摘要:
Manufacturing a wafer level stack package includes the steps of back-grinding a lower surface of a wafer including a plurality of first semiconductor chips. A support member is attached to a lower surface of the back-grinded wafer. One or more second semiconductor chips are stacked on the respective first semiconductor chips of the back-grinded wafer. First through-electrodes are formed to electrically connect the stacked first semiconductor chips and second semiconductor chips. Third semiconductor chips are attached to uppermost ones of the stacked second semiconductor chips, and the third semiconductor chips have second through-electrodes which are electrically connected to the first through-electrodes and re-distribution lines which are connected to the second through-electrodes. Outside connection terminals are attached to the re-distribution lines of the third semiconductor chips. The first semiconductor chips of a wafer level on which the second and third semiconductor chips are stacked are sawed to for semiconductor packages at a chip level.
摘要:
The present invention relates to novel red phosphorescent compounds exhibiting high luminous efficiency, and organic electroluminescent devices comprising the same.
摘要:
The present invention relates to novel organic electroluminescent compounds, and organic electroluminescent devices employing the same as electroluminescent material. Specifically, the organic electroluminescent compounds according to the invention are characterized in that they are represented by Chemical Formula (1): wherein, A and B independently represent CR7 or N, provided that both A and B cannot be CR7 or N at the same time; and X is O or S. Since the organic electroluminescent compounds according to the invention have good luminous efficiency and excellent color purity and life property of material, OLED's having very good operation life can be manufactured therefrom.
摘要:
The present invention relates to an organic electroluminescent device comprising an organic layer interposed between an anode and an cathode on a substrate, wherein the organic layer comprises an electroluminescent layer comprising one or more host compound(s) represented by Chemical Formula (1) and one or more dopant compound(s) represented by Chemical Formula (2): The organic electroluminescent device according to the present invention exhibits long life, high efficiency and high luminance with good color purity and lowered operation voltage, as well as enhanced stability of device.
摘要:
The present invention relates to novel organic electroluminescent compounds exhibiting high luminous efficiency, and organic electroluminescent devices comprising the same. The organic electroluminescent compounds according to the invention are represented by Chemical Formula (1):
摘要:
The present invention relates to novel organic electroluminescent compounds exhibiting high luminous efficiency, and organic electroluminescent devices comprising the same. The organic electroluminescent compounds according to the invention are represented by Chemical Formula (1):
摘要:
A laundry machine capable of washing and/or drying laundry is provided. The laundry machine includes a first washing tub provided in a cabinet, a housing having a space formed therein, the housing being insertable into and withdrawable from the cabinet, a second washing tub provided in the housing to receive laundry separately from the first washing tub, and a fixing member that fixes the second washing tub to restrict movement of the second washing tub.
摘要:
A laundry machine is provided capable of washing or drying laundry. The laundry machine, includes a cabinet, a first washing tub that receives laundry disposed within the cabinet, a housing disposed adjacent the cabinet, a second washing tub provided within the housing that receives laundry, and at least one support device that supports the second washing tub with respect to the housing, substantially preventing vertical displacement of the second washing tub due to the weight of the second washing tub and limiting the displacement of the second washing tub due to vibration thereof.
摘要:
To manufacture a wafer level stack package, first and second wafers having first and second via patterns are prepared. The second wafer is attached to the first wafer such that the front sides of the first and second wafers face each other and the first and second via patterns are connected to each other. The back side of the second wafer is ground and etched such that the lower ends of the second via patterns are exposed and projected. The back side of the first wafer is ground and etched such that the lower ends of the first via patterns are exposed and projected. A chip level stack structure is formed by sawing a wafer level stack structure having the stacked wafers into a chip level. The chip level stack structure is attached to a substrate having electrode terminals.
摘要:
An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.