公开(公告)号：US07791194B2

公开(公告)日：2010-09-07

申请号：US12101077

申请日：2008-04-10

Applicant: Vadim Gektin ,  David W. Copeland

Inventor： Vadim Gektin ,  David W. Copeland

IPC: H01L23/488

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06515 ,  H01L2224/10135 ,  H01L2224/13193 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/14515 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81815 ,  H01L2224/81906 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10659 ,  H05K2201/10719 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.

Abstract translation: 复合互连系统包括多个碳纳米管，多个焊球和支撑球，其设置在第一装置上以提供到第二装置的连接。 芯片连接的基板包括基板和通过管芯附着复合互连件设置在基板上的一个或多个管芯。 管芯附着复合互连件包括多个碳纳米管，焊料凸块和设置在管芯上的间隙球，以提供与衬底的一个或多个连接。 附着有PCB的衬底封装包括衬底封装和设置在衬底封装上的一个或多个管芯。 衬底封装通过PCB连接复合互连布置在PCB上。 PCB附着复合互连件包括多个碳纳米管，焊球和设置在衬底封装上的间隙球，以提供与PCB的一个或多个连接。

公开(公告)号：US20100134228A1

公开(公告)日：2010-06-03

申请号：US12624449

申请日：2009-11-24

Applicant: JOHN CHOW ,  CHIH-MIN LIN ,  YONG-CHUN XU ,  JIAN-MING BU

Inventor： JOHN CHOW ,  CHIH-MIN LIN ,  YONG-CHUN XU ,  JIAN-MING BU

IPC: H01F27/04

CPC classification number: H01F27/027 ,  H01F17/062 ,  H01F27/292 ,  H01F37/00 ,  H05K1/141 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10659

Abstract: A choke module (100) for an insulative housing (2) includes a first and a second walls (23, 24) defining a first and a second receiving cavities (28, 29); a first set of contact terminals (4) arranged in the first wall, a second set of contact terminals (4) arranged in the second wall, a third set of contact terminals (5) disposed in the partition, a paddle board (6) having a number of conductive traces and attached to the insulative housing to interconnect the first and third set of contact terminals, a number of chokes (8) wound with wires which interconnects the first and second sets of contact terminals. The first and second contact terminal has a first and a second soldering portion (42) extending out of the housing and a first and a second mating portion (41) at the first wall.

Abstract translation: 用于绝缘壳体（2）的扼流模块（100）包括限定第一和第二接收腔（28,29）的第一壁和第二壁（23,24）。 布置在第一壁中的第一组接触端子（4），布置在第二壁中的第二组接触端子（4），设置在隔板中的第三组接触端子（5），桨板（6） 具有多个导电迹线并且附接到绝缘壳体以互连第一和第三组接触端子，多个绕着互连第一和第二组接触端子的导线缠绕的扼流圈（8）。 第一和第二接触端子具有从壳体延伸出的第一和第二焊接部分（42）以及在第一壁处的第一和第二配合部分（41）。

公开(公告)号：US07708590B1

公开(公告)日：2010-05-04

申请号：US12508833

申请日：2009-07-24

Applicant: Zhan-Yang Li

Inventor： Zhan-Yang Li

IPC: H01R13/66

CPC classification number: H01R12/58 ,  H01R12/7011 ,  H05K1/18 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10545 ,  H05K2201/10659 ,  H05K2201/10901

Abstract: A circuit board includes a board body of a thickness, and a socket. The board body defines a plurality of through holes therein. The socket includes a first line of short pin groups and a second line of long pin groups engaging the through holes of the board body. The socket defines a slot. The first line of short pin groups and the second line of long pin groups are respectively located on opposite sides of the slot. The first line of short pin groups has a length less than the thickness of the board body. The second line of long pin groups has a length sufficient that the second line of pin groups protrudes the board body.

Abstract translation: 电路板包括厚度的板体和插座。 板主体在其中限定多个通孔。 插座包括第一线短销组和与板主体的通孔接合的第二条长销组。 插座定义一个插槽。 短销组的第一行和长销组的第二行分别位于插槽的相对侧。 短销组的第一行长度小于板体的厚度。 长销组的第二行具有足够的长度，使得第二组销组突出板主体。

公开(公告)号：US20100046185A1

公开(公告)日：2010-02-25

申请号：US12544156

申请日：2009-08-19

Applicant: Hideaki Hirasawa

Inventor： Hideaki Hirasawa

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/00

CPC classification number: H05K1/11 ,  H05K1/0203 ,  H05K1/111 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/10522 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/611

Abstract: A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.

