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公开(公告)号:US10770545B2
公开(公告)日:2020-09-08
申请号:US16314788
申请日:2016-08-30
Applicant: Intel Corporation
Inventor: Hubert C. George , Ravi Pillarisetty , Jeanette M. Roberts , Nicole K. Thomas , James S. Clarke
IPC: H01L29/06 , H01L29/66 , H01L29/778 , H01L29/10 , H01L29/423 , H01L29/76 , H01L29/165 , H01L29/12 , B82Y10/00 , B82Y40/00 , H01L29/16 , G06N10/00 , H01L29/82
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack; an insulating material disposed above the quantum well stack, wherein the insulating material includes a trench; and a gate metal disposed on the insulating material and extending into the trench.
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公开(公告)号:US10763347B2
公开(公告)日:2020-09-01
申请号:US16349955
申请日:2016-12-14
Applicant: Intel Corporation
Inventor: Payam Amin , Nicole K. Thomas , James S. Clarke , Jessica M. Torres , Ravi Pillarisetty , Hubert C. George , Kanwaljit Singh , Van H. Le , Jeanette M. Roberts , Roman Caudillo , Zachary R. Yoscovits , David J. Michalak
IPC: H01L29/775 , G06N10/00 , H01L21/02 , H01L29/12 , H01L29/165 , H01L29/66 , H01L29/06 , H01L29/76 , H01L29/423 , H01L29/40 , B82Y10/00 , B82Y40/00 , H01L29/778 , H01L29/82
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum processing device may include: a quantum well stack having alternatingly arranged relaxed and strained layers; and a plurality of gates disposed above the quantum well stack to control quantum dot formation in the quantum well stack.
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公开(公告)号:US20200258984A1
公开(公告)日:2020-08-13
申请号:US16274572
申请日:2019-02-13
Applicant: Intel Corporation
Inventor: Hubert C. George , Ravi Pillarisetty , Lester Lampert , James S. Clarke , Nicole K. Thomas , Stephanie A. Bojarski , Roman Caudillo , David J. Michalak , Jeanette M. Roberts , Thomas Francis Watson
Abstract: Disclosed herein are quantum dot devices with conductive liners, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include a base, a first fin extending from the base, a second fin extending from the base, a conductive material between the first fin and the second fin, and a dielectric material between the conductive material and the first fin.
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公开(公告)号:US10741664B2
公开(公告)日:2020-08-11
申请号:US16097432
申请日:2016-06-08
Applicant: Intel Corporation
Inventor: Ravi Pillarisetty , Jeanette M. Roberts , Hubert C. George , James S. Clarke , Nicole K. Thomas
IPC: H01L29/66 , H01L29/778 , H01L29/165 , H01L29/423 , H01L29/76 , H01L29/06 , H01L29/12 , H01L29/78 , B82Y10/00 , B82Y40/00
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack; a plurality of first gates disposed on the quantum well stack; a plurality of pairs of spacers, each pair of spacers disposed on opposites sides of an associated first gate, wherein each spacer in a pair has a curved surface that curves away from the associated first gate; and a plurality of second gates disposed on the quantum well stack, wherein the curved surface of each spacer is adjacent to one of the second gates such that at least a portion of each second gate is shaped complementarily to the curved surface of an adjacent spacer.
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公开(公告)号:US20200212210A1
公开(公告)日:2020-07-02
申请号:US16648402
申请日:2017-12-21
Applicant: Intel Corporation
Inventor: Ravi Pillarisetty , Nicole K. Thomas , Hubert C. George , Jeanette M. Roberts , Payam Amin , Zachary R. Yoscovits , Roman Caudillo , James S. Clarke
IPC: H01L29/778 , H01L29/76 , H01L29/82 , H01L29/12 , H01L29/165 , H01L29/66 , H01L21/321 , H01L21/8234
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a base; a fin extending away from the base, wherein the fin includes a quantum well layer; an insulating material at least partially above the fin, wherein the insulating material includes a trench above the fin; and a gate metal on the insulating material and extending into the trench.
