Group III nitride semiconductor light-emitting device
    81.
    发明授权
    Group III nitride semiconductor light-emitting device 有权
    III族氮化物半导体发光器件

    公开(公告)号:US08829545B2

    公开(公告)日:2014-09-09

    申请号:US12119015

    申请日:2008-05-12

    IPC分类号: H01L33/00

    CPC分类号: H01L33/32

    摘要: A group III nitride semiconductor light-emitting device comprises an n-type gallium nitride-based semiconductor layer, a first p-type AlXGa1-XN (0≦X

    摘要翻译: III族氮化物半导体发光器件包括n型氮化镓基半导体层,第一p型AlXGa1-XN(0&lt; NlE; X <1)层,包含InGaN层的有源层, 和第三p型AlZGa1-XN层(0&amp; nlE; Z&lt; EL; Y&lt; NlE; X <1)和与第三p型AlZGa1相接触的p电极的第二p型AlYGa1-YN(0&nlE; Y& -ZN层。 有源层设置在n型氮化镓基半导体层和第一p型AlXGa1-XN层之间。 在第一p型AlXGa1-XN层上设置第二p型AlYGa1-YN(0&nlE; Y&nlE; X <1)层。 第二p型AlYGa1-YN层的p型掺杂剂浓度大于第一p型AlXGa1-XN层的p型掺杂剂浓度。 在第二p型AlYGa1-YN层上设置第三p型AlZGa1-ZN层(0&nlE; Z&lt; Y; ​​Y&nlE; X <1)。 第二p型AlYGa1-YN层的p型掺杂剂浓度大于第三p型AlZGa1-ZN层的p型掺杂剂浓度。

    Nitride semiconductor light emitting device
    88.
    发明授权
    Nitride semiconductor light emitting device 失效
    氮化物半导体发光器件

    公开(公告)号:US08513684B2

    公开(公告)日:2013-08-20

    申请号:US13294034

    申请日:2011-11-10

    IPC分类号: H01L33/00

    摘要: A nitride semiconductor light emitting device is provided. A core semiconductor region, a first cladding region, and a second cladding region are mounted on a nonpolar primary surface of a support substrate of GaN which is not the polar plane. The core semiconductor region includes an active layer and a carrier block layer. The first cladding region includes an n-type AlGaN cladding layer and an n-type InAlGaN cladding layer. The n-type InAlGaN cladding layer is provided between the n-type AlGaN cladding layer and the active layer. A misfit dislocation density at an interface is larger than that at an interface. The AlGaN cladding layer is lattice-relaxed with respect to the GaN support substrate and the InAlGaN cladding layer is lattice-relaxed with respect to the AlGaN cladding layer.

    摘要翻译: 提供一种氮化物半导体发光器件。 核心半导体区域,第一包层区域和第二包层区域安装在不是极平面的GaN的支撑衬底的非极性主表面上。 核心半导体区域包括有源层和载流子阻挡层。 第一包层区域包括n型AlGaN包覆层和n型InAlGaN包覆层。 n型InAlGaN包层设置在n型AlGaN包层和有源层之间。 界面处的错配位错密度大于界面处的位错密度。 AlGaN包层相对于GaN支撑衬底是晶格弛豫的,并且InAlGaN包层相对于AlGaN包层是晶格弛豫的。

    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
    89.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20130181226A1

    公开(公告)日:2013-07-18

    申请号:US13822591

    申请日:2011-07-06

    IPC分类号: H01L29/778 H01L29/66

    摘要: There are provided a semiconductor device in which a drain leak current can be reduced in the transistor operation while high vertical breakdown voltage is achieved and a method for producing the semiconductor device. In the semiconductor device, an opening 28 that extends from an n+-type contact layer 8 and reaches an n-type drift layer 4 through a p-type barrier layer 6 is formed. The semiconductor device includes a regrown layer 27 located so as to cover portions of the p-type barrier layer 6 and the like that are exposed to the opening, the regrown layer 27 including an undoped GaN channel layer 22 and a carrier supply layer 26; an insulating layer 9 located so as to cover the regrown layer 27; and a gate electrode G located on the insulating layer 9. In the p-type barrier layer, the Mg concentration A (cm−3)and the hydrogen concentration B (cm−3) satisfy 0.1

    摘要翻译: 提供了一种半导体器件,其中在实现高的垂直击穿电压的同时,在晶体管操作中可以减小漏极漏电流,以及制造半导体器件的方法。 在半导体器件中,形成从n +型接触层8延伸并通过p型阻挡层6到达n型漂移层4的开口28。 半导体器件包括再生长层27,其被覆盖以覆盖暴露于开口的p型阻挡层6等的部分,再生长层27包括未掺杂的GaN沟道层22和载流子供给层26; 定位成覆盖再生长层27的绝缘层9; 和位于绝缘层9上的栅电极G.在p型阻挡层中,Mg浓度A(cm-3)和氢浓度B(cm-3)满足0.1

    Gallium nitride based semiconductor light-emitting device and method for fabricating the same, gallium nitride based light-emitting diode, epitaxial wafer, and method for fabricating gallium nitride light-emitting diode
    90.
    发明授权
    Gallium nitride based semiconductor light-emitting device and method for fabricating the same, gallium nitride based light-emitting diode, epitaxial wafer, and method for fabricating gallium nitride light-emitting diode 失效
    氮化镓系半导体发光元件及其制造方法,氮化镓系发光二极管,外延晶片及氮化镓系发光二极管的制造方法

    公开(公告)号:US08488642B2

    公开(公告)日:2013-07-16

    申请号:US13082101

    申请日:2011-04-07

    IPC分类号: H01S5/00 H01S5/02

    摘要: Provided is a gallium nitride based semiconductor light-emitting device with a structure capable of enhancing the degree of polarization. A light-emitting diode 11a is provided with a semiconductor region 13, an InGaN layer 15 and an active layer 17. The semiconductor region 13 has a primary surface 13a having semipolar nature, and is made of GaN or AlGaN. The primary surface 13a of the semiconductor region 13 is inclined at an angle α with respect to a plane Sc perpendicular to a reference axis Cx which extends in a direction of the [0001] axis in the primary surface 13a. The thickness D13 of the semiconductor region 13 is larger than the thickness DInGaN of the InGaN layer 17, and the thickness DInGaN of the InGaN layer 15 is not less than 150 nm. The InGaN layer 15 is provided directly on the primary surface 13a of the semiconductor region 13 and is in contact with the primary surface 13a. The active layer 17 is provided on a primary surface 15a of the InGaN layer 15 and is in contact with this primary surface 15a. The active layer 17 includes well layers 21 of InGaN.

    摘要翻译: 提供了具有能够提高极化度的结构的氮化镓系半导体发光元件。 发光二极管11a设置有半导体区域13,InGaN层15和有源层17.半导体区域13具有半极性的主表面13a,并且由GaN或AlGaN制成。 半导体区域13的主表面13a相对于垂直于在主表面13a中的[0001]轴方向延伸的参考轴线Cx的平面Sc倾斜角度α。 半导体区域13的厚度D13大于InGaN层17的厚度DInGaN,并且InGaN层15的厚度DInGaN不小于150nm。 InGaN层15直接设置在半导体区域13的主表面13a上并与主表面13a接触。 有源层17设置在InGaN层15的主表面15a上并与该主表面15a接触。 有源层17包括InGaN的阱层21。