公开(公告)号：US5365211A

公开(公告)日：1994-11-15

申请号：US996765

申请日：1992-12-18

申请人： William D. Carbaugh, Jr. ,  David C. Long ,  Karl F. Stroms

发明人： William D. Carbaugh, Jr. ,  David C. Long ,  Karl F. Stroms

IPC分类号： H01F5/00 ,  H01F7/20

CPC分类号： H01F7/202 ,  Y10T83/293

摘要： A magneto repulsion electrical tape wound coil has been developed with improved current distribution and improved heat transfer. The coil is easy and is expensive to manufacture and simple to mount. The coil comprises a conductive strip (e.g., a copper strip) with rectangular openings stamped in it with a standard metal stamp. The single row of openings are at regular intervals and arranged so that the width of the openings and the spacing of the openings is such that when the coil is wound there is an overlap of the openings, forming radial passages extending from the outer periphery of the coil to its central core electrode. Cooling fluid may be supplied from a hollow inner electrode so that the cooling fluid flows radially, outwardly. Since the openings overlap to form radial passages, a cross-flow path for the cooling fluid may be established where fluid enters the passages on one side of the coil and exits from the other side of the coil.

摘要翻译： 已经开发出具有改进的电流分布和改善的热传递的磁阻斥电缠绕线圈。 线圈容易，制造成本高，安装简单。 线圈包括具有标有金属印章的矩形开口的导电条（例如铜条）。 单排开口是规则的间隔并且布置成使得开口的宽度和开口的间隔使得当线圈被卷绕时存在开口的重叠，从而形成径向通道，该径向通道从 线圈到其中心芯电极。 冷却流体可以从中空的内部电极供应，使得冷却流体径向向外流动。 由于开口重叠以形成径向通道，所以可以建立用于冷却流体的横流通道，其中流体进入线圈一侧的通道并从线圈的另一侧离开。

公开(公告)号：US5172388A

公开(公告)日：1992-12-15

申请号：US734499

申请日：1991-07-23

申请人： David C. Long ,  Howard A. Bender ,  William D. Carbaugh, Jr. ,  Mark J. La Plante ,  Christopher D. Setzer

发明人： David C. Long ,  Howard A. Bender ,  William D. Carbaugh, Jr. ,  Mark J. La Plante ,  Christopher D. Setzer

IPC分类号： H01S3/04 ,  H01S3/042 ,  H01S3/06 ,  H01S3/093 ,  H01S3/0941 ,  H01S3/11

CPC分类号： H01S3/0931 ,  H01S3/0401 ,  H01S3/042 ,  H01S3/0404 ,  H01S3/0407 ,  H01S3/0608 ,  H01S3/0805 ,  H01S3/0941 ,  H01S3/102 ,  H01S3/1026

摘要： A solid state lasing rod is spun on its long axis. The rod is pumped with photons while it spins. The rod is greater in diameter than the aperture. The rod is aligned off-center from the center of the aperture so that different portions of the rod are exposed to the aperture for lasing. The repetition rate of the lasing of the laser is increased because as the rod spins, the area of the rod that is not lasing is being charged. The laser rod can also be hollow to allow for pumping of the photons from either outside or inside the hollow bore or both. Similarly, this hollow bore in the laser rod could also allow cooling fluids to be circulated therethrough.

公开(公告)号：US09034595B2

公开(公告)日：2015-05-19

申请号：US13325988

申请日：2011-12-14

申请人： Paul D. Oldenburg ,  Michel Daage ,  Virginia M. Roberts ,  Paul J. Berlowitz ,  David C. Long ,  James R. Bielenberg

发明人： Paul D. Oldenburg ,  Michel Daage ,  Virginia M. Roberts ,  Paul J. Berlowitz ,  David C. Long ,  James R. Bielenberg

IPC分类号： C12P7/10 ,  C12P7/24 ,  C12P7/54 ,  C12P7/62 ,  C12P7/64 ,  C12P7/04 ,  C12P7/16 ,  C12N1/12 ,  C12P7/06

CPC分类号： C12P7/6436 ,  C12N1/12 ,  C12P7/04 ,  C12P7/065 ,  C12P7/10 ,  C12P7/16 ,  Y02E50/10 ,  Y02E50/16 ,  Y02E50/17 ,  Y02P20/125 ,  Y02P20/582

摘要： Systems and methods are provided for enhancing the integration of processes for recovering products from algae-derived biomass. The enhanced process integration allows for increased use of input streams and other reagents that are derived from renewable sources. This increases the overall renewable character of the products extracted from the algae-derived biomass. The process integration can include exchange of input streams or energy between an algae processing system and a system for processing non-algal biomass. One example of improving process integration is using oxygenates that are generated in a renewable manner as a reagent for enhancing the algae processing system.

