公开(公告)号：US20120273806A1

公开(公告)日：2012-11-01

申请号：US13096761

申请日：2011-04-28

申请人： CHAO-CNIN WU ,  Shen-Ta Yang

发明人： CHAO-CNIN WU ,  Shen-Ta Yang

IPC分类号： H01L27/15

CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/11 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED bare chips. The positive electrode of each LED bare chip corresponds to at least two of the positive pads, and the negative electrode of each LED bare chip corresponds to at least two of the negative pads. Each wire is electrically connected between the positive electrode of the LED bare chip and one of the at least two positive pads or between the negative electrode of the LED bare chip and one of the at least two negative pads. The package unit has a light-permitting package resin body on the substrate body to cover the LED bare chips.

摘要翻译： 具有用于提高引线接合成品率的备用接合焊盘的LED封装结构包括基板单元，发光单元，导线单元和封装单元。 基板单元具有基板主体和多个正极焊盘和负极焊盘。 发光单元具有多个LED裸芯片。 每个LED裸芯片的正极对应于至少两个正极焊盘，并且每个LED裸芯片的负电极对应于至少两个负极焊盘。 每条导线电连接在LED裸芯片的正电极和至少两个正极焊盘中的一个之间或LED裸芯片的负电极之间以及至少两个负焊盘中的一个之间。 封装单元在基板主体上具有允许封装的树脂体，以覆盖LED裸芯片。

公开(公告)号：US20110050071A1

公开(公告)日：2011-03-03

申请号：US12591378

申请日：2009-11-18

申请人： Chia-Tin Chung ,  Fang-Kuei Wu ,  Shen-Ta Yang

发明人： Chia-Tin Chung ,  Fang-Kuei Wu ,  Shen-Ta Yang

IPC分类号： H01J61/52 ,  F21K2/08 ,  H01J1/62 ,  H01K1/26

CPC分类号： H05K3/284 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A quasioptical LED package structure for increasing color render index and brightness includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.

摘要翻译： 用于增加彩色渲染指数和亮度的准激光LED封装结构包括基板单元，发光单元，框架单元和封装单元。 发光单元具有用于产生第一色温的第一发光模块和用于产生第二色温的第二发光模块。 框架单元具有通过涂覆在基板单元的顶表面周围形成的两个环形树脂框架。 两个环形树脂框架分别围绕第一发光模块和第二发光模块，以在基板单元上方形成两个树脂位置限制空间。 封装单元具有第一半透明封装树脂体和第二半透明封装树脂体，两者均设置在基板单元上，并且分别覆盖第一发光模块和第二发光模块。

公开(公告)号：US08674376B2

公开(公告)日：2014-03-18

申请号：US13096761

申请日：2011-04-28

申请人： Chao-Chin Wu ,  Shen-Ta Yang

发明人： Chao-Chin Wu ,  Shen-Ta Yang

IPC分类号： H01L29/18

CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/11 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED bare chips. The positive electrode of each LED bare chip corresponds to at least two of the positive pads, and the negative electrode of each LED bare chip corresponds to at least two of the negative pads. Each wire is electrically connected between the positive electrode of the LED bare chip and one of the at least two positive pads or between the negative electrode of the LED bare chip and one of the at least two negative pads. The package unit has a light-permitting package resin body on the substrate body to cover the LED bare chips.

摘要翻译： 具有用于提高引线接合成品率的备用接合焊盘的LED封装结构包括基板单元，发光单元，导线单元和封装单元。 基板单元具有基板主体和多个正极焊盘和负极焊盘。 发光单元具有多个LED裸芯片。 每个LED裸芯片的正极对应于至少两个正极焊盘，并且每个LED裸芯片的负电极对应于至少两个负极焊盘。 每条导线电连接在LED裸芯片的正电极和至少两个正极焊盘中的一个之间或LED裸芯片的负电极之间以及至少两个负焊盘中的一个之间。 封装单元在基板主体上具有允许封装的树脂体，以覆盖LED裸芯片。

公开(公告)号：US08018151B2

公开(公告)日：2011-09-13

申请号：US12591378

申请日：2009-11-18

申请人： Chia-Tin Chung ,  Fang-Kuei Wu ,  Shen-Ta Yang

发明人： Chia-Tin Chung ,  Fang-Kuei Wu ,  Shen-Ta Yang

IPC分类号： H01J1/62

CPC分类号： H05K3/284 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A quasioptical LED package structure for increasing color render index and brightness includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.

公开(公告)号：US08672517B2

公开(公告)日：2014-03-18

申请号：US13452752

申请日：2012-04-20

申请人： Chia-Tin Chung ,  Shen-Ta Yang

发明人： Chia-Tin Chung ,  Shen-Ta Yang

IPC分类号： F21V29/00 ,  H01L23/34

CPC分类号： F21V7/048 ,  F21K9/00 ,  F21V5/04 ,  F21V7/0008 ,  F21V13/02 ,  F21V15/01 ,  F21V17/12 ,  F21V19/0035 ,  F21V29/503 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light-emitting module includes a heat-dissipating structure, a multichip package structure and a protection cover structure. The multichip package structure is disposed on the heat-dissipating structure, and the multichip package structure includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The protection cover structure is disposed on the heat-dissipating structure to cover and protect the multichip package structure, and the protection cover structure has an opening for exposing the package unit.

