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公开(公告)号：US12264362B2
公开(公告)日：2025-04-01
申请号：US18353603
申请日：2023-07-17
Inventor： Allen Timothy Chang , Yi-Hsien Chang , Chun-Ren Cheng
IPC: C12Q1/6869 , B01F33/302 , B01F33/3031 , B01L3/00 , G01N21/03 , G01N21/05 , G01N21/64 , G01N27/447 , G02B6/122
Abstract: An integrated semiconductor device for manipulating and processing bio-entity samples and methods are described. The device includes a lower substrate, at least one optical signal conduit disposed on the lower substrate, at least one cap bonding pad disposed on the lower substrate, a cap configured to form a capped area, and disposed on the at least one cap bonding pad, a fluidic channel, wherein a first side of the fluidic channel is formed on the lower substrate and a second side of the fluidic channel is formed on the cap, a photosensor array coupled to sensor control circuitry, and logic circuitry coupled to the fluidic control circuitry, and the sensor control circuitry.
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公开(公告)号：US12227410B2
公开(公告)日：2025-02-18
申请号：US18404922
申请日：2024-01-05
Inventor： Po Chen Yeh , Yi-Hsien Chang , Fu-Chun Huang , Ching-Hui Lin , Chiahung Liu , Shih-Fen Huang , Chun-Ren Cheng
Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.
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83.发明申请公开(公告)号：US20240373753A1
公开(公告)日：2024-11-07
申请号：US18772399
申请日：2024-07-15
Inventor： Alexander Kalnitsky , Chun-Ren Cheng , Chi-Yuan Shih , Kai-Fung Chang , Shih-Fen Huang , Yi-Chuan Teng , Yi Heng Tsai , You-Ru Lin , Yan-Jie Liao
IPC: H10N30/00 , G01N25/58 , H10N30/04 , H10N30/067 , H10N30/87 , H10N30/063
Abstract: In some embodiments, a piezoelectric device is provided. The piezoelectric device includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A heating element is disposed over the semiconductor substrate. The heating element is configured to heat the piezoelectric structure to a recovery temperature for a period of time, where heating the piezoelectric structure to the recovery temperature for the period of time improves a degraded electrical property of the piezoelectric device.
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公开(公告)号：US20240324463A1
公开(公告)日：2024-09-26
申请号：US18679537
申请日：2024-05-31
Inventor： Ching-Hui Lin , Chun-Ren Cheng , Shih-Fen Huang , Fu-Chun Huang
CPC classification number: H10N30/302 , G01N27/4141 , H10N30/05 , H10N30/08 , H10N30/878 , H10N30/88
Abstract: In some embodiments, a piezoelectric biosensor is provided. The piezoelectric biosensor includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A sensing reservoir is disposed over the piezoelectric structure and exposed to an ambient environment, where the sensing reservoir is configured to collect a fluid comprising a number of bio-entities.
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公开(公告)号：US20230357839A1
公开(公告)日：2023-11-09
申请号：US18353603
申请日：2023-07-17
Inventor： Allen Timothy Chang , Yi-Hsien Chang , Chun-Ren Cheng
IPC: C12Q1/6869 , G01N27/447 , B01L3/00 , G01N21/05 , G01N21/64 , B01F33/302 , B01F33/3031
CPC classification number: C12Q1/6869 , G01N27/44721 , G01N27/44791 , B01L3/502707 , B01L3/502792 , G01N21/05 , G01N21/6428 , B01F33/3021 , B01F33/3031 , B01L2300/0654 , B01L2300/0819 , B01L2300/0867 , B01L2300/089 , B01L2300/165 , B01L2300/168 , B01L2400/0427 , G02B6/122
Abstract: An integrated semiconductor device for manipulating and processing bio-entity samples and methods are described. The device includes a lower substrate, at least one optical signal conduit disposed on the lower substrate, at least one cap bonding pad disposed on the lower substrate, a cap configured to form a capped area, and disposed on the at least one cap bonding pad, a fluidic channel, wherein a first side of the fluidic channel is formed on the lower substrate and a second side of the fluidic channel is formed on the cap, a photosensor array coupled to sensor control circuitry, and logic circuitry coupled to the fluidic control circuitry, and the sensor control circuitry.