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公开(公告)号:US20190252536A1
公开(公告)日:2019-08-15
申请号:US16143676
申请日:2018-09-27
Applicant: Intel Corporation
Inventor: Hubert C. George , Ravi Pillarisetty , Lester Lampert , James S. Clarke , Nicole K. Thomas , Roman Caudillo , Kanwaljit Singh , David J. Michalak , Jeanette M. Roberts
IPC: H01L29/778 , H01L29/51 , H01L29/49 , H01L27/02 , H01L29/15
CPC classification number: H01L29/7782 , G06N10/00 , H01L23/5383 , H01L27/0255 , H01L29/15 , H01L29/4966 , H01L29/517
Abstract: A quantum dot device is disclosed that includes a fin and a gate above the fin. The fin may extend away from a base and include a quantum well stack in which one or more quantum dots may be formed during operation of the quantum dot device. The gate may include a gate electrode material having a first portion and a second portion, where the first portion is above the quantum well stack and the second portion is a portion that is not above the quantum well stack and is separated from the base by an insulating material. The quantum dot device may further include a metal structure between the second portion of the gate electrode material and the base, forming a portion of a diode provided in series with the gate, which diode may provide at least some ESD protection for the quantum dot device.
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公开(公告)号:US20190229188A1
公开(公告)日:2019-07-25
申请号:US16316971
申请日:2016-08-10
Applicant: Intel Corporation
Inventor: James S. Clarke , Robert L. Bristol , Ravi Pillarisetty , Jeanette M. Roberts , Hubert C. George , Nicole K. Thomas
IPC: H01L29/12 , H01L29/423 , H01L29/66 , H01L29/80 , H01L29/82 , H01L29/06 , H01L29/165 , H01L29/778
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack including a quantum well layer; and a plurality of gates disposed above the quantum well stack, wherein individual ones of the plurality of gates have a footprint shape with two opposing linear faces and two opposing curved faces.
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公开(公告)号:US10361353B2
公开(公告)日:2019-07-23
申请号:US15891518
申请日:2018-02-08
Applicant: Intel Corporation
Inventor: Hubert C. George , Zachary R. Yoscovits , Nicole K. Thomas , Lester Lampert , James S. Clarke , Jeanette M. Roberts , Ravi Pillarisetty , David J. Michalak , Kanwaljit Singh , Roman Caudillo
IPC: H01L29/06 , H01L39/14 , H01L39/22 , H01L29/12 , H01L29/15 , H01L29/423 , H01L29/40 , H01L39/24 , G06N10/00 , H01L25/16 , H01L23/00 , H01L23/498
Abstract: Disclosed herein are fabrication techniques for providing metal gates in quantum devices, as well as related quantum devices. For example, in some embodiments, a method of manufacturing a quantum device may include providing a gate dielectric over a qubit device layer, providing over the gate dielectric a pattern of non-metallic elements referred to as “gate support elements,” and depositing a gate metal on sidewalls of the gate support elements to form a plurality of gates of the quantum device.
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公开(公告)号:US20190206992A1
公开(公告)日:2019-07-04
申请号:US16314788
申请日:2016-08-30
Applicant: Intel Corporation
Inventor: Hubert C. George , Ravi Pillarisetty , Jeanette M. Roberts , Nicole K. Thomas , James S. Clarke
IPC: H01L29/06 , H01L29/165 , H01L29/10 , H01L29/423 , H01L29/76 , H01L29/778 , H01L29/66 , G06N10/00
Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack; an insulating material disposed above the quantum well stack, wherein the insulating material includes a trench; and a gate metal disposed on the insulating material and extending into the trench.
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公开(公告)号:US20190194016A1
公开(公告)日:2019-06-27
申请号:US16329676
申请日:2016-09-29
Applicant: Intel Corporation
Inventor: Jeanette M. Roberts , Ravi Pillarisetty , Nicole K. Thomas , Hubert C. George , James S. Clarke , Adel A. Elsherbini
IPC: B82Y10/00 , H01L23/538 , H01L25/065 , H01L29/12 , H01L29/423 , H01L29/66 , H01L29/76
CPC classification number: B82Y10/00 , H01L23/538 , H01L23/5383 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0655 , H01L29/0673 , H01L29/12 , H01L29/127 , H01L29/165 , H01L29/423 , H01L29/42376 , H01L29/66977 , H01L29/7613 , H01L2224/13101 , H01L2224/16225 , H01L2224/81203 , H01L2224/81815 , H01L2924/15192 , H01L2924/15311 , H01L2924/014 , H01L2924/00014
Abstract: Disclosed herein are quantum computing assemblies, as well as related computing devices and methods. For example, in some embodiments, a quantum computing assembly may include: a quantum device die to generate a plurality of qubits; a control circuitry die to control operation of the quantum device die; and a substrate; wherein the quantum device die and the control circuitry die are disposed on the substrate.
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