ASSEMBLIES COMPRISING A THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILM, AN ELECTRODE AND AN ABSORBER LAYER, AND METHODS RELATING THERETO
    1.
    发明申请
    ASSEMBLIES COMPRISING A THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILM, AN ELECTRODE AND AN ABSORBER LAYER, AND METHODS RELATING THERETO 审中-公开
    包含耐热和尺寸稳定的聚酰亚胺膜,电极和吸收层的组件以及与其相关的方法

    公开(公告)号:US20110056539A1

    公开(公告)日:2011-03-10

    申请号:US12991203

    申请日:2009-05-18

    摘要: The assemblies of the present invention comprise an electrode, an absorber layer and a polyimide film. The polyimide film contains from about 40 to about 95 weight percent of a polyimide derived from: i. at least one aromatic dianhydride, at least about 85 mole percent of such aromatic dianhydride being a rigid rod type dianhydride, and ii. at least one aromatic diamine, at least about 85 mole percent of such aromatic diamine being a rigid rod type diamine. The polyimide films of the present disclosure further comprise a filler that: i. is less than about 800 nanometers in at least one dimension; ii. has an aspect ratio greater than about 3:1 ; iii. is less than the thickness of the polyimide film in all dimensions; and iv. is present in an amount from about 5 to about 60 weight percent of the total weight of the polyimide film.

    摘要翻译: 本发明的组件包括电极,吸收层和聚酰亚胺膜。 聚酰亚胺膜含有约40至约95重量%的衍生自以下的聚酰亚胺: 至少一个芳族二酐,至少约85摩尔%的这种芳族二酐是刚性棒型二酐,和ii。 至少一个芳族二胺,至少约85摩尔%的这种芳族二胺是刚性棒型二胺。 本公开的聚酰亚胺膜还包含填料,其: 在至少一个维度上小于约800纳米; ii。 长宽比大于3:1; iii。 小于所有尺寸的聚酰亚胺膜的厚度; 和iv。 以聚酰亚胺膜的总重量的约5至约60重量%的量存在。

    THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILMS AND METHODS RELATING THERETO
    6.
    发明申请
    THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILMS AND METHODS RELATING THERETO 审中-公开
    热和尺寸稳定的聚酰亚胺膜及其相关方法

    公开(公告)号:US20120009406A1

    公开(公告)日:2012-01-12

    申请号:US12991192

    申请日:2009-05-11

    IPC分类号: B32B27/20

    摘要: The films of the present disclosure have a thickness from about 8 to about 150 microns and contain from about 40 to about 95 weight percent of a polyimide derived from: i. at least one aromatic dianhydride, at least about 85 mole percent of such aromatic dianhydride being a rigid rod type monomer, and ii. at least one aromatic diamine, at least about 85 mole percent of such aromatic diamine being a rigid rod type monomer. The films of the present disclosure further comprise a filler that: i. is less than about 800 nanometers in at least one dimension; ii. has an aspect ratio greater than about 3:1; iii. is less than the thickness of the film in all dimensions; and iv. is present in an amount from about 5 to about 60 weight percent of the total weight of the film.

    摘要翻译: 本公开的膜具有约8至约150微米的厚度,并且包含约40至约95重量%的衍生自以下的聚酰亚胺: 至少一种芳族二酐,至少约85摩尔%的这种芳族二酐是刚性棒型单体,和ii。 至少一种芳族二胺,至少约85摩尔%的这种芳族二胺是刚性棒型单体。 本公开的膜还包括填料,其:i。 在至少一个维度上小于约800纳米; ii。 长宽比大于3:1; iii。 小于所有尺寸的膜的厚度; 和iv。 的含量为膜的总重量的约5至约60重量%。

    THIN FILM TRANSISTOR COMPOSITIONS, AND METHODS RELATING THERETO
    7.
    发明申请
    THIN FILM TRANSISTOR COMPOSITIONS, AND METHODS RELATING THERETO 有权
    薄膜晶体管组合物及其相关方法

    公开(公告)号:US20110121296A1

    公开(公告)日:2011-05-26

    申请号:US12622789

    申请日:2009-11-20

    IPC分类号: H01L29/04 H01L21/20

    摘要: A process for forming at least one transistor on a substrate is described. The substrate comprises a polyimide and a nanoscopic filler. The polyimide is derived substantially or wholly from rigid rod monomers and the nanoscopic filler has an aspect ratio of at least 3:1. The substrates of the present disclosure are particularly well suited for thin film transistor applications, due at least in part to high resistance to hygroscopic expansion and relatively high levels of thermal and dimensional stability.

    摘要翻译: 描述了在衬底上形成至少一个晶体管的工艺。 衬底包括聚酰亚胺和纳米级填料。 聚酰亚胺基本上或全部来自刚性棒状单体,纳米尺寸填料的纵横比至少为3:1。 本公开的衬底特别适用于薄膜晶体管应用,至少部分地由于高吸湿膨胀性和相对较高水平的热和尺寸稳定性。

    CORONA RESISTANT STRUCTURE AND METHODS RELATING THERETO
    9.
    发明申请
    CORONA RESISTANT STRUCTURE AND METHODS RELATING THERETO 审中-公开
    耐腐蚀结构及其相关方法

    公开(公告)号:US20130209788A1

    公开(公告)日:2013-08-15

    申请号:US13369963

    申请日:2012-02-09

    IPC分类号: B32B27/18 C09J7/02 B32B27/08

    摘要: The present disclosure is directed to a corona resistant structure having a polyimide layer and an adhesive layer. The polyimide layer is composed of a chemically converted polyimide and a corona resistant composite filler. The chemically converted polyimide is derived from at least 50 mole percent of an aromatic dianhydride and at least 50 mole percent of an aromatic diamine. The corona resistant composite filler has an organic component and an inorganic ceramic oxide component. The weight ratio of the organic component to the inorganic ceramic oxide component is from 0.01 to 1.0. At least a portion of the organic component comprises an organo-siloxane moiety or an organo-metaloxane moiety.

    摘要翻译: 本公开涉及具有聚酰亚胺层和粘合剂层的耐电晕结构。 聚酰亚胺层由化学转化的聚酰亚胺和耐电晕复合填料组成。 化学转化的聚酰亚胺衍生自至少50摩尔%的芳族二酐和至少50摩尔%的芳族二胺。 耐电晕复合填料具有有机成分和无机陶瓷氧化物成分。 有机成分与无机陶瓷氧化物成分的重量比为0.01〜1.0。 有机组分的至少一部分包含有机硅氧烷部分或有机 - 金属氧化物部分。

    MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO
    10.
    发明申请
    MATTE FINISH POLYIMIDE FILMS AND METHODS RELATING THERETO 审中-公开
    MATTE FINISH POLYIMIDE FILMS AND METHODS RELATTING THERETO

    公开(公告)号:US20130196134A1

    公开(公告)日:2013-08-01

    申请号:US13811685

    申请日:2011-02-14

    IPC分类号: C08L79/08

    摘要: The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.

    摘要翻译: 本公开涉及厚度为8至152微米,60度光泽值为2至35,光密度大于或等于2且介电强度大于1400V / mil的基膜。 该基膜包含基础膜的71至96重量%的化学转化(部分或全部芳族)聚酰亚胺。 基膜还包含颜料和消光剂。 消光剂的存在量为基膜的1.6至10重量%,中值粒径为1.3至10微米,密度为2至4.5g / cc。 颜料的存在量为基膜的2至9重量%。 本公开还涉及包括基膜与粘合剂层组合的覆盖膜。