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Patent Agency Ranking
公开(公告)号：US20230240079A1
公开(公告)日：2023-07-27
申请号：US17834274
申请日：2022-06-07
Inventor： Chun-Ren Cheng , Ching-Hui Lin , Fu-Chun Huang , Chao-Hung Chu , Po-Chen Yeh
IPC: H01L27/11509 , H01L23/535 , H01L27/11507
CPC classification number: H01L27/11509 , H01L23/535 , H01L27/11507
Abstract: A semiconductor structure includes a first die, a second die, and an inter die via (IDV). The first die includes an interconnection structure and a CMOS device electrically connected to the interconnection structure. The second die includes a memory element including a first electrode, a ferroelectric layer on the first electrode, and a second electrode on the ferroelectric layer, wherein a peripheral region of the ferroelectric layer is exposed by and surrounding the second electrode from a top view perspective. The IDV electrically connects the interconnection structure of the first die to the memory element of the second die.
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公开(公告)号：US11702691B2
公开(公告)日：2023-07-18
申请号：US17111255
申请日：2020-12-03
Inventor： Allen Timothy Chang , Yi-Hsien Chang , Chun-Ren Cheng
IPC: C12Q1/6869 , G01N27/447 , B01L3/00 , G01N21/05 , G01N21/64 , B01F33/302 , B01F33/3031 , G02B6/122 , G01N21/03
CPC classification number: C12Q1/6869 , B01F33/3021 , B01F33/3031 , B01L3/502707 , B01L3/502792 , G01N21/05 , G01N21/6428 , G01N27/44721 , G01N27/44791 , B01L2300/0654 , B01L2300/089 , B01L2300/0819 , B01L2300/0867 , B01L2300/165 , B01L2300/168 , B01L2400/0427 , G01N2021/0325 , G01N2021/058 , G01N2021/6482 , G01N2201/08 , G02B6/122
Abstract: An integrated semiconductor device for manipulating and processing bio-entity samples and methods are described. The device includes a lower substrate, at least one optical signal conduit disposed on the lower substrate, at least one cap bonding pad disposed on the lower substrate, a cap configured to form a capped area, and disposed on the at least one cap bonding pad, a fluidic channel, wherein a first side of the fluidic channel is formed on the lower substrate and a second side of the fluidic channel is formed on the cap, a photosensor array coupled to sensor control circuitry, and logic circuitry coupled to the fluidic control circuitry, and the sensor control circuitry.
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公开(公告)号：US20220306452A1
公开(公告)日：2022-09-29
申请号：US17840892
申请日：2022-06-15
Inventor： Fan Hu , Chun-Ren Cheng , Hsiang-Fu Chen , Wen-Chuan Tai
Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a first dielectric structure disposed over a first semiconductor substrate, where the first dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the first dielectric structure and includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. A first piezoelectric anti-stiction structure is disposed between the movable mass and the first dielectric structure, wherein the first piezoelectric anti-stiction structure includes a first piezoelectric structure and a first electrode disposed between the first piezoelectric structure and the first dielectric structure
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89.发明申请公开(公告)号：US20210383972A1
公开(公告)日：2021-12-09
申请号：US17411416
申请日：2021-08-25
Inventor： Anderson Lin , Chun-Ren Cheng , Chi-Yuan Shih , Shih-Fen Huang , Yi-Chuan Teng , Yi Heng Tsai , You-Ru Lin , Yen-Wen Chen , Fu-Chun Huang , Fan Hu , Ching-Hui Lin , Yan-Jie Liao
IPC: H01G4/012 , H01G4/228 , H01G4/12 , H01L21/3213 , H01L21/311 , H01L49/02 , H01L41/113 , H01L41/083 , H01L41/047
Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.
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公开(公告)号：US10989685B2
公开(公告)日：2021-04-27
申请号：US15913642
申请日：2018-03-06
Inventor： Yi-Shao Liu , Chun-Wen Cheng , Chun-Ren Cheng
IPC: G01N27/414 , G03F7/20 , G03F7/00 , B01L3/00 , G01N33/543
Abstract: A method of sensing a biological sample includes introducing a fluid containing the biological sample through a first opening in a substrate. The method further includes passing the fluid from the first opening to a first cavity through at least one microfluidic channel. The method further includes repelling the biological sample from a first surface of the first cavity using a first surface modification layer. The method further includes attracting the biological sample to a sensing device using a plurality of modified surface patterns, wherein a first modified surface pattern of the plurality of modified surface patterns has different surface properties from a second modified surface pattern of the plurality of modified surface patterns. The method further includes outputting the fluid through a second opening in the substrate.
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