摘要翻译： 发光模块包括散热结构，多芯片封装结构和保护盖结构。 多芯片封装结构设置在散热结构上，多芯片封装结构包括基板单元，发光单元，框架单元和封装单元。 保护盖结构设置在散热结构上以覆盖和保护多芯片封装结构，并且保护盖结构具有用于暴露封装单元的开口。

公开(公告)号：US08288777B2

公开(公告)日：2012-10-16

申请号：US12654319

申请日：2009-12-17

申请人： Hsin-Yuan Peng ,  Shen-Ta Yang ,  Chia-Tin Chung

发明人： Hsin-Yuan Peng ,  Shen-Ta Yang ,  Chia-Tin Chung

IPC分类号： H01L27/15

CPC分类号： H01L33/62 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48655 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H05K3/244 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An LED package structure for increasing heat-dissipating and light-emitting efficiency includes a substrate unit, an alloy unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a first conductive pad, a second conductive pad and a chip-placing pad. The alloy unit has a Ni/Pd alloy formed on the chip-placing pad. The light-emitting unit has an LED chip positioned on the Ni/Pd alloy of the alloy unit by solidified solder ball or glue. The conductive unit has two conductive wires, and the LED chip is electrically connected to the first conductive pad and the second conductive pad by the two conductive wires, respectively. The package unit has a light-transmitting package gel body formed on the top surface of the substrate body in order to cover the light-emitting unit and the conductive unit.

摘要翻译： 用于增加散热和发光效率的LED封装结构包括基板单元，合金单元，发光单元，导电单元和封装单元。 基板单元具有基板主体，第一导电焊盘，第二导电焊盘和芯片放置焊盘。 合金单元在芯片放置垫上形成Ni / Pd合金。 发光单元具有通过固化的焊球或胶水定位在合金单元的Ni / Pd合金上的LED芯片。 导电单元具有两根导线，并且LED芯片分别通过两条导线电连接到第一导电焊盘和第二导电焊盘。 封装单元具有形成在基板主体的顶表面上的透光封装凝胶体，以覆盖发光单元和导电单元。

公开(公告)号：US20110057217A1

公开(公告)日：2011-03-10

申请号：US12654319

申请日：2009-12-17

申请人： Hsin-Yuan Peng ,  Shen-Ta Yang ,  Chia-Tin Chung

发明人： Hsin-Yuan Peng ,  Shen-Ta Yang ,  Chia-Tin Chung

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48655 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2933/0058 ,  H05K3/244 ,  H05K2201/10106 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An LED package structure for increasing heat-dissipating and light-emitting efficiency includes a substrate unit, an alloy unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a first conductive pad, a second conductive pad and a chip-placing pad. The alloy unit has a Ni/Pd alloy formed on the chip-placing pad. The light-emitting unit has an LED chip positioned on the Ni/Pd alloy of the alloy unit by solidified solder ball or glue. The conductive unit has two conductive wires, and the LED chip is electrically connected to the first conductive pad and the second conductive pad by the two conductive wires, respectively. The package unit has a light-transmitting package gel body formed on the top surface of the substrate body in order to cover the light-emitting unit and the conductive unit.

摘要翻译： 用于增加散热和发光效率的LED封装结构包括基板单元，合金单元，发光单元，导电单元和封装单元。 基板单元具有基板主体，第一导电焊盘，第二导电焊盘和芯片放置焊盘。 合金单元在芯片放置垫上形成Ni / Pd合金。 发光单元具有通过固化的焊球或胶水定位在合金单元的Ni / Pd合金上的LED芯片。 导电单元具有两根导线，并且LED芯片分别通过两条导线电连接到第一导电焊盘和第二导电焊盘。 封装单元具有形成在基板主体的顶表面上的透光封装凝胶体，以覆盖发光单元和导电单元。

公开(公告)号：US07736920B1

公开(公告)日：2010-06-15

申请号：US12559801

申请日：2009-09-15

申请人： Chao-Chin Wu ,  Shen-Ta Yang

发明人： Chao-Chin Wu ,  Shen-Ta Yang

IPC分类号： H01L21/00 ,  H01L21/66

CPC分类号： H01L25/0753 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/27013 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49107 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED chips. The positive electrode of each LED chip corresponds to at least two of the positive pads, and the negative electrode of each. LED chip corresponds to at least two of the negative pads. Every two wires of the conductive wire unit are respectively electrically connected between the positive electrode of each LED chip and one of the at least two positive pads and between the negative electrode of each LED chip and one of the at least two negative pads. The package unit has a translucent package resin body on the substrate body to cover the LED chips.

摘要翻译： 具有用于提高引线接合成品率的备用接合焊盘的LED封装结构包括基板单元，发光单元，导线单元和封装单元。 基板单元具有基板主体和多个正极焊盘和负极焊盘。 发光单元具有多个LED芯片。 每个LED芯片的正极对应于至少两个正极焊盘和负极。 LED芯片对应于至少两个负极焊盘。 导线单元的每两条导线分别电连接在每个LED芯片的正电极和至少两个正极焊盘中的一个之间，以及每个LED芯片的负电极和至少两个负焊盘中的一个之间。 封装单元在基板主体上具有半透明的封装树脂体，以覆盖LED芯片。