公开(公告)号：US06518650B2

公开(公告)日：2003-02-11

申请号：US09820999

申请日：2001-03-29

申请人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

发明人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

IPC分类号： H01L23495

CPC分类号： H01L23/49506 ,  H01L23/49544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.

公开(公告)号：US6091133A

公开(公告)日：2000-07-18

申请号：US38858

申请日：1998-03-11

申请人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

发明人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/12 ,  H01L23/50

CPC分类号： H01L23/49506 ,  H01L23/49544 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14

摘要： A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.

摘要翻译： 一种半导体集成电路器件及其制造方法，具有去除了管芯焊盘的常规型引线框架。 特别地，模具板被用引线指的端部支撑的一部分带替代。 将半导体管芯附着到带子上，使其可以被引线接合到引线指。 胶带包含至少一个槽，以允许由于在制造过程中经历的各种温度而导致的带的膨胀和/或收缩，使得带不会起皱或翘曲以改变模具的位置。

公开(公告)号：US06590277B1

公开(公告)日：2003-07-08

申请号：US09505058

申请日：2000-02-16

申请人： Jerrold L. King ,  Larry D. Kinsman ,  Jerry M. Brooks ,  David J. Corisis

发明人： Jerrold L. King ,  Larry D. Kinsman ,  Jerry M. Brooks ,  David J. Corisis

IPC分类号： H01L23495

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/73215 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： An LOC die assembly including a die dielectrically adhered to the under of lead frame. The adhesive is applied over a minimum cross-sectional area and number of attachment points to maximize flexure of leads extending over the active surface of the die. In this manner, flexure of the leads to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant is maximized, and the point stresses on the active surface caused by the filler particles are reduced by the lead flexure.

摘要翻译： 一个LOC模具组件，其包括一个介电粘附到引线框架下面的模具。 将粘合剂施加在最小横截面面积和附着点的数量上，以使引线在模具的有效表面上延伸的弯曲最大化。 以这种方式，使塑料密封剂的传递模塑期间引线的挠曲适应填充在引线和模具的有效表面之间的填料颗粒，由填料颗粒引起的活性表面上的点应力减小 导线弯曲。

公开(公告)号：US06215177B1

公开(公告)日：2001-04-10

申请号：US09537134

申请日：2000-03-29

申请人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

发明人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

IPC分类号： H01L2348

CPC分类号： H01L23/49506 ,  H01L23/49544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.

公开(公告)号：US6143589A

公开(公告)日：2000-11-07

申请号：US244972

申请日：1999-02-05

申请人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

发明人： David J. Corisis ,  Larry D. Kinsman ,  Jerry M. Brooks

IPC分类号： H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49506 ,  H01L23/49544 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14

摘要： A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.

公开(公告)号：US6095822A

公开(公告)日：2000-08-01

申请号：US6395

申请日：1998-01-13

申请人： David J. Corisis ,  Larry D. Kinsman ,  Walter Moden

发明人： David J. Corisis ,  Larry D. Kinsman ,  Walter Moden

IPC分类号： H01L23/32 ,  H01L25/10 ,  H05K3/30 ,  H01R9/09

CPC分类号： H01L23/32 ,  H01R12/7023 ,  H01R12/714 ,  H05K3/301 ,  H01L25/105 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A component module holder is adapted to hold a plurality of integrated circuit devices in alignment with one another in a way that enables the devices to be directly plugged to a printed circuit board. In this condition, the holder is secured to said printed circuit board with the contacts on said integrated circuit devices making contacts with appropriate contacts on the printed circuit board. This direct contact between the packaged integrated circuit device leads and a board may reduce the die bond pad to board pad stub length, improving speed. This arrangement may also allow the integrated circuit devices to be replaced and upgraded as a whole as needed. The holder may be utilized, for example, to upgrade system integrated circuit devices in computer systems by providing a plurality of connected, integrated circuit dynamic random access memory elements directly pluggable onto a computer system motherboard.

摘要翻译： 组件模块保持器适于将多个集成电路设备彼此对准，使得设备能够直接插入印刷电路板。 在这种情况下，保持器被固定到所述印刷电路板上，所述集成电路装置上的触点与印刷电路板上的适当触点接触。 封装的集成电路器件引线和电路板之间的这种直接接触可以将管芯接合焊盘减小到板焊盘短截线长度，从而提高速度。 这种安排还可以根据需要整体地替换和升级集成电路设备。 例如，可以通过提供可以直接插到计算机系统主板上的多个连接的集成电路动态随机存取存储器元件来将保持器用于例如升级计算机系统中的系统集成电路装置。

公开(公告)号：US6083777A

公开(公告)日：2000-07-04

申请号：US416369

申请日：1999-10-12

申请人： Jerrold L. King ,  Larry D. Kinsman ,  Jerry M. Brooks ,  David J. Corisis

发明人： Jerrold L. King ,  Larry D. Kinsman ,  Jerry M. Brooks ,  David J. Corisis

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/05 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/73215 ,  H01L2224/85447 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181

摘要： An LOC die assembly including a die dielectrically adhered to the underside of a lead frame. The adhesive is applied over a minimum cross-sectional area and number of attachment points to maximize flexure of leads extending over the active surface of the die. In this manner, flexure of the leads to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant is maximized, and the point stresses on the active surface caused by the filler particles are reduced by the lead flexure.

