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公开(公告)号：US10286497B2
公开(公告)日：2019-05-14
申请号：US14901638
申请日：2015-04-28
IPC分类号： C22C13/00 , C22C13/02 , B23K35/362 , B23K35/26 , H01R4/02 , B23K1/00 , B23K35/36 , B23K35/02
摘要： Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn—Cu—Ni as a basic composition, which includes 0.1 to 2.0 mass % of Cu, and 0.01 to 0.5 mass % of Ni, 0.1 to 5 mass % of Bi, and 76.0 to 99.5 mass % of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.
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公开(公告)号：US20190134759A1
公开(公告)日：2019-05-09
申请号：US16234649
申请日：2018-12-28
IPC分类号： B23K35/26 , B23K35/02 , C22C13/02 , B23K101/42
摘要： In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, nickel and an additional element, the content ratios of the silver, the copper, the bismuth, the antimony, the indium, the nickel and the additional element, which is at least one of germanium, gallium, iron or phosphorus, are defined, the content ratio of the tin is the remaining ratio, and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less. In a further embodiment, the solder alloy additionally contains a defined amount of cobalt.
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公开(公告)号：US10190630B2
公开(公告)日：2019-01-29
申请号：US14784452
申请日：2014-04-10
摘要： A tin-based sliding bearing alloy contains zinc as its principal alloying element at a content of 2 to 14% w/w and has the Sn—Zn eutectic as its main structural element. The content of zinc as the principal alloying element can be expanded to 2 to 30% w/w by the addition of additional alloying elements. Antimony and/or copper can additionally be used as further principal alloying elements.
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公开(公告)号：US10157877B2
公开(公告)日：2018-12-18
申请号：US14878903
申请日：2015-10-08
发明人： Kazumasa Kido , Takashi Saitou , Kyouhei Fukuda , Shinji Tada , Fumihiko Momose , Yoshitaka Nishimura
IPC分类号： H01L23/00 , B23K1/00 , B23K35/26 , C22C13/02 , H01L21/52 , B23K1/008 , B23K1/012 , B23K1/20 , B23K35/02 , B23K1/19 , B23K103/00 , B23K101/42 , H01L23/051
摘要： A solder joint layer has a structure in which plural fine-grained second crystal sections (22) precipitate at crystal grain boundaries between first crystal sections (21) dispersed in a matrix. The first crystal sections (21) are Sn crystal grains containing tin and antimony in a predetermined proportion. The second crystal sections (22) are made up of a first portion containing a predetermined proportion of Ag atoms with respect to Sn atoms, or a second portion containing a predetermined proportion of Cu atoms with respect to Sn atoms, or both. The solder joint layer may have third crystal sections (23) which are crystal grains that contain a predetermined proportion of Sb atoms with respect to Sn atoms. As a result, solder joining is enabled at a low melting point, and a highly reliable solder joint layer having a substantially uniform metal structure can be formed.
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公开(公告)号：US09956649B2
公开(公告)日：2018-05-01
申请号：US14442597
申请日：2014-08-28
发明人： Kazuki Ikeda , Kosuke Inoue , Kazuya Ichikawa , Tadashi Takemoto
IPC分类号： C22C13/02 , B23K35/26 , C22C13/00 , B23K35/02 , B23K35/22 , B23K35/36 , H05K3/34 , B23K35/362 , B23K101/36 , B23K101/42
CPC分类号： B23K35/262 , B23K35/0205 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/36 , B23K35/3606 , B23K35/3612 , B23K35/3613 , B23K35/3616 , B23K35/3618 , B23K35/362 , B23K2101/36 , B23K2101/42 , C22C13/00 , C22C13/02 , H05K3/3457 , H05K3/3484
摘要： A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass % or more and 4 mass % or less; the content ratio of the indium is 6.2 mass % or more and 9.0 mass % or less; the content ratio of the bismuth is 0.7 mass % or more and 5.0 mass % or less; the content ratio of the antimony is 0.3 mass % or more and 5.0 mass % or less; and the content ratio of the tin is the remaining ratio and the value of A is 4.36 or less wherein A=0.87×[In content ratio (mass %)]−0.41×[Ag content ratio (mass %)]−0.82×[Sb content ratio (mass %)].
