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公开(公告)号：US11844156B1
公开(公告)日：2023-12-12
申请号：US18145826
申请日：2022-12-22
发明人： Chia-Tin Chung , Pei-Chun Liu , Yi-Chun Liu
IPC分类号： H05B45/20 , H05B45/54 , H05B45/325 , H05B45/37
CPC分类号： H05B45/20 , H05B45/325 , H05B45/37 , H05B45/54
摘要： An LED illumination device and a color temperature switching method thereof are provided. The LED illumination device includes a bridge rectifier chip, a microcontroller module, a first semiconductor switch module, a second semiconductor switch module, a first current limiting module, a second current limiting module, and a first light-emitting module and a second light-emitting module. The microcontroller module includes a microcontroller chip. The first semiconductor switch module includes a first semiconductor switch chip for receiving a first pulse width modulation signal output from the microcontroller chip. The second semiconductor switch module includes a second semiconductor switch chip for receiving a second pulse width modulation signal output from the microcontroller chip. When the AC power is supplied to the LED illumination device, the first and the second semiconductor switch modules are turned on and maintained within a predetermined turn-on percentage range without being completely turned off.
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公开(公告)号：US11716801B1
公开(公告)日：2023-08-01
申请号：US17702805
申请日：2022-03-24
发明人： Chia-Tin Chung , Pei-Chun Liu
IPC分类号： H05B45/3725 , H05B45/40 , H02M7/06
CPC分类号： H05B45/3725 , H05B45/40 , H02M7/06
摘要： An LED illumination device for rapidly releasing residual capacitance, which includes a bridge rectifier chip, a current-limiting chip, a light-emitting group, a resistor group and a capacitor. The light-emitting group includes a plurality of first and second LED chips. The resistor group includes a plurality of first and second resistor chips. The first working voltage of the first LED chip is different from the second working voltage of the second LED chip. The first resistance value of the first resistor chip is different from the second resistance value of the second resistor chip. Each first LED chip corresponds to one of the first resistor chips, and each second LED chip corresponds to one of the second resistor chips. When the power supply is turned off, the residual capacitance remaining in the capacitor can be released by cooperation of the first resistor chips and the second resistor chips.
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公开(公告)号：US11576242B1
公开(公告)日：2023-02-07
申请号：US17730135
申请日：2022-04-26
发明人： Chia-Tin Chung , Pei-Chun Liu , Yi-Chun Liu
摘要： An LED illumination device for improving anti-surge capability includes a circuit substrate, a bridge rectifier chip, a surge absorber group, a first anti-surge current-limiting chip group, a second anti-surge current-limiting chip group, an LED illuminating group, and an LED current-limiting group. The surge absorber group is disposed on the circuit substrate and electrically connected to the bridge rectifier chip for absorbing a surge voltage. The first anti-surge current-limiting chip group is disposed on the circuit substrate for absorbing a first predetermined surge voltage. The second anti-surge current-limiting chip group is disposed on the circuit substrate for absorbing a second predetermined surge voltage. The LED illuminating group includes a plurality of LED chips disposed on the circuit substrate. The LED current-limiting group is disposed on the circuit substrate for controlling a total harmonic distortion of current (THDi) of the LED illuminating group.
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公开(公告)号：US10066821B1
公开(公告)日：2018-09-04
申请号：US15712825
申请日：2017-09-22
发明人： Chia-Tin Chung , Shih-Neng Tai
摘要： The present disclosure provides a light-emitting device having an ambient light sensing function, including a light-emitting module, a rectification module, a switch module, a control module, and an ambient light sensing module. The light-emitting module includes a circuit substrate and a plurality of light-emitting elements. The rectification module is electrically connected to the light-emitting module. The switch module includes a semiconductor switch element electrically connected to the light-emitting module. The control module is electrically connected to the rectification module and the switch module. The ambient light sensing module is electrically connected to the control module for receiving an ambient light source. The ambient light sensing module provides a light intensity signal to the control module according to a light intensity provided by the ambient light source, and the light-emitting elements are turned on or turned off by the semiconductor switch element according to the light intensity signal.