摘要翻译： 提供了系统和方法，用于增强从藻类衍生的生物质中回收产物的方法的整合。 增强的过程集成允许更多地使用从可再生来源获得的输入流和其他试剂。 这增加了从藻类来源的生物质提取的产品的整体可再生性。 过程集成可以包括在藻类处理系统和用于处理非藻类生物质的系统之间的输入流或能量的交换。 改进过程整合的一个实例是使用以可再生方式产生的含氧化合物作为增强藻类处理系统的试剂。

公开(公告)号：US08704020B2

公开(公告)日：2014-04-22

申请号：US13285787

申请日：2011-10-31

申请人： Virginia M. Roberts ,  Michel Daage ,  James R. Bielenberg ,  Paul J. Berlowitz ,  Paul D. Oldenburg ,  David C. Long ,  Halou Oumar-Mahamat

发明人： Virginia M. Roberts ,  Michel Daage ,  James R. Bielenberg ,  Paul J. Berlowitz ,  Paul D. Oldenburg ,  David C. Long ,  Halou Oumar-Mahamat

IPC分类号： C07C1/00

CPC分类号： C10G3/50 ,  C10G3/42 ,  C10G3/44 ,  C10G3/45 ,  C10G3/52 ,  C10G3/62 ,  C10G45/08 ,  C10G45/26 ,  C10G45/50 ,  C10G47/06 ,  C10G65/12 ,  C10G2300/1011 ,  C10G2300/1014 ,  C10G2300/1018 ,  C10G2300/201 ,  C10G2300/202 ,  C10G2300/205 ,  C10G2300/4081 ,  C10G2300/44 ,  C10G2300/70 ,  C10G2300/805 ,  C10G2400/02 ,  C10G2400/04 ,  C10G2400/10 ,  Y02P30/20

摘要： Biomass based feeds are processed under hydrothermal treatment conditions, e.g., to produce a hydrocarbon liquid product and a solids portion. The hydrothermal treatment is performed in the presence of a dissolved catalyst or catalyst precursor. The presence of the dissolved catalyst or catalyst precursor can modify the nature of the hydrocarbon products produced from the hydrothermal treatment.

摘要翻译： 基于生物质的饲料在水热处理条件下进行处理，例如产生烃液体产物和固体部分。 在溶解的催化剂或催化剂前体的存在下进行水热处理。 溶解的催化剂或催化剂前体的存在可以改变由水热处理产生的烃产物的性质。

公开(公告)号：US20100200197A1

公开(公告)日：2010-08-12

申请号：US12698430

申请日：2010-02-02

申请人： Raschid J. Bezama ,  David C. Long ,  Govindarajan Natarajan ,  Thomas Weiss

发明人： Raschid J. Bezama ,  David C. Long ,  Govindarajan Natarajan ,  Thomas Weiss

IPC分类号： H01L23/473 ,  F28D15/00 ,  F28D11/06 ,  H01L23/433

CPC分类号： H01L23/4735 ,  F28D15/00 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/3733 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

摘要翻译： 本发明提供一种散热器及其使用方法，用于冷却集成电路（IC）芯片。 散热器包括歧管块，充满液体的冷却系统和固定到歧管块的柔性箔，并且由闭环冷却系统中的液体支撑。 由箔片后面的液体提供的压力导致箔片弯曲并符合IC芯片表面中的非平面性，从而减少了气隙并增加了IC芯片与散热片之间的热耦合。

公开(公告)号：US07687894B2

公开(公告)日：2010-03-30

申请号：US11535740

申请日：2006-09-27

申请人： John S. Corbin, Jr. ,  David L. Edwards ,  David C. Long ,  Jason S. Miller

发明人： John S. Corbin, Jr. ,  David L. Edwards ,  David C. Long ,  Jason S. Miller

IPC分类号： H01L23/02

CPC分类号： H05K3/325 ,  H05K1/0271 ,  H05K3/0058 ,  H05K2201/10719 ,  H05K2201/2009 ,  H05K2203/074

摘要： An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.

摘要翻译： 公开了一种IC芯片封装及相关方法。 IC芯片封装可以包括通过平面栅格阵列（LGA）连接器耦合到芯片模块的印刷电路板（PCB），包括接触PCB底部的基于流体的压力补偿器的金属加强件和至少两个耦合器 用于将金属加强件耦合到芯片模块，其中PCB和LGA连接器在其间。 基于流体的压力补偿器自动补偿PCB和芯片模块的自然和非系统的平坦度公差以及PCB的不均匀厚度，同时在LGA上产生基本上均匀的接触力。

公开(公告)号：US20080232072A1

公开(公告)日：2008-09-25

申请号：US12131352

申请日：2008-06-02

申请人： David L. Edwards ,  Ronald L. Hering ,  David C. Long ,  Jason S. Miller ,  Carl R. Peterson

发明人： David L. Edwards ,  Ronald L. Hering ,  David C. Long ,  Jason S. Miller ,  Carl R. Peterson

IPC分类号： H05K3/30 ,  H01R13/73

CPC分类号： H05K7/142

摘要： A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.