Abstract translation: 印刷电路板具有第一焊盘焊盘，第二焊盘焊盘和信号线图案。 第一焊盘被配置为与电子部件焊接。 第二焊盘被构造为蓄积焊料，第二焊盘位于沿着印刷电路的携带方向设置在第一焊盘的下游侧。 信号线图案包括未被抗蚀剂覆盖的暴露部分，暴露部分设置在焊接区域和防止桥接防止焊盘之间。

公开(公告)号：US20100007006A1

公开(公告)日：2010-01-14

申请号：US12513906

申请日：2006-12-05

Applicant: Stanley Job Doraisamy ,  Wae Chet Young

Inventor： Stanley Job Doraisamy ,  Wae Chet Young

IPC: H01L23/50

CPC classification number: H05K1/18 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10659 ,  H01L2924/00

Abstract: A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.

Abstract translation: 为适用于汽车的控制模块的半导体集成器件提供晶体管外形封装，用于连接印刷电路板和这种模块的母线。 封装包括封装壳体，其具有适于安装到PCB并具有宽度的第一端。 该封装还形成有引线框架，该引线框架包括适于连接到母线的散热器和接地平面叶片，适合于连接到PCB的多个连接器引线和适于连接到模块连接器的至少一个源极突起引线 的这种控制模块。 多个连接引线和源极突片从包装壳体的第一端沿着包装壳体的第一端的宽度方向并排地延伸。

公开(公告)号：US20090256255A1

公开(公告)日：2009-10-15

申请号：US12101077

申请日：2008-04-10

Applicant: Vadim Gektin ,  David W. Copeland

Inventor： Vadim Gektin ,  David W. Copeland

IPC: H01L23/488

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06515 ,  H01L2224/10135 ,  H01L2224/13193 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/14515 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81815 ,  H01L2224/81906 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10659 ,  H05K2201/10719 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.

Abstract translation: 复合互连系统包括多个碳纳米管，多个焊球和支撑球，其设置在第一装置上以提供到第二装置的连接。 芯片连接的基板包括基板和通过管芯附着复合互连件设置在基板上的一个或多个管芯。 管芯附着复合互连件包括多个碳纳米管，焊料凸块和设置在管芯上的间隙球，以提供与衬底的一个或多个连接。 附着有PCB的衬底封装包括衬底封装和设置在衬底封装上的一个或多个管芯。 衬底封装通过PCB连接复合互连布置在PCB上。 PCB附着复合互连件包括多个碳纳米管，焊球和设置在衬底封装上的间隙球，以提供与PCB的一个或多个连接。

公开(公告)号：US20090251446A1

公开(公告)日：2009-10-08

申请号：US12481892

申请日：2009-06-10

Applicant: Kazuhiro Ogawa ,  Kazuhiko Yanagawa

Inventor： Kazuhiro Ogawa ,  Kazuhiko Yanagawa

IPC: G09G3/36 ,  G09G5/00

CPC classification number: G02F1/13452 ,  G02F1/134363 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/244 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10659 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A display device includes a display panel, a printed circuit board, a plurality of semiconductor devices which are film-like substrates with an IC chip, and a monolithic anisotropic conductive film disposed on the printed circuit board. Each of the semiconductor devices has a first side portion and a second side portion opposite to the first side portion. The first side portion is connected to the printed circuit board via the monolithic anisotropic conductive film, and the second side portion is connected to the display panel. Further the first side portion of each of the semiconductor devices is respectively connected at separated portions of the monolithic anisotropic conductive film.

Abstract translation: 显示装置包括显示面板，印刷电路板，作为具有IC芯片的薄膜状基板的多个半导体装置以及布置在印刷电路板上的整体式各向异性导电膜。 每个半导体器件具有与第一侧部相对的第一侧部分和第二侧部分。 第一侧部通过单片式各向异性导电膜与印刷电路板连接，第二侧部与显示面板连接。 此外，每个半导体器件的第一侧部分别分别连接在单片各向异性导电膜的分离部分。