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公开(公告)号：US20180102464A1
公开(公告)日：2018-04-12
申请号：US15286759
申请日：2016-10-06
发明人： Morgana de Avila Ribas , Pritha Choudhury , Siuli Sarkar , Ranjit Pandher , Nicholas G. Herrick , Amit Patel , Ravindra M Bhatkal , Bawa Singh
IPC分类号： H01L33/62 , H01L23/00 , H01L33/64 , B23K1/00 , B23K1/08 , B23K1/002 , B23K1/005 , B23K35/26 , C22C13/02
CPC分类号： H01L33/62 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/085 , B23K35/262 , C22C13/02 , H01L24/13 , H01L24/29 , H01L33/641 , H01L33/647 , H01L2224/13211 , H01L2224/13313 , H01L2224/1332 , H01L2224/13339 , H01L2224/13347 , H01L2224/13355 , H01L2224/29211 , H01L2224/29313 , H01L2224/2932 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2924/01058 , H01L2924/014 , H01L2924/12041 , H01L2924/20106 , H01L2924/351 , H01L2933/0066
摘要： Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
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公开(公告)号：US20180001426A1
公开(公告)日：2018-01-04
申请号：US15613895
申请日：2017-06-05
发明人： Masayuki SUZUKI , Naoko IZUMITA , Shunsaku YOSHIKAWA , Ken TACHIBANA , Rei FUJIMAKI , Hikaru NOMURA
CPC分类号： B23K35/025 , B23K35/0222 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/36 , C22C13/00 , C22C13/02 , H05K3/3463 , H05K2201/10636 , Y02P70/611 , Y10T403/479
摘要： Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.
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公开(公告)号：US20170304955A1
公开(公告)日：2017-10-26
申请号：US15644331
申请日：2017-07-07
发明人： Ranjit Pandher , Bawa Singh , Siuli Sarkar , Sujatha Chegudi , Anil K. N. Kumar , Kamanio Chattopadhyay , Dominic Lodge , Morgana de Avila Ribas
CPC分类号： B23K35/262 , B23K1/002 , B23K1/0056 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0244 , B23K35/025 , B23K35/264 , B23K2101/42 , C22C12/00 , C22C13/02 , Y10T403/479
摘要： The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to .0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to .0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to .0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.
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公开(公告)号：US09796053B2
公开(公告)日：2017-10-24
申请号：US14420413
申请日：2013-07-29
发明人： Rei Fujimaki , Minoru Ueshima
IPC分类号： B23K35/28 , B23K35/26 , C22C13/02 , C22C30/02 , C22C30/04 , C22C30/06 , B23K35/02 , H05K3/34 , B23K1/00 , C22C12/00 , B23K101/40
CPC分类号： B23K35/28 , B23K1/0016 , B23K35/025 , B23K35/26 , B23K35/262 , B23K2101/40 , C22C12/00 , C22C13/02 , C22C30/02 , C22C30/04 , C22C30/06 , H01L2224/48091 , H01L2224/48227 , H05K3/3463 , Y10T403/479 , H01L2924/00014
摘要： Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.
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公开(公告)号：US20170066089A1
公开(公告)日：2017-03-09
申请号：US15252347
申请日：2016-08-31
发明人： Mehran Maalekian , Karl Seelig
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02
摘要： A lead-free, tin-based solder alloy contains about 0.6 to about 0.8 wt % copper, about 2.8 to about 3.2 wt % silver, about 2.8 to about 3.2 wt % bismuth, about 0.5 to about 0.7 wt % antimony, about 0.04 to about 0.07 wt % nickel, and about 0.007 to about 0.015 wt % titanium, exhibits low melting temperature, narrow solidification range and undercooling, high hardness and ultimate tensile strength at room temperature and high temperature, good formability, superior reliability performance such as creep resistance at high temperature, improved thermal cycle fatigue resistance on leadless (BGA and QFN) surface mount devices, stable microstructure at high temperature, very good solderability performance, low voiding in bottom terminated components, and mitigated tin whisker growth as compared with other lead-free solder alloys
摘要翻译： 无铅锡基焊料合金含有约0.6至约0.8重量％的铜，约2.8至约3.2重量％的银，约2.8至约3.2重量％的铋，约0.5至约0.7重量％的锑，约0.04至 约0.07重量％的镍和约0.007至约0.015重量％的钛，在室温和高温下表现出低的熔融温度，窄的凝固范围和过冷，高硬度和极限拉伸强度，良好的成形性，优异的可靠性性能如抗蠕变性 在高温下，无铅（BGA和QFN）表面贴装器件具有改善的热循环耐疲劳性能，在高温下稳定的微观结构，非常好的可焊性性能，底部封端组件的低孔隙度以及减轻的锡晶须生长与其他无铅 焊锡合金
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