provide light for two adjacent LGPs at the same time. As local dimming function is switched, besides the power-saving and the high contrast, the local edge effect due to the joint of the LGPs can be reduced.

摘要翻译： 背光组件包括多个导光板，多个光模块和多个驱动单元，分别控制配置在LGP的入射侧的对应的光模块。 每个灯模块面向两个相邻的LGP，使得驱动单元驱动灯模块同时为两个相邻的LGP提供光。 随着局部调光功能的切换，除了省电和高对比度之外，还可以减少由于LGP接头造成的局部边缘效应。

公开(公告)号：US20110149460A1

公开(公告)日：2011-06-23

申请号：US12768704

申请日：2010-04-27

申请人： Ming-Hsiang Weng ,  Chih-Wei Chang ,  Bhoopal Ponnuvelu

发明人： Ming-Hsiang Weng ,  Chih-Wei Chang ,  Bhoopal Ponnuvelu

IPC分类号： H05F3/00

CPC分类号： H05K9/0067 ,  H04M1/0249 ,  H04M1/0277 ,  H04M1/18

摘要： An elastic sheet structure includes an elastic body and a conductive body. The elastic body is capable of elastic deformation, and the conductive body includes a main body, a first elastic arm, and a second elastic arm. The main body is installed into the elastic body; the first elastic arm and the second elastic arm are connected at opposite sides of the main body and extend out from two opposite ends of the elastic body. The first elastic arm is capable of electrically connecting to ground to conduct away static electricity through the second elastic arm, the main body, and the first elastic arm. An electronic device employing the elastic sheet structure is also described.

摘要翻译： 弹性片结构包括弹性体和导电体。 弹性体能够弹性变形，导电体包括主体，第一弹性臂和第二弹性臂。 主体安装在弹性体内; 第一弹性臂和第二弹性臂在主体的相对侧连接并从弹性体的两个相对端延伸出来。 第一弹性臂能够电连接到地面以通过第二弹性臂，主体和第一弹性臂导致静电。 还描述了采用弹性片结构的电子装置。

公开(公告)号：US20110128899A1

公开(公告)日：2011-06-02

申请号：US12915041

申请日：2010-10-29

申请人： Wei-Ta Su ,  Hsin-Hung Lin ,  Der-Chung Hwang ,  Anhua Tsui ,  Chieh-Tsao Hwang ,  Chih-Wei Chang ,  Jenq-Haur Pan ,  Shao-Hsien Wang ,  Chien-Ming Lee

发明人： Wei-Ta Su ,  Hsin-Hung Lin ,  Der-Chung Hwang ,  Anhua Tsui ,  Chieh-Tsao Hwang ,  Chih-Wei Chang ,  Jenq-Haur Pan ,  Shao-Hsien Wang ,  Chien-Ming Lee

IPC分类号： H04W52/02

CPC分类号： H04W52/0245 ,  Y02D70/00 ,  Y02D70/142

摘要： An electronic device and a power saving method thereof are provided. The electronic device includes a network module and a power saving module, wherein the network module connects to an access point (AP). The method includes executing an AP search operation at a predetermined time interval by the network module, and determining whether the electronic device is in a specific state by the power saving module. The method also includes disabling the network module from executing the AP search operation as long as the electronic device is still in the specific state. As a result, the unnecessary AP search operations can be avoided, and the purpose of saving power can be achieved.

摘要翻译： 提供一种电子设备及其省电方法。 电子设备包括网络模块和省电模块，其中网络模块连接到接入点（AP）。 该方法包括由网络模块以预定的时间间隔执行AP搜索操作，并且通过省电模块确定电子设备是否处于特定状态。 该方法还包括禁止网络模块执行AP搜索操作，只要电子设备仍处于特定状态即可。 结果，可以避免不必要的AP搜索操作，并且可以实现节电的目的。