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公开(公告)号：US09433103B2
公开(公告)日：2016-08-30
申请号：US14803185
申请日：2015-07-20
发明人： Chia-Tin Chung , Chao-Chin Wu , Fang-Kuei Wu
CPC分类号： H05K3/285 , H01L33/54 , H01L33/60 , H01L2224/05553 , H01L2224/48091 , H01L2924/181 , H05K3/284 , H05K2201/10106 , H05K2201/2054 , Y10T29/49146 , Y10T29/49147 , H01L2924/00014 , H01L2924/00012
摘要： A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried colloid outer layer totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.
摘要翻译： 一种制造多芯片封装结构的方法包括：提供衬底本体; 将多个发光芯片放置在基板主体上，其中发光芯片电连接到基板主体; 围绕所述基板主体周围形成周围的液体胶体以围绕所述发光芯片; 在预定的室温下自然地干燥周围的液体胶体的外层，以形成半干燥的周围的反光框架，其中半干燥的周围的光反射框架具有设置在基板主体上的非干燥的包围胶体，并且干燥的胶体 外层完全覆盖不干燥的周围胶体; 然后在基板主体上形成封装胶体，以覆盖发光芯片，半透明周围的光反射框架接触并包围封装胶体。
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6.发明授权Multichip package structure for directly electrically connecting to an AC power source 有权用于直接电连接到交流电源的多芯片封装结构公开(公告)号：US09078312B2
公开(公告)日：2015-07-07
申请号：US12964415
申请日：2010-12-09
申请人： Shih-Neng Dai , Chia-Tin Chung
发明人： Shih-Neng Dai , Chia-Tin Chung
IPC分类号： H05B33/08 , F21K99/00 , H01L25/16 , H01L25/075
CPC分类号： H05B33/0812 , F21K9/00 , H01L25/0753 , H01L25/167 , H01L2224/48091 , H01L2924/3025 , H05B33/0821 , Y02B20/348 , H01L2924/00014 , H01L2924/00
摘要： A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.
摘要翻译： 多芯片封装结构包括基板单元，发光单元，控制模块，框架单元和封装单元。 基板单元包括第一芯片放置区域和第二芯片放置区域。 发光单元包括电连接到第一芯片放置区的多个发光芯片。 控制模块包括至少一个限流单元，并且整流单元电连接到第二芯片放置区域和发光单元。 框架单元包括围绕发光芯片的第一环形胶体框架和围绕限流单元和整流单元的第二环形胶体框架。 封装单元包括被第一环形胶体框架包围以覆盖发光芯片的第一封装胶体体和由第二环形胶体框架包围以覆盖限流单元和整流器单元的第二封装胶体体。
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公开(公告)号：US09018662B2
公开(公告)日：2015-04-28
申请号：US14076489
申请日：2013-11-11
发明人： Chia-Tin Chung , Shih-Neng Tai
IPC分类号： H01L33/50 , H01L25/075 , H05B33/08
CPC分类号： H01L25/0753 , H01L23/24 , H01L25/167 , H01L33/60 , H01L2224/48137 , H01L2224/48227 , H05B33/0803 , H05B33/0806 , H05B33/0827 , H05K1/05 , H05K3/284 , H05K2201/10106
摘要： A multichip package structure includes a metal substrate, a circuit substrate and a light-emitting module. The metal substrate has a first mirror plane area and a second mirror plane area. The circuit substrate is disposed on the metal substrate. The circuit substrate includes a plurality of first conductive pads, a plurality of second conductive pads, a first passing opening for exposing the first mirror plane area, and a second passing opening for exposing the second mirror plane area. The light-emitting module includes a plurality of light-emitting units disposed on the first mirror plane area. Each light-emitting unit includes a plurality of LED chips disposed on the first mirror plane area. The LED chips of each light-emitting unit are electrically connected between the first conductive pad and the second conductive pad in series. Thus, the heat-dissipating efficiency and the light-emitting effect of the multichip package structure can be increased.
