摘要:
The current paths of a plurality of floating gate type MOSFETs are series-connected to form a series circuit. The series circuit is connected at one end to receive a reference voltage, and is connected to data programming and readout circuit. In the data programming mode, electrons are discharged from the floating gate to the drain of the MOSFET or holes are injected into the drain into the floating gate. The data readout operation is effected by checking whether current flows from the other end to the one end of the series circuit or not.
摘要:
The current paths of a plurality of floating gate type MOSFETs are series-connected to form a series circuit. The series circuit is connected at one end to receive a reference voltage, and is connected to data programming and readout circuit. In the data programming mode, electrons are discharged from the floating gate to the drain of the MOSFET or holes are injected into the drain into the floating gate. The data readout operation is effected by checking whether current flows from the other end to the one end of the series circuit or not.
摘要:
The current paths of a plurality of floating gate type MOSFETs are series-connected to form a series circuit. The series circuit is connected at one end to receive a reference voltage, and is connected to data programming and readout circuit. In the data programming mode, electrons are discharged from the floating gate to the drain of the MOSFET or holes are injected into the drain into the floating gate. The data readout operation is effected by checking whether current flows from the other end to the one end of the series circuit or not.
摘要:
A semiconductor integrated circuit which is protected from element breakdown includes a memory cell, series-connected first and second program load transistors arranged between the memory cell and the program power source, a boosting circuit for outputting a board voltage higher than the voltage of a program power source, and a controller. The controller applies the boosted voltage to the gates of the first and second program load transistors when program data is set at a first logic level. The controller applies a voltage of about 0 V to the gate of the first program load transistor and an intermediate voltage lower than the voltage of the program power source and higher than 0 V to the gate of the second load transistor when the program data is set at a second logic level.
摘要:
A semiconductor memory device has a memory circuit with a plurality of memory cells, a data transmission line for transmitting the data from the memory circuit, and a data detection circuit for detecting the memory data supplied through the data transmission line. The data detection circuit produces output data in accordance with the direction of change in logic level of the memory data supplied through the data transmission line.
摘要:
A programming circuit used with a semiconductor memory comprising normal as well as spare memory cells allows any of the normal memory cells to be replaced by a spare memory cell and includes a fuse and a MOSFET connected in series between first and second power supply terminals. A voltage signal at the junction between the fuse and the MOSFET is delivered to the gate of the MOSFET after being delayed after power is supplied.
摘要:
In a welded structure and welded pipe, having members joined to each other by welding wherein, at least one of the members is formed of Fe—Ni-base low thermal expansion coefficient alloy, there is provided a welded structure and welded pipe having a weld metal free from cracking and achieving an excellent toughness and stress corrosion cracking resistance. Further, a welding material is provided which can form such a weld metal and is excellent in workability and weldability in fabrication. The weld metal comprises, on the weight % basis, Ni: 30 to 45%, Co: 0 to 10%, C: 0.03 to 0.5%, Mn: 0.7% or less, either one of or the total of Nb and Zr: 0.05 to 4%, and rare earth element: 0 to 0.5%, with impurities being P: 0.02% or less, Al: 0.01% or less, and oxygen: 0.01% or less, wherein each of Si and S satisfies the following formulas {circle around (1)} and {circle around (2)}, where each element symbol in the following formulas {circle around (1)} and {circle around (2)} indicates the content (weight %) of each element. Si≦0.1(Nb+Zr)+0.05% {circle around (1)} S≦0.0015(Nb+Zr)+0.0055% {circle around (2)}
摘要翻译:在焊接结构和焊接管中,具有通过焊接彼此接合的构件,其中至少一个构件由Fe-Ni基低热膨胀系数合金形成,提供焊接结构和焊接管,其具有焊接 金属无裂纹,具有优异的韧性和应力腐蚀开裂性。 此外,提供了可以形成这种焊接金属的焊接材料,并且加工性和制造中的可焊接性优异。 焊接金属以重量%计含有:Ni:30〜45%,Co:0〜10%,C:0.03〜0.5%,Mn:0.7%以下,Nb和Zr: 0.05〜4%,稀土元素:0〜0.5%,杂质为P:0.02%以下,Al:0.01%以下,氧:0.01%以下,Si和S分别满足下式 {round around(1和{circle around(2,where each element symbol in the following formula {circle around(1 and {circle around(2表示每个元素的含量(重量%))。
摘要:
In a non-volatile semiconductor memory, a large current can be flowed through the memory cell during reading. The number of the column lines can be reduced. The electron injection to the floating gates of the respective memory cells is averaged to reduce the dispersion of the threshold voltages thereof. The electron emission from the floating gates of the respective memory cells is also averaged to reduce the dispersion of the threshold voltages thereof. An increase in chip size due to latch circuits can be prevented. By noting that either of a plurality of “0” or “1” of the binary data are stored much in the memory cells of the memory cell bundle or block, a negative threshold voltage is allocated to the memory cells for storing the more bit side data of the binary data. A single column line is used in common for the two adjacent memory blocks. To inject electrons to the floating gates of the memory cells, voltage is increased gradually and stopped when electrons have been injected up to a predetermined injection rate. Electrons are once emitted from the floating gates, and thereafter the electrons are injected again to store one of a binary data. Further, the data latch circuits can be formed at any positions remote from the memory cell array.
摘要:
In a non-volatile semiconductor memory, a large current can be flowed through the memory cell during reading. The number of the column lines can be reduced. The electron injection to the floating gates of the respective memory cells is averaged to reduce the dispersion of the threshold voltages thereof. The electron emission from the floating gates of the respective memory cells is also averaged to reduce the dispersion of the threshold voltages thereof. An increase in chip size due to latch circuits can be prevented. By noting that either of a plurality of “0” or “1” of the binary data are stored much in the memory cells of the memory cell bundle or block, a negative threshold voltage is allocated to the memory cells for storing the more bit side data of the binary data. A single column line is used in common for the two adjacent memory blocks. To inject electrons to the floating gates of the memory cells, voltage is increased gradually and stopped when electrons have been injected up to a predetermined injection rate. Electrons are once emitted from the floating gates, and thereafter the electrons are injected again to store one of a binary data. Further, the data latch circuits can be formed at any positions remote from the memory cell array.
摘要:
The current paths of a plurality of floating gate type MOSFETs are series-connected to form a series circuit. The series circuit is connected at one end to receive a reference voltage, and is connected to data programming and readout circuit. In the data programming mode, electrons are discharged from the floating gate to the drain of the MOSFET or holes are injected into the drain into the floating gate. The data readout operation is effected by checking whether current flows from the other end to the one end of the series circuit or not.