摘要:
A semiconductor device capable of operating at a high speed or of having many functions. In this device, delamination of buried electrodes is prevented and thus high reliability is offered. The depth A of contact holes, the minimum linewidth R of a lower metallization layer, and the thickness B of the lower metallization layer satisfy relations given by (0.605/R)0.5
摘要:
In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by pressing a testing structure provided with electrically independent projections having a number equal to a number of conductor portions to be tested formed on an area to be tested of a body to be tested to the body to be tested.
摘要:
In forming an electrode 2 on a silicon oxide film 5 on a semiconductor substrate 4 through a silicon oxide film 5, for example, the gate electrode 2 is structured in a laminated structure of a plurality of polycrystalline silicon layers 6. The portion of the gate electrode 2 is formed by a method of manufacturing a thin film having a process of depositing amorphous layers and a process of crystallizing (recrystallizing) this amorphous material. In this case, depositing of the amorphous layers is carried out dividedly by a plurality of times so that the thickness of an amorphous layer to be deposited at one time is not larger than a thickness to be prescribed by a critical stress value determined according to a fail event, the amorphous material is crystallized after each process of depositing each amorphous layer has been finished, and the process of depositing amorphous layers and the process of crystallizing the amorphous material are repeated, whereby a laminated structure of the polycrystalline layer 6 having a necessary film thickness is obtained. With the above-described arrangement, it is possible to prevent a deterioration of electric characteristics of a semiconductor device and an occurrence of a defect, such as a peeling off between layers, cracks in a layer, etc., and it is possible to obtain a polycrystalline layer of small grain size in a desired film thickness by a lamination of polycrystalline materials.
摘要:
A semiconductor device capable of operating at a high speed or of having many functions. In this device, delamination of buried electrodes is prevented and thus high reliability is offered. The depth A of contact holes, the minimum linewidth R of a lower metallization layer, and the thickness B of the lower metallization layer satisfy relations given by (0.605/R)0.5
摘要:
A portable video camera of the type having a taking lens and an electronic video imaging device comprises a camera body incorporating the electronic video imaging device therein, a handgrip turnably mounted on one side wall of the camera body, and a view finder, electronic or optical, structurally integral with the handgrip for viewing an image of a subject therethrough. Being changeable in position according to camera angles, the action finder can be brought into alignment with an eye of the operator in any shooting angle.
摘要:
A piezoresistive strain sensing device is comprised of a semiconductor single-crystal substrate, having crystal indices in the (100) phase, and having p-type and n-type diffused resistors formed therein. A diffused resistance gauge is formed of the p-type and n-type resistors. Temperature compensation means are formed adjacent the resistance gauge in the substrate.
摘要:
A problem of a resist mask collapse due to a plasma process is solved. In a method of manufacturing a semiconductor device including steps of a plasma process to a sample having a mask made of an organic material, the plasma process includes a first step of a plasma process under a gas containing any of fluorine, oxygen, or nitrogen, or containing all of them, and a second step of the plasma process under a gas containing a rare gas without containing any of fluorine, oxygen, and nitrogen, and the first step and the second step are repeated.
摘要:
[Problems]A laser beam irradiation apparatus which can accurately perform a linear welding with a uniform width on an irradiation portion even if the overlap ratio is lowered is provided.[Means for Solving the Problems]A laser beam irradiation apparatus includes laser beam generation means for emitting a laser beam, an optical fiber for transmitting the laser beam incident on an input side face to an output side face, an incident optical unit for introducing the laser beam emitted from the laser beam generation means to the input side face of the optical fiber, and an emission optical unit for applying the laser beam emitted from the output side face of the optical fiber to an irradiation portion, wherein the core cross section of the optical fiber is formed to be rectangular, preferably oblong, throughout the optical fiber or in a range at a predetermined distance from the output side face, and the length of the range where the core cross section is rectangular is preferably set to 3 m or above.
摘要:
Provided, is a reliable semiconductor device with a layered interconnect structure that may develop no trouble of voids and interconnect breakdowns, in which the layered interconnect structure comprises a conductor film and a neighboring film as so layered on a semiconductor substrate that the neighboring film is contacted with the conductor film. In the device, the materials for the conductor film and the neighboring film are so selected that the difference between the short side, ap, of the rectangular unit cells that constitute the plane with minimum free energy of the conductor film and the short side, an, of the rectangular unit cells that constitute the plane with minimum free energy of the neighboring film, {|ap−an|/ap}×100=A (%) and the difference between the long side, bp, of the rectangular unit cells that constitute the plane with minimum free energy of the conductor film and the long side, bn, of the rectangular unit cells that constitute the plane with minimum free energy of the neighboring film, {|bp−bn|/bp}×100=B (%) satisfy an inequality of {A+B×(ap/bp)}
摘要:
An optical device includes: a first optical member having a light-exit end at which light exits the first optical member; a second optical member having a light-entrance end which abuts the light-exit end through a protective medium and from which the light enters the second optical member; and the protective medium which is arranged between the light-exit end and the light-entrance end, and suppresses fixing together of the light-exit end and the light-entrance end. Specifically, the protective medium is transparent and arranged between the light-exit end and the light-entrance end, and is reusable even after the light-exit end and the light-entrance end are pressed together with a pressure of approximately 0.5 or 1 kgf and are then separated from each other.