公开(公告)号：US20110115447A1

公开(公告)日：2011-05-19

申请号：US12913779

申请日：2010-10-28

申请人： Chih-Wei Lin ,  Nung-Te Huang ,  Chih-Wan Hsu

发明人： Chih-Wei Lin ,  Nung-Te Huang ,  Chih-Wan Hsu

IPC分类号： G05F1/10

CPC分类号： H02M3/1584

摘要： A multiphase power supply device and a current adjusting method thereof are provided in the application. The multiphase power supply device outputs power sources and currents with different phases to a microprocessor, and a detection module detects present temperature values of each phase power source to adjust currents of each phase power source to achieve thermal balance. The multiphase power supply device further can automatically measure the power efficiency and display results including the detected temperature values of each phase power source and the power efficiency on a screen, and thus the user can know the operation efficiency of the power supply device conveniently.

摘要翻译： 本申请中提供了多相电源装置及其电流调节方法。 多相电源装置向微处理器输出具有不同相位的电源和电流，并且检测模块检测每相电源的当前温度值，以调节每相电源的电流以实现热平衡。 多相电源装置还可以自动测量功率效率和显示结果，包括各相电源的检测温度值和屏幕上的电源效率，从而使用户可以方便地了解电源设备的运行效率。

公开(公告)号：US20110033787A1

公开(公告)日：2011-02-10

申请号：US12537836

申请日：2009-08-07

申请人： Chih-Wei Lin ,  Yung-Cheng Chen ,  Heng-Jen Lee

发明人： Chih-Wei Lin ,  Yung-Cheng Chen ,  Heng-Jen Lee

IPC分类号： G03F7/20 ,  G06F17/50

CPC分类号： G03F7/70433

摘要： A method includes receiving an integrated circuit chip size and determining a frame structure segment size based on the chip size. The frame structure segment size is less than the chip size. An initial shot layout having a chip count is established in which a number of shots, each including at least one frame structure segment and at least one chip, are arranged in vertically and horizontally aligned columns and rows. At least one additional shot layout is established in which at least one of a row or column of shots is offset from an adjacent row or column of shots. The initial shot layout is compared to the at least one additional shot layout, and a final shot layout is selected based in part on the total number of shots in the shot layout and has a final chip count that is greater than or equal to the initial chip count.

摘要翻译： 一种方法包括接收集成电路芯片尺寸并基于芯片尺寸确定帧结构段大小。 帧结构段大小小于芯片大小。 建立具有芯片数量的初始照片布局，其中每个包括至少一个框架结构段和至少一个芯片的镜头排列在垂直和水平排列的列和行中。 建立至少一个额外的镜头布局，其中一列或一列镜头中的至少一个从相邻的行或列的镜头偏移。 将初始照片布局与至少一个附加镜头布局进行比较，并且部分地基于镜头布局中的总镜头数量选择最终镜头布局，并且具有大于或等于初始镜头布局的最终​​裁片数量 芯片数量

公开(公告)号：US20100109855A1

公开(公告)日：2010-05-06

申请号：US12346838

申请日：2008-12-31

申请人： Jung-Huang Liao ,  Chih-Wei Lin

发明人： Jung-Huang Liao ,  Chih-Wei Lin

IPC分类号： B60Q1/00

CPC分类号： B60Q5/00 ,  B60Q5/003

摘要： A sounder control circuit is applicable to for a vehicle with a plurality of sounders, in which each sounder is used for generating a sound signal toward a different direction respectively. The sounder control circuit includes a switch module, a control module and a driving module. The switch module has a plurality of switches, and outputs an operation signal to the control module according to a status of each of the switches. Thus, the control module outputs a control signal to the driving module according to the operation signal for driving at least one of the sounders to output the sound signal.

摘要翻译： 发声器控制电路适用于具有多个发声器的车辆，其中每个发声器用于分别向不同方向产生声音信号。 发声器控制电路包括开关模块，控制模块和驱动模块。 开关模块具有多个开关，并且根据每个开关的状态向控制模块输出操作信号。 因此，控制模块根据用于驱动至少一个发声器的操作信号向驱动模块输出控制信号以输出声音信号。

公开(公告)号：US20100098292A1

公开(公告)日：2010-04-22

申请号：US12468224

申请日：2009-06-11

申请人： Tsann-Tay Tang ,  Chih-Wei Lin ,  Ming-Yu Shih

发明人： Tsann-Tay Tang ,  Chih-Wei Lin ,  Ming-Yu Shih

IPC分类号： G06K9/00

CPC分类号： G06K9/00771 ,  G06K9/4671

摘要： An image detecting method and a system thereof are provided. The image detecting method includes the following steps. An original image is captured. A moving-object image of the original image is created. An edge-straight-line image of the original image is created, wherein the edge-straight-line image comprises a plurality of edge-straight-lines. Whether the original image has a mechanical moving-object image is detected according to the length, the parallelism and the gap of the part of the edge-straight-lines corresponding to the moving-object image.