摘要翻译： 公开了一种用于安装电路板的凸轮动作扩展型支座连接器及相关方法。 支座连接器包括主体和多个安装构件，其具有用于由凸轮接合的内部纵向延伸的凸轮部分。 凸轮构造成在安装构件内定位在第一位置，在第一位置，安装构件不会抵靠安装开口的内部膨胀，并且在第二位置中凸轮接合凸轮部分以使多个安装构件 抵靠安装开口的内部。 由于凸轮作用仅仅是水平的（纯径向的），实际上没有垂直力施加到电路板上，并且可以建立和维持电路板和散热器之间的最佳配合。

公开(公告)号：US20080218971A1

公开(公告)日：2008-09-11

申请号：US11681994

申请日：2007-03-05

申请人： Patrick A. Coico ,  David L. Edwards ,  Richard F. Indyk ,  David C. Long

发明人： Patrick A. Coico ,  David L. Edwards ,  Richard F. Indyk ,  David C. Long

IPC分类号： H05K7/20

CPC分类号： H01L21/4871 ,  H01L21/50 ,  H01L23/3675 ,  H01L24/16 ,  H01L24/31 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

公开(公告)号：US07378452B2

公开(公告)日：2008-05-27

申请号：US11641222

申请日：2006-12-19

申请人： David C. Long ,  Thomas M. Holden ,  Stephen J. Hsia ,  Costas A. Coulaloglou

发明人： David C. Long ,  Thomas M. Holden ,  Stephen J. Hsia ,  Costas A. Coulaloglou

IPC分类号： C07C27/00

CPC分类号： B01J8/22 ,  B01J8/006 ,  B01J8/009 ,  C10G2/344

摘要： A method for separating and filtering solid particles from a hydrocarbon slurry liquid includes two or more filter sections in fluid communication with the hydrocarbon slurry. At least one filter section is comprised of one or more filter elements having a mean pore size of less than 10 microns, and at least one other section is comprised of one or more filter elements having a mean pore size of 10 microns or greater. The small pore filter (less than 10 microns) will exclude all or substantially all of the smaller catalyst fines produced by catalyst particle attrition. The liquid product removed from the small pore filters will be substantially free of particulates. The large pore filters (10 microns or greater) will exclude larger catalyst particles, but will allow the smaller fines to pass. The liquid product removed from the large pore filters will contain the fines generated from catalyst particle attrition.

摘要翻译： 从烃浆液中分离和过滤固体颗粒的方法包括与烃浆料流体连通的两个或多个过滤器部分。 至少一个过滤器部分由平均孔径小于10微米的一个或多个过滤元件组成，并且至少一个其它部分由平均孔径为10微米或更大的一个或多个过滤元件组成。 小孔过滤器（小于10微米）将排除由催化剂颗粒磨耗产生的所有或基本上所有较小的催化剂细粉。 从小孔过滤器去除的液体产物将基本上不含微粒。 大孔过滤器（10微米或更大）将排除较大的催化剂颗粒，但将允许较小的细粉通过。 从大孔过滤器去除的液体产物将含有由催化剂颗粒磨耗产生的细粉。

公开(公告)号：US07281667B2

公开(公告)日：2007-10-16

申请号：US10907761

申请日：2005-04-14

申请人： Mukta G. Farooq ,  Benjamin V. Fasano ,  Jason L. Frankel ,  Harvey C. Hamel ,  Suresh D Kadakia ,  David C. Long ,  Frank L. Pompeo ,  Sudipta K. Ray

发明人： Mukta G. Farooq ,  Benjamin V. Fasano ,  Jason L. Frankel ,  Harvey C. Hamel ,  Suresh D Kadakia ,  David C. Long ,  Frank L. Pompeo ,  Sudipta K. Ray

IPC分类号： G06K19/06

CPC分类号： G06K19/07381 ,  H01L23/04 ,  H01L23/055 ,  H01L23/10 ,  H01L23/576 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/3011 ,  H05K1/0275 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/09263 ,  H05K2201/10151

摘要： A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

摘要翻译： 防干扰集成电路（IC）模块包括陶瓷芯片载体，附接到芯片载体的一个或多个集成电路芯片，以及附接到芯片载体的覆盖一个或多个集成电路芯片的盖结构。 在芯片载体和盖结构中形成导电栅格结构，该导电结构具有沿x方向，y方向和z方向设置的多条曲折线。 导电栅格结构被配置为检测穿透IC模块的尝试。