公开(公告)号：US09887071B2

公开(公告)日：2018-02-06

申请号：US13328172

申请日：2011-12-16

申请人： Chien-An Chen ,  Yen-Shuo Su ,  Ying Xiao ,  Chin-Hsiang Lin

发明人： Chien-An Chen ,  Yen-Shuo Su ,  Ying Xiao ,  Chin-Hsiang Lin

IPC分类号： H01J37/32 ,  H01L21/311

CPC分类号： H01J37/32963 ,  H01J37/3299 ,  H01L21/31116

摘要： The present disclosure relates to a semiconductor body etching apparatus having a multi-zone end point detection system. In some embodiments, the multi-zone end point detection system has a processing chamber that houses a workpiece that is etched according to an etching process. A plurality of end point detector (EPD) probes are located within the processing chamber. Respective EPD probes are located within different zones in the processing chamber, thereby enabling the detection of end point signals from multiple zones within the processing chamber. The detected end point signals are provided from the plurality of EPD probes to an advanced process control (APC) unit. The APC unit is configured to make a tuning knob adjustment to etching process parameters based upon the detected end point signals and to thereby account for etching non-uniformities.

公开(公告)号：US09133021B2

公开(公告)日：2015-09-15

申请号：US13090852

申请日：2011-04-20

申请人： Hong-Da Chang ,  Hsin-Yi Liao ,  Chun-An Huang ,  Shih-Kuang Chiu ,  Chien-An Chen

发明人： Hong-Da Chang ,  Hsin-Yi Liao ,  Chun-An Huang ,  Shih-Kuang Chiu ,  Chien-An Chen

IPC分类号： H01L29/84 ,  B81C1/00

CPC分类号： B81C1/00301 ,  B81B2201/0264 ,  B81C1/00269 ,  B81C2203/0154 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path.

摘要翻译： 提供了具有压力传感器及其制造方法的晶片级封装。 将具有压力传感器的晶片接合到盖上，并且在晶片上形成电连接焊盘。 在切割盖子之后，进行引线键合和封装处理。 接合线的端部暴露并用作电连接路径。 为了形成压力传感器路径，在晶片的底面上形成底部开口。

公开(公告)号：US20140225796A1

公开(公告)日：2014-08-14

申请号：US13762402

申请日：2013-02-08

申请人： Chien-An Chen ,  Linda Chen

发明人： Chien-An Chen ,  Linda Chen

IPC分类号： H01Q15/00

CPC分类号： H01Q15/0033 ,  H01Q5/45 ,  H01Q19/132 ,  H01Q19/192

摘要： An ultra-wide bandwidth multi-channel offset Cassegrain dichroic antenna system serves for bidirectional signal transmission between a ground-based system and at least one satellite. By properly selecting the high and low frequency band, ultra wide bandwidths for both high and low frequency band signals are provided. The band widths are about 15%, even up-to 50%, of the carrier frequency. Especially, the band widths for high frequency band signals are much wider than that for low frequency band signals. The low frequency band can be from 10.7 up-to 12.75 GHz while the high frequency band can be from 17 up-to 30 GHz. Furthermore, in order to achieve ultra-wide bandwidth, a surface of a dichroic sub-dish is divided into a plurality of unit areas. Arrangements of the metal dichroic element of one unit area are slightly different from another unit area f, while the metal elements on same unit area are identical.

