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    Active noise control system utilizing noise cancellation sounds
    1.
    发明授权
    Active noise control system utilizing noise cancellation sounds 有权

    公开(公告)号：US11622195B2

    公开(公告)日：2023-04-04

    申请号：US17363228

    申请日：2021-06-30

    申请人： ALPS ALPINE CO., LTD. ,  A School Corporation Kansai University

    发明人： Ryosuke Tachi ,  Yoshinobu Kajikawa

    IPC分类号： G10K11/178 ,  H04R3/04 ,  B60R11/02 ,  H04R3/00 ,  H04R3/12 ,  H04R5/04 ,  H04S7/00

    摘要： Adaptive operations of a first noise control system and a second noise control system may include a speaker that outputs noise cancellation sound, a microphone that detects an error signal, an auxiliary filter that generates, from a noise signal, a correction signal that corrects the error signal so that a difference in a position between the microphone and a noise cancellation position is compensated, and an adaptive filter that performs an adaptive operation using the corrected error signal to generate the noise cancellation sound from the noise signal are alternately performed. A transfer function learned in a state in which the second noise control system is stopped is set in the auxiliary filter of the first noise control system, and a transfer function learned in a state in which the adaptive operation of the first noise control system is stopped is set in the auxiliary filter of the second noise control system.

    POLYMER COMPOUND, RADIATION SENSITIVE COMPOSITION AND PATTERN FORMING METHOD
    5.
    发明申请
    POLYMER COMPOUND, RADIATION SENSITIVE COMPOSITION AND PATTERN FORMING METHOD 审中-公开
    聚合物化合物，辐射敏感组合物和图案形成方法

    公开(公告)号：US20170059989A1

    公开(公告)日：2017-03-02

    申请号：US15151087

    申请日：2016-05-10

    申请人： A School Corporation Kansai University ,  Mitsubishi Gas Chemical Company, Inc.

    发明人： Hiroto KUDO ,  Masatoshi ECHIGO ,  Takumi TOIDA ,  Takashi SATO

    IPC分类号： G03F7/038 ,  G03F7/32 ,  C08G65/40 ,  G03F7/20

    CPC分类号： C08G65/40 ,  G03F7/0392 ,  G03F7/322 ,  G03F7/325

    摘要： A polymer compound including a unit structure represented by the following general formula (1): wherein m1 equals 1 to 8, n1 equals 0 to 7, m1+n1 equals 4 to 8, m2 equals 1 to 8, n2 equals 0 to 7, m2+n2 equals 4 to 8, m1 equals m2, y represents 0 to 2, R1 represents a hydroxy group, a substituted or unsubstituted straight, branched or cyclic alkyl group, a substituted or unsubstituted aryl group, or a halogen atom, R3 represents a hydrogen atom, a substituted or unsubstituted straight, branched or cyclic alkyl group, or a substituted or unsubstituted aryl group, each R2 independently represents any structure represented by general formula (2) in the specification, at least one R2 has an acid-dissociable site, and R5 represents a hydroxy group or —O—R2—O—*.

    摘要翻译： 其中m1等于1至8，n1等于0至7，m1 + n1等于4至8，m2等于1至8，n2等于0至7，m2 + n2等于4至8，m1等于m2，y表示0至2 R 1表示羟基，取代或未取代的直链，支链或环状烷基，取代或未取代的芳基或卤素原子，R 3表示氢原子，取代或未取代的直链，支链或环状烷基，或 取代或未取代的芳基，每个R 2独立地表示说明书中由通式（2）表示的任何结构，至少一个R 2具有酸解离位点，并且R 5表示羟基或-O-R 2 -O- 。

    POLYMER COMPOUND, RADIATION SENSITIVE COMPOSITION AND PATTERN FORMING METHOD
    6.
    发明申请
    POLYMER COMPOUND, RADIATION SENSITIVE COMPOSITION AND PATTERN FORMING METHOD 审中-公开
    聚合物化合物，辐射敏感组合物和图案形成方法

    公开(公告)号：US20170058079A1

    公开(公告)日：2017-03-02

    申请号：US15151131

    申请日：2016-05-10

    申请人： A School Corporation Kansai University ,  Mitsubishi Gas Chemical Company, Inc.

    发明人： Hiroto KUDO ,  Masatoshi ECHIGO ,  Takumi TOIDA ,  Takashi SATO

    IPC分类号： C08G63/668 ,  G03F7/32 ,  G03F7/20 ,  G03F7/038 ,  G03F7/16

    CPC分类号： C08G63/668 ,  G03F7/0392

    摘要： A polymer compound including a unit structure represented by the general formula (1): wherein m1 and m2 each equal 1 to 8, n1 and n2 each equal 0 to 7, m1+n1 and m2+n2 each equal 4 to 8, y represents 0 to 2, R1 represents a hydroxy group; a substituted or unsubstituted straight, branched or cyclic alkyl group; a substituted or unsubstituted aryl group, or a halogen atom, R3 represents a hydrogen atom, a substituted or unsubstituted straight, branched or cyclic alkyl group, or a substituted or unsubstituted aryl group, R2 represents any structure represented by general formula (2) in the specification, at least one R2 has an acid-dissociable site, R5 represents a hydroxy group, —O—R2—O—* or —O—R2—O—R55, and R6 represents a hydroxy group or —O—R2—O—*.