公开(公告)号：US20080083554A1

公开(公告)日：2008-04-10

申请号：US11538637

申请日：2006-10-04

Applicant: Robert G. Biskeborn ,  George G. Zamora

Inventor： Robert G. Biskeborn ,  George G. Zamora

IPC: H01B7/08

CPC classification number: H05K3/361 ,  H01L2224/48091 ,  H05K3/328 ,  H05K3/4092 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/10659 ,  H05K2203/049 ,  H01L2924/00014

Abstract: A flexible circuit for bonding to another circuit includes a film having a first conductor layer fabricated upon a topside of the film and a second conductor layer fabricated on an underside of the film, the first conductor layer being insulated by a first insulator layer fabricated thereover, the second conductor layer being insulated by a second insulator layer fabricated thereover; wherein the first conductor layer terminates in at least one bonding pad for the bonding to the another circuit and the second conductor layer terminates in at least one finger lead for the bonding to another circuit. A method for fabricating the flex circuit is provided.

Abstract translation: 用于接合到另一电路的柔性电路包括具有在膜顶部制造的第一导体层的膜和在膜的下侧制造的第二导体层，第一导体层由其上制造的第一绝缘体层绝缘， 所述第二导体层由制造在其上的第二绝缘体层绝缘; 其中所述第一导体层终止于至少一个用于与所述另一电路接合的接合焊盘，并且所述第二导体层终止于用于与另一电路接合的至少一根指状引线。 提供了制造柔性电路的方法。

公开(公告)号：US20080081253A1

公开(公告)日：2008-04-03

申请号：US11905282

申请日：2007-09-28

Applicant: Tomoyuki Shose ,  Katsuyuki Kida ,  Masao Kondou ,  Yasuo Akai

Inventor： Tomoyuki Shose ,  Katsuyuki Kida ,  Masao Kondou ,  Yasuo Akai

IPC: H01M2/02

CPC classification number: H01M2/0413 ,  H01M2/0222 ,  H01M10/052 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/10462 ,  H05K2201/10643 ,  H05K2201/10659 ,  Y02P70/613 ,  Y10S228/901

Abstract: A lead plate-attached coin-type battery is constituted from a combination of a coin-type battery and a positive lead plate. In the coin-type battery, a negative cap seals the aperture of a positive outer can. In a lateral view, the positive lead plate is crank-shaped, and one end thereof is attached to the outer surface of the positive outer can of the coin-type battery. A lead plate is not attached to the negative cap. One or more projections that project in the Z axis direction are provided on the negative cap. In the lead plate-attached coin-type battery, the positive lead plate and negative cap have been attached to respective conductive lands on a circuit board by a solder reflow method.

Abstract translation: 引线板式硬币型电池由硬币型电池和正极引线板的组合构成。 在硬币型电池中，负极帽密封正外壳的孔径。 在侧视图中，正极引线板是曲柄形的，其一端连接到硬币型电池的正外壳的外表面。 引线板未连接到负极盖。 在Z轴方向上投影的一个或多个突起设置在负极盖上。 在带引线板的硬币型电池中，通过焊料回流法将正极引线板和负极盖安装在电路板上的各个导电焊盘上。

公开(公告)号：US20080024424A1

公开(公告)日：2008-01-31

申请号：US11860017

申请日：2007-09-24

Applicant: Kazuhiro Ogawa ,  Kazuhiko Yanagawa

Inventor： Kazuhiro Ogawa ,  Kazuhiko Yanagawa

IPC: G09G3/36

CPC classification number: G02F1/13452 ,  G02F1/134363 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/244 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10659 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A display device includes a display panel, a printed circuit board, and a semiconductor device of a film carrier type which is disposed to lie between the display panel and the printed circuit board and is mounted on a film carrier. Terminals of the film carrier are connected to terminals of the printed circuit board by an anisotropic conductive film. The terminals of the printed circuit board are disposed in at least two rows, with the terminals row being located at a position between adjacent ones of the terminals of the other row. The terminals of the film carrier connected to respective terminals of the printed circuit board are arranged to correspond to an arrangement of the terminals of the printed circuit board.

Abstract translation: 显示装置包括显示面板，印刷电路板和薄膜载体型的半导体器件，其设置在所述显示面板和所述印刷电路板之间并且安装在薄膜载体上。 胶片载体的端子通过各向异性导电膜连接到印刷电路板的端子。 印刷电路板的端子设置成至少两排，端子排位于另一排的相邻端子之间的位置。 连接到印刷电路板的各个端子的胶片载体的端子布置成对应于印刷电路板的端子的布置。