摘要翻译： 超宽带宽多通道偏移卡塞格伦二向色天线系统用于地面系统与至少一颗卫星之间的双向信号传输。 通过适当选择高频和低频带，提供高频和低频信号的超宽带宽。 带宽约为载波频率的15％，甚至高达50％。 特别地，高频带信号的带宽比低频带信号宽。 低频带可以是10.7到12.75GHz，而高频带可以是从17到高达30GHz。 此外，为了实现超宽带宽，二向色子盘的表面被分成多个单位区域。 一个单位面积的金属二向色元件的布置与另一个单位面积f略有不同，而同一单位面积上的金属元素是相同的。

公开(公告)号：US08654532B2

公开(公告)日：2014-02-18

申请号：US13297446

申请日：2011-11-16

申请人： Chien-An Chen ,  Wei-Ta Shih

发明人： Chien-An Chen ,  Wei-Ta Shih

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  F28F9/0246 ,  Y10T137/4456 ,  Y10T137/598 ,  Y10T137/87161 ,  Y10T137/87949

摘要： A cooling coolant pipe of a server cabinet includes multiple tube bodies interconnected in series and at least one adjustable valve. In each of the tube bodies a first chamber and a second chamber that are adjacent to and separated from each other, the second chambers of the two adjacent tube bodies are in communication with each other, and a wall surface of each of the tube bodies has at least one connection port in communication with the first chamber. The adjustable valve is disposed in one of the tube bodies. The first chamber in each of the tube bodies is in communication with the second chamber in the tube body through the adjustable valve. In this way, the adjustable valve adjusts the flow rate of a cooling fluid flowing from the second chamber to the first chamber.

摘要翻译： 服务器机柜的冷却冷却剂管包括串联连接的多个管体和至少一个可调节阀。 在每个管体中，彼此相邻并分离的第一腔室和第二腔室，两个相邻管体的第二腔室彼此连通，并且每个管体的壁表面具有 与第一室连通的至少一个连接端口。 可调节阀设置在管体之一中。 每个管体中的第一腔室通过可调节阀与管体中的第二腔室连通。 以这种方式，可调节阀调节从第二室流向第一室的冷却流体的流量。

公开(公告)号：US20130157387A1

公开(公告)日：2013-06-20

申请号：US13328172

申请日：2011-12-16

申请人： Chien-An Chen ,  Yen-Shuo Su ,  Ying Xiao ,  Chin-Hsiang Lin

发明人： Chien-An Chen ,  Yen-Shuo Su ,  Ying Xiao ,  Chin-Hsiang Lin

IPC分类号： H01L21/66 ,  H01L21/306

CPC分类号： H01J37/32963 ,  H01J37/3299 ,  H01L21/31116

摘要： The present disclosure relates to a semiconductor body etching apparatus having a multi-zone end point detection system. In some embodiments, the multi-zone end point detection system has a processing chamber that houses a workpiece that is etched according to an etching process. A plurality of end point detector (EPD) probes are located within the processing chamber. Respective EPD probes are located within different zones in the processing chamber, thereby enabling the detection of end point signals from multiple zones within the processing chamber. The detected end point signals are provided from the plurality of EPD probes to an advanced process control (APC) unit. The APC unit is configured to make a tuning knob adjustment to etching process parameters based upon the detected end point signals and to thereby account for etching non-uniformities.

摘要翻译： 本公开涉及具有多区域端点检测系统的半导体本体蚀刻装置。 在一些实施例中，多区域终点检测系统具有容纳根据蚀刻工艺被蚀刻的工件的处理室。 多个端点检测器（EPD）探针位于处理室内。 相应的EPD探针位于处理室中的不同区域内，从而能够检测来自处理室内的多个区域的终点信号。 检测到的终点信号从多个EPD探针提供给高级处理控制（APC）单元。 APC单元被配置为基于检测到的终点信号对调谐旋钮进行蚀刻工艺参数调整，从而考虑蚀刻非均匀性。

公开(公告)号：US20130127055A1

公开(公告)日：2013-05-23

申请号：US13434691

申请日：2012-03-29

申请人： Chien-An CHEN ,  Wen-Jiun LIU ,  Chun-Chieh LIN ,  Hung-Wen SU ,  Ming-Hsing TSAI ,  Syun-Ming JANG

发明人： Chien-An CHEN ,  Wen-Jiun LIU ,  Chun-Chieh LIN ,  Hung-Wen SU ,  Ming-Hsing TSAI ,  Syun-Ming JANG