摘要翻译： 多芯片封装结构包括金属基板，电路基板和发光模块。 金属基板具有第一镜面区域和第二镜面区域。 电路基板设置在金属基板上。 电路基板包括多个第一导电焊盘，多个第二导电焊盘，用于暴露第一镜面平面区域的第一通过开口和用于暴露第二镜面区域的第二通过开口。 发光模块包括设置在第一镜面区域上的多个发光单元。 每个发光单元包括设置在第一镜面区域上的多个LED芯片。 每个发光单元的LED芯片串联地电连接在第一导电焊盘和第二导电焊盘之间。 因此，可以提高多芯片封装结构的散热效率和发光效果。
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公开(公告)号：US08674376B2
公开(公告)日：2014-03-18
申请号：US13096761
申请日：2011-04-28
申请人： Chao-Chin Wu , Shen-Ta Yang
发明人： Chao-Chin Wu , Shen-Ta Yang
IPC分类号： H01L29/18
CPC分类号： H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H05K1/11 , H05K2201/0979 , H05K2201/10106 , H05K2203/049 , H01L2924/00014 , H01L2924/00
摘要： An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED bare chips. The positive electrode of each LED bare chip corresponds to at least two of the positive pads, and the negative electrode of each LED bare chip corresponds to at least two of the negative pads. Each wire is electrically connected between the positive electrode of the LED bare chip and one of the at least two positive pads or between the negative electrode of the LED bare chip and one of the at least two negative pads. The package unit has a light-permitting package resin body on the substrate body to cover the LED bare chips.
摘要翻译： 具有用于提高引线接合成品率的备用接合焊盘的LED封装结构包括基板单元，发光单元，导线单元和封装单元。 基板单元具有基板主体和多个正极焊盘和负极焊盘。 发光单元具有多个LED裸芯片。 每个LED裸芯片的正极对应于至少两个正极焊盘，并且每个LED裸芯片的负电极对应于至少两个负极焊盘。 每条导线电连接在LED裸芯片的正电极和至少两个正极焊盘中的一个之间或LED裸芯片的负电极之间以及至少两个负焊盘中的一个之间。 封装单元在基板主体上具有允许封装的树脂体，以覆盖LED裸芯片。
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公开(公告)号：US20120273806A1
公开(公告)日：2012-11-01
申请号：US13096761
申请日：2011-04-28
申请人： CHAO-CNIN WU , Shen-Ta Yang
发明人： CHAO-CNIN WU , Shen-Ta Yang
IPC分类号： H01L27/15
CPC分类号： H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H05K1/11 , H05K2201/0979 , H05K2201/10106 , H05K2203/049 , H01L2924/00014 , H01L2924/00
摘要： An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED bare chips. The positive electrode of each LED bare chip corresponds to at least two of the positive pads, and the negative electrode of each LED bare chip corresponds to at least two of the negative pads. Each wire is electrically connected between the positive electrode of the LED bare chip and one of the at least two positive pads or between the negative electrode of the LED bare chip and one of the at least two negative pads. The package unit has a light-permitting package resin body on the substrate body to cover the LED bare chips.
摘要翻译： 具有用于提高引线接合成品率的备用接合焊盘的LED封装结构包括基板单元，发光单元，导线单元和封装单元。 基板单元具有基板主体和多个正极焊盘和负极焊盘。 发光单元具有多个LED裸芯片。 每个LED裸芯片的正极对应于至少两个正极焊盘，并且每个LED裸芯片的负电极对应于至少两个负极焊盘。 每条导线电连接在LED裸芯片的正电极和至少两个正极焊盘中的一个之间或LED裸芯片的负电极之间以及至少两个负焊盘中的一个之间。 封装单元在基板主体上具有允许封装的树脂体，以覆盖LED裸芯片。
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公开(公告)号：US20110006318A1
公开(公告)日：2011-01-13
申请号：US12558492
申请日：2009-09-12
申请人： CHIA-TIN CHUNG
发明人： CHIA-TIN CHUNG
IPC分类号： H01L33/00
CPC分类号： F21K9/00 , H01L25/0753 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H01L2933/0075 , H01L2924/00014 , H01L2924/00
摘要： An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.
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