High Density Split-Gate Memory Cell
    81.
    发明申请
    High Density Split-Gate Memory Cell 审中-公开
    高密度分离栅极存储单元

    公开(公告)号:US20160217849A1

    公开(公告)日:2016-07-28

    申请号:US15002302

    申请日:2016-01-20

    Abstract: A method of forming a memory device that includes forming on a substrate, a first insulation layer, a first conductive layer, a second insulation layer, a second conductive layer, a third insulation layer. First trenches are formed through third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer, leaving side portions of the first conductive layer exposed. A fourth insulation layer is formed at the bottom of the first trenches that extends along the exposed portions of the first conductive layer. The first trenches are filled with conductive material. Second trenches are formed through the third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer. Drain regions are formed in the substrate under the second trenches. A pair of memory cells results, with a single continuous channel region extending between drain regions for the pair of memory cells.

    Abstract translation: 一种形成存储器件的方法,包括在衬底上形成第一绝缘层,第一导电层,第二绝缘层,第二导电层,第三绝缘层。 第一沟槽通过第三绝缘层,第二导电层,第二绝缘层和第一导电层形成,从而使第一导电层的侧面部分露出。 第一绝缘层形成在沿第一导电层的暴露部分延伸的第一沟槽的底部。 第一个沟槽填充有导电材料。 第二沟槽通过第三绝缘层,第二导电层,第二绝缘层和第一导电层形成。 在第二沟槽下的衬底中形成漏区。 导致一对存储单元,其中单个连续沟道区域在用于该对存储单元的漏极区域之间延伸。

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