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76877 ,  H01L21/76802 ,  H01L21/76819 ,  H01L21/76834 ,  H01L21/76843 ,  H01L21/76847 ,  H01L21/76849 ,  H01L21/7685 ,  H01L21/76864 ,  H01L21/76882 ,  H01L21/76886 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： The mechanisms of forming an interconnect structures described above involves using a reflowed conductive layer. The reflowed conductive layer is thicker in smaller openings than in wider openings. The mechanisms may further involve forming a metal cap layer over the reflow conductive layer, in some embodiments. The interconnect structures formed by the mechanisms described have better electrical and reliability performance.

摘要翻译： 形成上述互连结构的机理涉及使用回流导电层。 较小的开口中的回流导电层比较宽的开口厚。 在一些实施例中，这些机构还可以包括在回流导电层上形成金属盖层。 由所述机构形成的互连结构具有更好的电气和可靠性性能。

公开(公告)号：US20130118710A1

公开(公告)日：2013-05-16

申请号：US13409965

申请日：2012-03-01

申请人： Chien-An Chen ,  Kai-Yang Tung

发明人： Chien-An Chen ,  Kai-Yang Tung

IPC分类号： F28D15/00 ,  F25D31/00

CPC分类号： F25D31/00 ,  F28D15/00 ,  F28D15/06 ,  F28D2021/0028

摘要： A server rack heat dissipation system for a server including an electronic component comprises a first and a second heat dissipation assembly. The first heat dissipation assembly includes a first heat exchanger and a first pipeline. The first heat exchanger is inside the server rack and in thermal contact with the electronic component. The first pipeline is in thermal contact with the first heat exchanger and has a first coolant. The second heat dissipation assembly includes a second heat exchanger. The second heat exchanger is inside the server rack and in thermal contact with the first pipeline. The second heat exchanger can remove the heat of the electronic component in the first coolant in advance. Accordingly, the time of the first coolant being maintained in a vapor phase can be shortened, so that a power the fluid driving device used for driving the first coolant is reduced.

摘要翻译： 一种用于包括电子部件的服务器的服务器机架散热系统包括第一和第二散热组件。 第一散热组件包括第一热交换器和第一管道。 第一个热交换器在服务器机架内部，并与电子元件热接触。 第一管道与第一热交换器热接触并具有第一冷却剂。 第二散热组件包括第二热交换器。 第二个热交换器在服务器机架内部，并与第一个管道热接触。 第二热交换器可以预先去除第一冷却剂中的电子部件的热量。 因此，可以缩短保持在蒸气相中的第一冷却剂的时间，从而减少用于驱动第一冷却剂的流体驱动装置的功率。

公开(公告)号：US08386062B2

公开(公告)日：2013-02-26

申请号：US12923018

申请日：2010-08-30

申请人： Hong-Tzong Yau ,  Chuan-Chu Kuo ,  Jiun-Ren Chen ,  Chien-An Chen ,  Lee-Sen Tsou

发明人： Hong-Tzong Yau ,  Chuan-Chu Kuo ,  Jiun-Ren Chen ,  Chien-An Chen ,  Lee-Sen Tsou

IPC分类号： A61C5/00 ,  A61C5/10 ,  A61C8/00 ,  A61C9/00 ,  G06F19/00

CPC分类号： A61C8/005 ,  A61C8/0001 ,  A61C8/0077 ,  A61C13/0004

摘要： A method of preparing a digital model and an artificial tooth applied to dental implant includes the steps of a) combining a jig into a fixture in a patient's oral cavity and scanning the patient's oral cavity by an oral scanner to acquire a first oral digital data and saving it in a computer; b) operating the computer to select one of digital prostheses from a prosthetic database in the computer, arranging a digital positioning jig to correspond to the jig in the first oral digital data, and then combining the selected digital prosthesis with the first oral digital data to generate a second oral data; c) generating a digital oral model based on the second oral digital data; and d) creating a solid oral model.