摘要翻译： 提供了一种图像检测方法及其系统。 图像检测方法包括以下步骤。 捕获原始图像。 创建原始图像的移动物体图像。 创建原始图像的边缘直线图像，其中边缘直线图像包括多条边缘直线。 根据对应于移动物体图像的边缘直线的一部分的长度，平行度和间隙来检测原始图像是否具有机械移动物体图像。

公开(公告)号：US20100044732A1

公开(公告)日：2010-02-25

申请号：US12485237

申请日：2009-06-16

申请人： Yueh-Han Li ,  Po-Tang Hsu ,  Chien-Ming Ko ,  Hung-Ching Lee ,  Chih-Wei Lin

发明人： Yueh-Han Li ,  Po-Tang Hsu ,  Chien-Ming Ko ,  Hung-Ching Lee ,  Chih-Wei Lin

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/54 ,  H01L33/58

摘要： A light emitting diode structure and a light emitting diode structure forming method are provided. The light emitting diode structure includes a base, a diode chip, and a package lens. The diode chip is mounted on the base. The package lens covers the diode chip. The surface of the package lens includes a plurality of dot structures. The steps of the method include mounting a light-emitting diode chip on a base, assembling a package lens to cover the light emitting diodes chip, and forming a plurality of dot structures on the surface of the package lens.

摘要翻译： 提供了发光二极管结构和发光二极管结构形成方法。 发光二极管结构包括基座，二极管芯片和封装透镜。 二极管芯片安装在基座上。 封装透镜覆盖二极管芯片。 封装透镜的表面包括多个点结构。 该方法的步骤包括将发光二极管芯片安装在基座上，组装封装透镜以覆盖发光二极管芯片，以及在封装透镜的表面上形成多个点状结构。

公开(公告)号：US07453148B2

公开(公告)日：2008-11-18

申请号：US11613247

申请日：2006-12-20

申请人： Wen-Kun Yang ,  Chun-Hui Yu ,  Chao-Nan Chou ,  Chih-Wei Lin ,  Ching-Shun Huang

发明人： Wen-Kun Yang ,  Chun-Hui Yu ,  Chao-Nan Chou ,  Chih-Wei Lin ,  Ching-Shun Huang

IPC分类号： H01L23/48

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00

摘要： The present invention provides a structure of elastic dielectric layers with certain through holes adjacent to the angle of a RDL of WLP to absorb the stress. The elastic dielectric layer is made from silicone based materials with specific range of CTE, elongation rate and hardness, which can improve the mechanical reliability of the structure during temperature cycling test. The CTE difference between the RDL and the elastic dielectric material still may cause the elastic dielectric layer crack; to solve this problem, The present invention further provides a structure of dielectric layers with certain open through holes adjacent to the curve portion of a RDL of WLP which can reduce the stress accumulated at area of the dielectric layer adjacent to the RDL/dielectric layer interface to solve the crack problem of the dielectric layer.

摘要翻译： 本发明提供了具有与WLP的RDL的角度相邻的某些通孔以吸收应力的弹性介电层的结构。 弹性介电层由具有特定范围的CTE，伸长率和硬度的硅酮基材料制成，这可以在温度循环测试期间提高结构的机械可靠性。 RDL和弹性介电材料之间的CTE差异仍然可能导致弹性介电层裂纹; 为了解决这个问题，本发明还提供了具有与WLP的RDL的曲线部分相邻的某些开放通孔的电介质层的结构，其可以减少在与RDL /介电层界面相邻的介电层的面积处积累的应力 以解决电介质层的裂纹问题。

公开(公告)号：US20080237834A1

公开(公告)日：2008-10-02

申请号：US11692933

申请日：2007-03-29

申请人： Dyi-Chung Hu ,  Yu-Shan Hu ,  Chih-Wei Lin

发明人： Dyi-Chung Hu ,  Yu-Shan Hu ,  Chih-Wei Lin

IPC分类号： H01L23/31

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L24/28 ,  H01L24/32 ,  H01L25/105 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2224/32057 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/1815 ,  H01L2924/01026 ,  H01L2924/01028

摘要： A chip packaging structure comprising a chip, a plurality of conductive pillars surrounding the chip, an encapsulation encapsulating the chip and the conductive pillars, and a connecting layer is provided. The encapsulation has a first side and a second side corresponding to the first side. The connecting layer is disposed at the first side of the encapsulation and electrically connected between the chip and the conductive pillars. Furthermore, a chip packaging process accompanying the chip packaging structure is also provided. The chip packaging structure is more useful and powerful and is suitable for various chip packaging applications, and the chip packaging process can reduce the manufacturing time and save the production cost.