公开(公告)号：US20100182767A1

公开(公告)日：2010-07-22

申请号：US12390510

申请日：2009-02-23

申请人： Ming-Lung Chen ,  Chih-Kang Tung ,  Chih-Wei Chang

发明人： Ming-Lung Chen ,  Chih-Kang Tung ,  Chih-Wei Chang

IPC分类号： F21V8/00

CPC分类号： G02B6/0055 ,  G02B6/0016 ,  G02B6/0045 ,  G02B6/008 ,  G02B6/0091

摘要： Backlight assembly includes a plurality of light guide plates, a plurality of light modules, and a plurality of driving units separately in control of corresponding light modules which are configured at the incident sides of the LGPs. Each light module faces two adjacent LGPs such that the driving unit drives the light module to provide light for two adjacent LGPs at the same time. As local dimming function is switched, besides the power-saving and the high contrast, the local edge effect due to the joint of the LGPs can be reduced.

摘要翻译： 背光组件包括多个导光板，多个光模块和多个驱动单元，分别控制配置在LGP的入射侧的对应的光模块。 每个灯模块面向两个相邻的LGP，使得驱动单元驱动灯模块同时为两个相邻的LGP提供光。 随着局部调光功能的切换，除了省电和高对比度之外，还可以减少由于LGP接头造成的局部边缘效应。

公开(公告)号：US07687861B2

公开(公告)日：2010-03-30

申请号：US11248555

申请日：2005-10-12

申请人： Chii-Ming Wu ,  Chiang-Ming Chuang ,  Chih-Wei Chang

发明人： Chii-Ming Wu ,  Chiang-Ming Chuang ,  Chih-Wei Chang

IPC分类号： H01L27/092

CPC分类号： H01L29/7843 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/7833

摘要： A semiconductor device having an NMOS and a PMOS device formed thereon is provided. The NMOS device has additional spacers formed alongside the gate electrode to allow the silicide region to be formed farther away from the gate electrode. By placing the silicide region farther away from the gate electrode, the effects of the lateral encroachment of the silicide region under the spacers is reduced, particularly the leakage. A method of forming the semiconductor device may include forming a plurality of spacers alongside the gate electrodes of a PMOS and an NMOS device, and one or more implants may be performed to implant impurities into the source/drain regions of the PMOS and NMOS devices. One or more of the spacers alongside the gate electrode of the PMOS device may be selectively removed. Thereafter, the source/drain regions may be silicided.

摘要翻译： 提供了一种其上形成有NMOS和PMOS器件的半导体器件。 NMOS器件具有在栅电极旁边形成的附加间隔物，以允许硅化物区域远离栅电极形成。 通过将硅化物区域放置在更远离栅电极的位置，减少了间隔物下方的硅化物区域的横向侵蚀的影响，特别是泄漏。 形成半导体器件的方法可以包括在PMOS和NMOS器件的栅电极旁边形成多个间隔物，并且可以执行一个或多个注入以将杂质注入到PMOS和NMOS器件的源极/漏极区域中。 可以选择性地去除与PMOS器件的栅电极旁边的一个或多个间隔物。 此后，源极/漏极区域可以被硅化。

公开(公告)号：US07625801B2

公开(公告)日：2009-12-01

申请号：US11523678

申请日：2006-09-19

申请人： Chii-Ming Wu ,  Cheng-Tung Lin ,  Chih-Wei Chang ,  Shau-Lin Shue

发明人： Chii-Ming Wu ,  Cheng-Tung Lin ,  Chih-Wei Chang ,  Shau-Lin Shue

IPC分类号： H01L21/336

CPC分类号： H01L21/26506 ,  H01L21/2658 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7848 ,  H01L29/78654

摘要： A method for forming a semiconductor structure includes providing a semiconductor substrate, forming a gate stack on the semiconductor substrate, forming a silicon-containing compound stressor adjacent the gate stack, implanting non-siliciding ions into the silicon-containing compound stressor to amorphize an upper portion of the silicon-containing compound stressor, forming a metal layer on the silicon-containing compound stressor while the upper portion of the SiGe stressor is amorphous, and annealing to react the metal layer with the silicon-containing compound stressor to form a silicide region. The silicon-containing compound stressor includes SiGe or SiC.