摘要翻译： 一种制备应用于牙科植入物的数字模型和人造牙齿的方法包括以下步骤：a）将夹具组合到患者口腔中的夹具中并通过口腔扫描仪扫描患者的口腔以获得第一口头数字数据， 将其保存在计算机中; b）操作所述计算机以从所述计算机中的假肢数据库中选择一个数字假体，在所述第一口头数字数据中布置数字定位夹具以对应于所述夹具，然后将所选择的数字假体与所述第一口头数字数据组合到 产生第二个口头资料; c）基于第二口头数字数据产生数字口头模型; 和d）创建一个坚实的口头模式。

公开(公告)号：US20120136487A1

公开(公告)日：2012-05-31

申请号：US13118936

申请日：2011-05-31

申请人： CHIH-CHIEN LIN ,  CHIEN-AN CHEN

发明人： CHIH-CHIEN LIN ,  CHIEN-AN CHEN

IPC分类号： G05D23/19

CPC分类号： H05K7/20836 ,  G05D23/1932

摘要： A modulized heat-dissipation control method for a datacenter is provided. In this method, a temperature sensor is used to sense inner temperatures of multiple servers and CPU temperatures in the multiple servers. If any one of the CPU temperatures is abnormal, a flow of a first coolant is adjusted. If any one of the inner temperatures is abnormal, a rotating speed of a fan module is adjusted. If the rotating speed of the fan module has reached its maximum, a flow of a second coolant is adjusted.

摘要翻译： 提供了一种用于数据中心的模块化散热控制方法。 在这种方法中，温度传感器用于检测多个服务器的内部温度和多个服务器中的CPU温度。 如果任何一个CPU温度异常，则调节第一冷却液的流量。 如果任何一个内部温度异常，则调节风扇模块的转速。 如果风扇模块的转速达到其最大值，则调节第二冷却剂的流量。

公开(公告)号：US08135492B2

公开(公告)日：2012-03-13

申请号：US12713849

申请日：2010-02-26

申请人： Hong-Tzong Yau ,  Chuan-Chu Kuo ,  Jiun-Ren Chen ,  Chun-Chun Yang ,  Chien-An Chen ,  Ying-Li Chen

发明人： Hong-Tzong Yau ,  Chuan-Chu Kuo ,  Jiun-Ren Chen ,  Chun-Chun Yang ,  Chien-An Chen ,  Ying-Li Chen

IPC分类号： G06F19/00 ,  A61C9/00 ,  A61C13/08

CPC分类号： A61C1/084 ,  A61C13/0004

摘要： A method of making a surgical template used for a computer-guided dental implant surgery includes the steps of: establishing implant planning data of a patient's jaw, producing a digital plaster model of the patient's jaw, allowing the digital plaster model to have the implant planning data, integrating the digital plaster model with the implant planning data to obtain a digital machining data, holding and machining a modeling block at a machining position according to the digital machining data to form a solid jaw model corresponding to the patient's jaw and having teeth, gums, and at least one implant-position indicating structure, mounting a positioning member at the implant-position indicating structure, and producing a negative template body from an assembly of the solid jaw model and the positioning member with a thermoplastic dental material by a molding process or a vacuum forming process.

摘要翻译： 制作用于计算机引导的牙科植入手术的手术模板的方法包括以下步骤：建立患者颌骨的植入计划数据，产生患者颌骨的数字膏药模型，允许数字膏药模型进行植入计划 数据，将数字石膏模型与植入物计划数据集成以获得数字加工数据，根据数字加工数据在加工位置保持和加工建模块，以形成对应于患者颌骨并具有牙齿的实心颌模型， 牙龈和至少一个植入位置指示结构，将定位构件安装在植入位置指示结构处，以及通过模制件从固体颌模型和定位构件的组件产生负模板体 工艺或真空成型工艺。