摘要翻译： 一种芯片封装结构，包括芯片，围绕芯片的多个导电柱，封装芯片和导电柱的封装以及连接层。 封装具有对应于第一侧的第一侧和第二侧。 连接层设置在封装的第一侧并电连接在芯片和导电柱之间。 此外，还提供了伴随芯片封装结构的芯片封装工艺。 芯片封装结构更加实用，功能强大，适用于各种芯片封装应用，芯片封装工艺可以缩短制造时间，节省生产成本。

公开(公告)号：US20080229574A1

公开(公告)日：2008-09-25

申请号：US11725826

申请日：2007-03-19

申请人： Wen-Kun Yang ,  Hsien-Wen Hsu ,  Chih-Wei Lin ,  Ming-Chung Cheng ,  Chih-Ming Chen ,  Chun-Hiu Yu

发明人： Wen-Kun Yang ,  Hsien-Wen Hsu ,  Chih-Wei Lin ,  Ming-Chung Cheng ,  Chih-Ming Chen ,  Chun-Hiu Yu

IPC分类号： B23P19/033

CPC分类号： H01L21/67144 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/53535

摘要： The present invention provides an apparatus and a method for self chip redistribution. The apparatus of the present invention comprises a glass base on which a trench and a cavity formed by a layer of photo resistance. Chips are picked from a sawed wafer and placed on the glass base and moved by fluid flow to the front of index bar. The glass base and the index bar vibrate with low frequency to fill chips into chip cavities. The present invention further provides a method for self chip redistribution, comprising providing a self redistribution tool, transferring redistributed chips onto a panel forming tool, forming a chip panel and separating said chip panel from panel forming tool.

摘要翻译： 本发明提供一种用于自身芯片再分配的装置和方法。 本发明的装置包括一个玻璃基座，一个沟槽和一个由光电阻层形成的空腔。 芯片从锯切的晶片上取下并放置在玻璃基底上，并通过流体流动将其移动到索引杆的前部。 玻璃基座和索引杆以低频振动，将芯片填充到芯片空腔中。 本发明还提供了一种用于自芯片再分配的方法，包括提供自重新分配工具，将重新分配的芯片转移到面板成形工具上，形成芯片面板并将所述芯片面板与面板成形工具分离。

公开(公告)号：US20080200041A1

公开(公告)日：2008-08-21

申请号：US11675645

申请日：2007-02-16

申请人： Chih-Wei Lin ,  Chien-Hua Wu ,  Chia-Lin Shih ,  Chia-Ming Chen

发明人： Chih-Wei Lin ,  Chien-Hua Wu ,  Chia-Lin Shih ,  Chia-Ming Chen

IPC分类号： H01R12/00

CPC分类号： G11B33/122 ,  H05K1/117 ,  H05K2201/10325 ,  H05K2201/2018

摘要： The present disclosure relates to a storage device. The storage device comprises a frame having a hole and a printed circuit board embedded in the frame, wherein the printed circuit board has an extended part for forming a connector. The connector may pass through the hole and is exposed out the frame for interfacing the storage device with a host device. At least one memory device is mounted to the printed circuit board and electrically connected to the printed circuit board.

摘要翻译： 本公开涉及一种存储装置。 存储装置包括具有孔的框架和嵌入框架中的印刷电路板，其中印刷电路板具有用于形成连接器的延伸部分。 连接器可以穿过孔并且暴露出框架以将存储设备与主机设备接口。 至少一个存储器件被安装到印刷电路板并电连接到印刷电路板。

公开(公告)号：US20060033196A1

公开(公告)日：2006-02-16

申请号：US10918416

申请日：2004-08-16

申请人： Wen-Kun Yang ,  Shih-Li Chen ,  Wen-Bin Sun ,  Ming-Hui Lin ,  Chao-Nan Chou ,  Chih-Wei Lin

发明人： Wen-Kun Yang ,  Shih-Li Chen ,  Wen-Bin Sun ,  Ming-Hui Lin ,  Chao-Nan Chou ,  Chih-Wei Lin

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  H01L23/3128 ,  H01L24/19 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.

摘要翻译： 提供包括器件，互连元件，焊盘和保护元件的封装结构。 该装置通过焊盘与互连元件的第一端连接。 保护元件覆盖焊盘和互连元件的第一端。