摘要:
An SOI cell includes a semiconductor body having at least one insulator layer. A polycrystalline zone doped with a dopant of a first conductivity type is grown on the insulator layer. The polycrystalline zone is adjoined outside the region of the insulator layer by a semiconductor region, which is doped with the dopant of the first conduction type that has been diffused out of the polycrystalline zone. A dopant source having a dopant of a second conductivity type is also provided. A zone having the dopant of the second conductivity type is formed by diffusing the dopant out of the dopant source.
摘要:
The electrical switch component has two temperature sensors. The first temperature sensor is provided at that location of the component which is warmest during operation. The first sensor switches the component off when a first, upper threshold value is reached, and switches the component on when the temperature falls below a second, lower threshold value. The oscillation owing to the first temperature sensor is switched on and off by the second temperature sensor, which is arranged remote from the first temperature sensor at a location that is less warm than the first temperature sensor. The second sensor has lower threshold values than the first temperature sensor.
摘要:
A first power FET has a source terminal, a gate terminal and a drain terminal and a load is connected in series with the source terminal of the power FET. A circuit configuration for triggering the first power FET includes a first input terminal. A first diode and a capacitor are connected between the first input terminal and the gate terminal of the first power FET. A second FET of the opposite channel type from that of the first power FET has a gate terminal and has drain and source terminals defining a drain-to-source path. A second diode is connected between the first diode and the capacitor and is connected through the drain-to-source path of the second FET to the drain terminal of the power FET. A resistor is connected between the gate and source terminals of the second FET. A controllable switch is connected to the gate terminal of the second FET. A second input terminal is connected to the controllable switch for receiving a voltage being lower than a supply voltage. A third depletion FET has a gate terminal connected to the controllable switch and has drain and source terminals defining a drain-to-source path connected between the gate terminal and the source terminal of the first power FET for discharging a gate-to-source capacitance of the first power FET.
摘要:
The gate-source capacitance of a power MOSFET (1) can be protected against positive and negative excess voltages by two integrated Zener diodes (3, 4) the anodes of which are coupled to each other and the cathodes of which are respectively coupled to the gate and source terminals of the power MOSFET. However, when a control voltage is applied, the parasitic bipolar transistor associated with one of the Zener diodes is switched on and prevents the MOSFET from completely switching on. The parasitic bipolar transistor is rendered harmless by the fact that the anode terminal is coupled to a source terminal (S) MOSFET (1) when a gate-source voltage is applied.
摘要:
In order to rapidly reduce the magnetic energy of an inductive load (2), the driving voltage must be high. When the load (2) is disconnected via a MOSFET (3), then a premature activation of the MOSFET (3) given reversal of the voltage at the inductive load (2) must be prevented. A series circuit of a Zener diode and of a controllable switch (3) is connected between the gate and the load (2). A current source (depletion MOSFET 5) whose current is lower than the current that would flow upon Zener breakdown is connected between the gate and the source of the power MOSFET (1). The MOSFET (3) becomes conductive upon Zener breakdown and the energy is quickly reduced by a high voltage, essentially by the Zener voltage.
摘要:
A field effect controllable bipolar transistor or isolated gate bipolar transistor (IGBT) has a drastically reduced inhibit delay charge, given identical on-state behavior, in that the anode zone has a thickness of less that 1 micrometer, it is doped with implanted ions with a dose of about 1.times.10.sup.12 through 1.times.10.sup.15 cm.sup.-2, and in that the life time of the minority charge carriers in the inner zone amounts to at least 1 microsecond.
摘要翻译:给定相同的导通状态,场效应可控双极晶体管或隔离栅双极晶体管(IGBT)具有显着降低的抑制延迟电荷,因为阳极区具有小于1微米的厚度,其掺杂有注入离子 约1×10 12至1×10 15 cm -2的剂量,并且内区中少数电荷载体的寿命至少为1微秒。
摘要:
A circuit for monitoring the temperature of a semiconductor structural component. The circuit includes a bipolar transistor (1) in thermal contact with a semiconductor structural element to be monitored, and a MOSFET (11) connected in series with a current source (12). The MOSFET (11) is maintained in a nonconducting state with two Zener diodes (13, 14) if the bipolar transistor (1) is the standard operating temperature of the semiconductor structural element. This circuit provides for a reduced zero current signal. The current flowing through the bipolar transistor (1) increases with temperature and the gate-source voltage of the MOSFET (11) is increases until it switches off. If the current flowing through the MOSFET (11) is greater than the impressed current of the current source (12) the potential across the current source takes a step increase a value near the supply voltage (V.sub.DD). This voltage step can then be detected as an excess-temperature signal.
摘要:
The temperature of the power semiconductor component is sensed by a bipolar transistor. The bipolar transistor is in series with a depletion mode MOSFET whose gate and source electrodes are connected together. The drain electrode is also connected to a threshold element. Normally, the FET has low impedance, so that at the input of the threshold element source potential, e.g. ground potential, is present. With current rising as a function of temperature, the current through the FET is limited to a constant, essentially temperature-independent value, and the potential at the input of the threshold element rises steeply. This condition is detected as an overtemperature signal.
摘要:
The voltage peaks occuring upon disconnection of inductive loads are normally attenuated by a by-pass diode connected in parallel with the load. The driving countervoltage is thereby limited to the value of the forward voltage drop of the diode. For a power MOSFET with a source-side inductive load, the driving countervoltage is increased by placing a series connection of an additional MOSFET and a Zener diode between the gate of the power MOSFET and the connection of the load which is remote from the power MOSFET. The driving countervoltage at the source now becomes the Zener voltage plus the occuring gate-source voltage of the power MOSFET.
摘要:
When a power MOSFET operated as a source follower is driven by an electronic switch, an interruption of the connection between ground and the electronic switch may result in the output potential of the electronic switch to change so that the power MOSFET is partially switched on. This causes a considerable amount of power dissipation. Therefore, there is placed between the source and gate electrodes of the MOSFET a depletion MOSFET whose gate is connected to the terminal of the electronic switch intended for connection to ground. Thus, the power MOSFET remains non-conducting upon interruption of the connection between the electronic switch and ground.