    摘要翻译： 其中m1和m2各自等于1至8，n1和n2各自等于0至7，m1 + n1和m2 + n2均等于4至8，y表示0至2，R1表示羟基; 取代或未取代的直链，支链或环状烷基; 取代或未取代的芳基或卤素原子，R3表示氢原子，取代或未取代的直链，支链或环状烷基或取代或未取代的芳基，R2表示通式（2）表示的任何结构， 该说明书中，至少一个R2具有酸解离位点，R5表示羟基，-O-R2-O- *或-O-R2-O-R55，R6表示羟基或-O-R2- O- *。

    Method for treating substrate that support catalyst particles for plating processing
    7.
    发明授权
    Method for treating substrate that support catalyst particles for plating processing 有权
    用于处理支撑用于电镀处理的催化剂颗粒的基材的方法

    公开(公告)号：US09565776B2

    公开(公告)日：2017-02-07

    申请号：US14429702

    申请日：2013-09-27

    申请人： Tanaka Kikinzoku Kogyo K.K. ,  A School Corporation Kansai University

    发明人： Noriaki Nakamura ,  Junichi Taniuchi ,  Hitoshi Kubo ,  Yuusuke Ohshima ,  Tomoko Ishikawa ,  Shoso Shingubara ,  Fumihiro Inoue

    IPC分类号： B05D5/12 ,  H05K3/42 ,  H05K3/38

    CPC分类号： H05K3/422 ,  C23C18/1893 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/34 ,  H05K3/387 ,  H05K3/389 ,  H05K3/426

    摘要： The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.

    摘要翻译： 本发明提供一种处理基板的方法，该基板用于在各种基板上的电路图形或TSV上支撑用于形成镀层的金属微粒，与常规方法相比，能够进一步进行微粉化处理，并形成稳定的电镀 层被启用。 本发明是一种处理基板的方法，该方法包括使基板与含有金属颗粒的胶体溶液接触，以便支撑用作在基板上形成镀层的催化剂的金属颗粒，其中 胶体溶液含有由Pd形成的并且具有0.6nm至4.0nm的粒径和（111）面的面对面尺寸为2.254或更大的金属颗粒。 当在该处理之前在基板的表面上形成诸如SAM的有机层时，可以增加Pd颗粒的结合力。

    METHOD FOR MOLDING PIEZOELECTRIC POLYMER AND MOLDED BODY
    9.
    发明申请
    METHOD FOR MOLDING PIEZOELECTRIC POLYMER AND MOLDED BODY 审中-公开
    用于模压压电聚合物和模制体的方法

    公开(公告)号：US20160008851A1

    公开(公告)日：2016-01-14

    申请号：US14649447

    申请日：2013-11-28

    申请人： A SCHOOL CORPORATION KANSAI UNIVERSITY

    发明人： Yoshiro TAJITSU ,  Yasuyuki KARASAWA

    IPC分类号： B06B1/06 ,  B29C43/56 ,  C08G63/08 ,  H04R17/00 ,  H04R31/00 ,  H04R7/12 ,  B29C43/52 ,  B29C43/02

    CPC分类号： B06B1/0655 ,  B06B1/0644 ,  B29C43/02 ,  B29C43/52 ,  B29C43/56 ,  B29C2043/561 ,  B29K2067/046 ,  B29K2433/12 ,  B29L2031/38 ,  C08G63/08 ,  C08L67/04 ,  G10K9/122 ,  H01L41/193 ,  H01L41/333 ,  H01L41/45 ,  H04R7/12 ,  H04R17/005 ,  H04R31/00 ,  H04R2231/001 ,  H04R2307/025 ,  H04R2499/11 ,  C08L33/12

    摘要： A method for molding capable of molding a piezoelectric polymer into polymer piezoelectric materials having various shapes is provided. A vibration generator using a polymer piezoelectric material and a speaker capable of generating a high sound pressure and achieving flat sound pressure-frequency characteristics are provided. A material formed from a piezoelectric polymer is molded at a temperature not less than the glass transition temperature and less than the crystallization temperature of the piezoelectric polymer and is then heat-treated at a temperature not less than the crystallization temperature of the piezoelectric polymer. A vibration generator comprising a piezoelectric portion formed from a piezoelectric polymer; a first electrode disposed on a first main surface of the piezoelectric portion; and a second electrode disposed on a second main surface of the piezoelectric portion, which has a piezoelectric modulus of 0.5 pC/N or more and satisfies at least one of the following (a) to (c): (a) the ratio of the length in the longitudinal direction to the thickness of the piezoelectric portion is about 100 or more; (b) the ratio of the curvature radius of a curved portion to the thickness of the piezoelectric portion is about 10 or more; and (c) the ratio of the length in the longitudinal direction to the curvature radius of the curved portion of the piezoelectric portion is about 0.01 or more.

    摘要翻译： 提供了一种能够将压电聚合物模塑成具有各种形状的聚合物压电材料的模制方法。 提供一种使用聚合物压电材料的振动发生器和能够产生高声压并实现平坦的声压 - 频率特性的扬声器。 由压电聚合物形成的材料在不低于玻璃化转变温度并低于压电聚合物的结晶温度的温度下成型，然后在不低于压电聚合物的结晶温度的温度下进行热处理。 一种振动发生器，包括由压电聚合物形成的压电部分; 设置在所述压电部的第一主面上的第一电极; 以及设置在所述压电部件的第二主表面上的压电模量为0.5pC / N以上并满足以下（a）〜（c）中的至少一个的第二电极：（a） 长度方向相对于压电部的厚度的长度为约100以上; （b）弯曲部的曲率半径与压电部的厚度的比率为10以上; 和（c）长度方向的长度与压电部的弯曲部的曲率半径的比为0.01以上。