公开(公告)号：US6063650A

公开(公告)日：2000-05-16

申请号：US41520

申请日：1998-03-12

申请人： Jerrold L. King ,  Larry D. Kinsman ,  Jerry M. Brooks ,  David J. Corisis

发明人： Jerrold L. King ,  Larry D. Kinsman ,  Jerry M. Brooks ,  David J. Corisis

IPC分类号： H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/05 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/73215 ,  H01L2224/85447 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181

摘要： An LOC die assembly including a die dielectrically adhered to the underside of a lead frame. The adhesive is applied over a minimum cross-sectional area and number of attachment points to maximize flexure of leads extending over the active surface of the die. In this manner, flexure of the leads to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant is maximized, and the point stresses on the active surface caused by the filler particles are reduced by the lead flexure.

摘要翻译： 一个LOC模具组件，其包括一个介电粘附到引线框架底面的模具。 将粘合剂施加在最小横截面面积和附着点的数量上，以使引线在模具的有效表面上延伸的弯曲最大化。 以这种方式，使塑料密封剂的传递模塑期间引线的挠曲适应填充在引线和模具的有效表面之间的填料颗粒，由填料颗粒引起的活性表面上的点应力减小 导线弯曲。

公开(公告)号：US20100052086A1

公开(公告)日：2010-03-04

申请号：US12615943

申请日：2009-11-10

申请人： Larry D. Kinsman

发明人： Larry D. Kinsman

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/1469 ,  H01L31/02005 ,  H01L31/0203 ,  H01L2224/73204

摘要： Electronic device packages comprise transparent substrates covering an active surface of an optically interactive electronic device. In some embodiments, the optically interactive electronic device is bonded to conductive traces formed directly on the transparent substrate. In other embodiments, a secondary substrate comprising a plurality of conductive traces is disposed between the transparent substrate and the optically interactive electronic device.

摘要翻译： 电子器件封装包括覆盖光学交互式电子器件的有源表面的透明衬底。 在一些实施例中，光学交互式电子器件被结合到直接形成在透明衬底上的导电迹线。 在其他实施例中，包括多个导电迹线的次级衬底设置在透明衬底和光学交互式电子器件之间。

公开(公告)号：US20090245009A1

公开(公告)日：2009-10-01

申请号：US12381143

申请日：2009-03-06

申请人： Brent Keeth ,  Layne G. Bunker ,  Scott J. Demer ,  Ronald L. Taylor ,  John S. Mullin ,  Raymond J. Beffa ,  Frank F. Ross ,  Larry D. Kinsman

发明人： Brent Keeth ,  Layne G. Bunker ,  Scott J. Demer ,  Ronald L. Taylor ,  John S. Mullin ,  Raymond J. Beffa ,  Frank F. Ross ,  Larry D. Kinsman

IPC分类号： G11C8/00

CPC分类号： G11C5/063 ,  G11C5/025 ,  G11C5/145 ,  G11C5/147 ,  G11C11/401 ,  G11C11/4074 ,  G11C11/4076 ,  G11C11/4097 ,  G11C11/4099 ,  G11C29/021 ,  G11C29/028 ,  G11C29/12 ,  G11C29/12005 ,  G11C29/46 ,  G11C29/787 ,  G11C2029/0407 ,  H01L27/10805 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00

摘要： A 256 Meg dynamic random access memory is comprised of a plurality of cells organized into individual arrays, with the arrays being organized into 32 Meg array blocks, which are organized into 64 Meg quadrants. Sense amplifiers are positioned between adjacent rows in the individual arrays while row decoders are positioned between adjacent columns in the individual arrays. In certain of the gap cells, multiplexers are provided to transfer signals from I/O lines to datalines. A data path is provided which, in addition to the foregoing, includes array I/O blocks, responsive to the datalines from each quadrant to output data to a data read mux, data buffers, and data driver pads. The write data path includes a data in buffer and data write muxes for providing data to the array I/O blocks. A power bus is provided which minimizes routing of externally supplied voltages, completely rings each of the array blocks, and provides gridded power distribution within each of the array blocks. A plurality of voltage supplies provide the voltages needed in the array and in the peripheral circuits. The power supplies are organized to match their power output to the power demand and to maintain a desired ratio of power production capability and decoupling capacitance. A powerup sequence circuit is provided to control the powerup of the chip. Redundant rows and columns are provided as is the circuitry necessary to logically replace defective rows and columns with operational rows and columns. Circuitry is also provided on chip to support various types of test modes.