摘要:
A structure and method for fabricating a spacer structure for semiconductor devices, such as a multi-gate structure, is provided. The dummy gate structure is formed by depositing a dielectric layer, forming a mask over the dielectric layer, and patterning the dielectric layer. The mask is formed to have a tapered edge. In an embodiment, the tapered edge is formed in a post-patterning process, such as a baking process. In another embodiment, a relatively thick mask layer is utilized such that during patterning a tapered results. The profile of the tapered mask is transferred to the dielectric layer, thereby providing a tapered edge on the dielectric layer.
摘要:
A semiconductor device includes a semiconductor substrate, a source region and a drain region formed in the substrate, a gate structure formed on the substrate disposed between the source and drain regions, and a first isolation structure formed in the substrate between the gate structure and the drain region, the first isolation structure including projections that are located proximate to an edge of the drain region. Each projection includes a width measured in a first direction along the edge of the drain region and a length measured in a second direction perpendicular to the first direction, and adjacent projections are spaced a distance from each other.
摘要:
A semiconductor structure includes a semiconductor substrate; a first high-voltage well (HVW) region of a first conductivity type overlying the semiconductor substrate; a second well region of a second conductivity type opposite the first conductivity type overlying the semiconductor substrate and laterally adjoining the first well region; a gate dielectric extending from over the first well region to over the second well region; a drain region in the second well region; a source region on an opposite side of the gate dielectric than the drain region; and a gate electrode on the gate dielectric. The gate electrode includes a first portion directly over the second well region, and a second portion directly over the first well region. The first portion has a first impurity concentration lower than a second impurity concentration of the second portion.
摘要:
A semiconductor device includes a semiconductor substrate, a source region and a drain region formed in the substrate, a gate structure formed on the substrate disposed between the source and drain regions, and a first isolation structure formed in the substrate between the gate structure and the drain region, the first isolation structure including projections that are located proximate to an edge of the drain region. Each projection includes a width measured in a first direction along the edge of the drain region and a length measured in a second direction perpendicular to the first direction, and adjacent projections are spaced a distance from each other.
摘要:
A high voltage PMOS device having an improved breakdown voltage is achieved. An asymmetrical high voltage integrated circuit structure comprises a gate electrode on a substrate and source and drain regions within the substrate on either side and adjacent to the gate electrode wherein the source region is encompassed by an n-well. A symmetrical high voltage integrated circuit structure comprises a gate electrode on a substrate, source and drain regions within the substrate on either side and adjacent to the gate electrode, and an n-well in the substrate underlying the gate electrode. The n-well in both structures shifts the breakdown point from the silicon surface to the bottom of the source or drain regions.
摘要:
A device of an improvement on the structure of linear actuator primarily includes a motor body and an output shaft, and at one end of the motor body fixed a gear case in which two sets of planetary gear trains fitted, by which a sun gear of one of the planetary gear trains is disposed at the top of output shaft; according to the above mentioned structure, the mesh teeth number between planetary gear is more to enhance the efficiency of resisting shocks and absorbing vibrates for attaining the intention of reducing cost, decreasing weight, diminishing volume, and promoting better outlook.
摘要:
A method of forming an NMOS device with reduced device degradation, generated during a constant current stress, has been developed. The reduced device degradation is attributed to the use of a high temperature oxide (HTO), layer, used as an underlying component of composite insulator spacers, formed on the sides of the NMOS gate structures. After definition of an insulator capped polycide gate structure a thin, (140 to 160 Angstrom), HTO layer is deposited at a temperature between about 700 to 800° C., followed by the deposition of a silicon nitride layer. Definition of the composite insulator layer, comprised with the underlying, HTO, results in NMOS devices with reduced drain current and reduced transconductance values, when compared to counterparts fabricated with composite insulator spacers formed without the thin, HTO layer featured in this invention.
摘要:
An integrated circuit structure includes a semiconductor substrate and a high-voltage metal-oxide-semiconductor (HVMOS) device, which includes a first high-voltage well (HVW) region of a first conductivity type in the semiconductor substrate; a drain region of a second conductivity type opposite the first conductivity type in the semiconductor substrate and spaced apart from the first HVW region; a gate dielectric with at least a portion directly over the first HVW region; and a gate electrode over the gate dielectric. The gate dielectric includes a bottom gate oxide region; and a silicon nitride region over the bottom gate oxide region.
摘要:
A semiconductor device includes a semiconducting substrate having CMOS transistors thereon. A composite etch stop layer including a lowermost silicon oxynitride portion and an uppermost silicon nitride portion is disposed on the semiconducting substrate including the CMOS transistors. At least one dielectric layer is on the composite etch stop layer. A first contact opening extends to a first level through the composite etch stop layer thickness and a second contact opening extends to a second level deeper than the first level through the composite etch stop layer.
摘要:
A device of an improvement on the structure of linear actuator primarily includes a motor body and an output shaft, and at one end of the motor body fixed a gear case in which two sets of planetary gear trains fitted, by which a sun gear of one of the planetary gear trains is disposed at the top of output shaft; according to the above mentioned structure, the mesh teeth number between planetary gear is more to enhance the efficiency of resisting shocks and absorbing vibrates for attaining the intention of reducing cost, decreasing weight, diminishing volume, and promoting better outlook.