摘要翻译： 一种用于形成半导体结构的方法包括：提供半导体衬底，在半导体衬底上形成栅极叠层，在栅堆叠附近形成含硅化合物应力源，将非硅化离子注入到含硅化合物应力器中以使上层 含硅化合物应激源的部分，在含硅化合物应激物上形成金属层，同时SiGe应力源的上部是无定形的，退火使金属层与含硅化合物应激反应物形成硅化物区域 。 含硅化合物应激源包括SiGe或SiC。

公开(公告)号：US07429333B2

公开(公告)日：2008-09-30

申请号：US11691573

申请日：2007-03-27

申请人： Jin-Chern Chiou ,  Chen-Chun Hung ,  Chih-Wei Chang

发明人： Jin-Chern Chiou ,  Chen-Chun Hung ,  Chih-Wei Chang

IPC分类号： B44C1/22 ,  C25F3/00

CPC分类号： B29C33/40 ,  B29C33/3878

摘要： The present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated.

摘要翻译： 本发明公开了一种用压花工艺快速制造微针阵列的方法和一种用于制造微针阵列的压花模具的方法，其中利用微机电技术制造高纵横比硅微针阵列的母模， 图案用于制造压花模具; 将热固性材料填充到压花模具中; 然后进行烘烤，压制和脱模; 从而可以批量制造一次性固体聚合物微针阵列。

公开(公告)号：US20080122071A1

公开(公告)日：2008-05-29

申请号：US11986362

申请日：2007-11-21

申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/373

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311

摘要： A heat dissipating semiconductor package and the fabrication method therefor are provided. The fabrication method for the heat dissipating semiconductor package mainly includes steps of: containing a substrate having a chip mounted thereon in an aperture of a carrier, wherein the carrier has an electroconductive layer; allowing a heat dissipating structure having supporting portions to be mounted on and electrically connected to the electroconductive layer of the carrier via the supporting portions thereof while heat dissipating structure being mounted on the chip; after an encapsulation process and removing a part of the encapsulant above the heat dissipating sheet by lapping to expose a surface of the heat dissipating structure from the encapsulant, depositing and forming a metal passivation layer on the surface of the heat dissipating structure by electroplating for preventing the heat dissipating structure from oxidizing.

摘要翻译： 提供一种散热半导体封装及其制造方法。 用于散热半导体封装的制造方法主要包括以下步骤：在载体的孔中容纳其上安装有芯片的基板，其中载体具有导电层; 允许散热结构，其具有支撑部分，其安装在载体的导电层上并通过其支撑部分电连接，同时散热结构安装在芯片上; 在封装工艺之后并且通过研磨去除散热片上方的一部分密封剂，以从密封剂暴露出散热结构的表面，在散热结构的表面上沉积和形成金属钝化层，通过电镀防止 散热结构从氧化。

公开(公告)号：US20080083957A1

公开(公告)日：2008-04-10

申请号：US11539025

申请日：2006-10-05

申请人： Wen-Chieh Wei ,  Hong-Ching Her ,  Shih-Chin Gong ,  Chih-Wei Chang

发明人： Wen-Chieh Wei ,  Hong-Ching Her ,  Shih-Chin Gong ,  Chih-Wei Chang

IPC分类号： H01L29/84

CPC分类号： H04R19/005 ,  B81B7/0064 ,  B81B2201/0257 ,  B81B2207/012 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15151 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H04R19/04 ,  H01L2924/00 ,  H01L2924/00012

摘要： A micro-electromechanical system package includes a substrate, a group of components, isolative stuff and a conductive shield. The substrate is made with an upper face and a lower face. The group is mounted on the upper face of the substrate. The isolative stuff seals the group and the upper face of the substrate, thus protecting the group from moisture. The conductive shield covers the isolative stuff, thus protecting the group from electromagnetic interference.

摘要翻译： 微机电系统封装包括基板，一组部件，隔离材料和导电屏蔽。 基板由上表面和下表面制成。 该组安装在基板的上表面上。 隔离物密封基体的基团和上表面，从而保护基团免受潮湿。 导电屏蔽覆盖隔离材料，从而保护组免受电磁干扰。