摘要:
A thin film transistor array (TFT) substrate and a method for manufacturing the same are provided. The manufacturing method needs only or even less than six mask processes for manufacturing the TFT array substrate integrated with a color filter pattern. Therefore, the manufacturing method is simpler and the manufacturing cost is reduced. In addition, the manufacturing method needs not to form a contact window in a relative thick film layer such as a planarization layer or a color filter layer, so as to connect the pixel electrode to the source/drain, thus the difficulty of the manufacturing process is effectively reduced.
摘要:
A color filter includes a transparent substrate, a black matrix formed on the transparent substrate, a plurality of banks superposed on the black matrix, and a color layer formed of R, G and B color portions. The black matrix defines a plurality of sub-pixels of the color filter. The banks and the black matrix enclose a plurality of spaces for respectively accommodating the R, G and B color portions. Wherein, a plurality of groups is defined, each group includes a plurality of sub-pixels of concolorous color portions, at least one channel is formed on the bank between adjacent sub-pixels of concolorous color portions in the group. In a manufacturing method for the color filter, the ink can flow over between the adjacent sub-pixels in a defined group and level through the channel, thus the uniformity of the color portions can be improved.
摘要:
A method for programming a P-channel EEPROM having an N-well, a floating gate, a control gate, a P-type source region and a P-type drain region is provided. In the method, the N-well is grounded, a first positive voltage is applied to the control gate, a second positive voltage or a programming current is applied to the P-type source region, and a negative voltage is applied to the P-type drain region.
摘要:
A method for programming a single-poly EPROM cell at relatively low operation voltages (±Vcc) is disclosed. According to this invention, the single-poly EPROM cell includes a P-channel floating-gate transistor formed on an N well of a P type substrate, and an N-channel coupling device. The P-channel floating-gate transistor has a P+ doped drain, P+ doped source, a P channel defined between the P+ doped drain and P+ doped source, a tunnel oxide layer on the P channel, and a floating doped poly gate disposed on the tunnel oxide layer. The N-channel coupling device includes a floating poly electrode, which is electrically connected to the floating doped poly gate of the P-channel floating-gate transistor, and is capacitively coupled to a control region doped in the P type substrate.
摘要:
A self-aligned contact method includes, firstly, forming a plurality of stack structures on a semiconductor substrate. The stack structures separate each other and each has a first polysilicon layer, an insulating layer on the first polysilicon layer and a second polysilicon layer on the insulating layer. Secondly, a spacer forms on the sidewall of the stack structures, and then a dielectric layer is formed on the stack structures, the spacers and the semiconductor substrate. Finally, the portion of the second polysilicon layer is used as a buffer for forming a contact window by removing a portion of the dielectric layer. The contact window is located between two stack structures.
摘要:
A method for molding a molded substance to a substrate is provided. A substrate connected to a fixing portion by a connecting portion is prepared. The substrate is placed in a mold, wherein a portion of the fixing portion is protruding from the mold. The fixing portion is fixed by a fixing device outside the mold. Then, the molded substance covering the substrate is formed within the mold.
摘要:
A method for forming a concave bottom oxide layer in a trench, comprising: providing a semiconductor substrate; forming a pad oxide layer on the semiconductor substrate; forming a silicon nitride layer on the pad oxide layer; etching the silicon nitride layer, the pad oxide layer and the semiconductor substrate to form the trench in the semiconductor substrate; depositing a silicon oxide layer to refill into the trench and cover on the silicon nitride layer, wherein the silicon oxide layer has overhang portions at corners of the trench; anisotropically etching the silicon oxide layer to form a concave bottom oxide layer in the trench; etching the silicon oxide layer to remove the silicon oxide layer on the silicon nitride layer and the sidewalls of the trench; removing the silicon nitride layer and the pad oxide layer.
摘要:
A method of forming a field oxide isolation region includes: forming a first pad oxide layer over a semiconductor substrate; forming a silicon nitride layer over the first pad oxide layer; patterning and etching the silicon nitride layer and the first pad oxide layer to expose a portion of the substrate, and simultaneously forming an undercut cavity; forming a second pad oxide layer over the exposed portion of the substrate; depositing a layer of polysilicon over the second pad oxide layer, the polysilicon layer filling the undercut cavity to form a polysilicon plug; removing portions of the polysilicon layer to form a polysilicon spacer; thermally oxidizing the substrate to substantially consume the polysilicon spacer but leave a polysilicon residual of the polysilicon plug, the thermal oxidation forming a thick oxide above the exposed portion of the substrate; substantially removing the silicon nitride layer; applying a first etching solution to the first pad oxide layer and the polysilicon residual, the first etching solution providing selective etching of the first pad oxide layer and the polysilicon residual so that the polysilicon residual is substantially removed and the first pad oxide layer is partially removed leaving a first pad oxide layer residual; and applying a second etching solution to remove the first pad oxide layer residual, thereby leaving the thick oxide to form the isolation region.
摘要:
The present invention relates to a method for removing a first dielectric layer of a semiconductor wafer. The first dielectric layer is formed on the surface of a second dielectric layer of the semiconductor wafer. The method comprises performing a chemical mechanical polishing (CMP) process on the first dielectric layer to remove a predetermined thickness of the first dielectric layer, measuring the remaining thickness of the first dielectric layer, providing an etching table having a plurality of thickness ranges of the remaining first dielectric layer and corresponding etching back procedure or parameters of each of the thickness ranges, and performing an etching back process to horizontally remove the remaining first dielectric layer according to the etching back procedure or parameters of the thickness range corresponding to the measured thickness of the remaining first dielectric layer.
摘要:
An improved exhaust line of a chemical-mechanical polisher will improve polishing performance. A chemical-mechanical polisher is in a polishing chamber, wherein the chemical-mechanical polisher contains a polishing table, a plurality of polishing pads on the polishing table, and a plurality of outlets on the polishing table. A plurality of exhaust lines is connected with the plurality of the outlets, wherein the exhaust lines are used to drive out exhaust gas and sewage generated in the polishing chamber. At least a gas-liquid separating device is connected with the plurality of the exhaust lines, wherein the gas-liquid separating device is used for separation of the exhaust and the sewage. The gas-liquid separating device comprises a sewage collector, a filter, a pump, and a sewage-collecting device. The sewage collector is connected with the plurality of the outlets, wherein the sewage collector is used for collecting the exhaust gas and the sewage driven out through the plurality of outlets. The filter is connected with the top of the gas-liquid separating device. The pump is connected with the filter. The sewage-collecting device is connected with the bottom of the gas-liquid separating device, wherein the sewage-collecting device is used for collecting the sewage.