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    Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode
    1.
    发明授权
    Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode 有权
    具有非对称电极的内置电容器的电容装置和制造方法

    公开(公告)号：US07102874B2

    公开(公告)日：2006-09-05

    申请号：US10895116

    申请日：2004-07-21

    申请人： Uei-Ming Jow ,  Ying-Jiunn Lai ,  Chun-Kun Wu ,  Pel-Shen Wei ,  Chang-Sheng Chen ,  Ching-Liang Weng

    发明人： Uei-Ming Jow ,  Ying-Jiunn Lai ,  Chun-Kun Wu ,  Pel-Shen Wei ,  Chang-Sheng Chen ,  Ching-Liang Weng

    IPC分类号： H01G4/06 ,  H01G4/08 ,  H01G4/30

    CPC分类号： H01G4/012 ,  H05K1/0298 ,  H05K1/162 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09672

    摘要： The present invention describes an intermediate for use in a capacitive printed circuit board (PCB), which relates to a capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode used to reduce inaccuracy of the error compression alignment on laminates. The invention employs a plurality of different sized metal laminates stacked for a built-in capacitor to achieve a high-precise capacitor PCB. More particularly, the invention can raise the capability of noise-immunity of a capacitive PCB applied to high frequency/speed modules and systems, and also provides precise capacitance to regular circuit design for the need of compact package and high-precise capacitance in the future.

    摘要翻译： 本发明描述了一种用于电容式印刷电路板（PCB）的中间体，其涉及一种用于具有非对称电极的内置电容器的电容性装置和制造方法，所述电容器用于减少层压板上的误差压缩对准的不精确性 。 本发明采用多个不同尺寸的金属层压板，其堆叠用于内置电容器以实现高精度电容器PCB。 更具体地，本发明可以提高应用于高频/速度模块和系统的电容PCB的抗噪声能力，并且为将来需要紧凑封装和高精度电容的​​常规电路设计提供精确的电容 。

    Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode
    3.
    发明申请
    Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode 有权
    具有非对称电极的内置电容器的电容装置和制造方法

    公开(公告)号：US20050168913A1

    公开(公告)日：2005-08-04

    申请号：US10895116

    申请日：2004-07-21

    申请人： Uei-Ming Jow ,  Ying-Jiunn Lai ,  Chun-Kun Wu ,  Pel-Shen Wei ,  Chang-Sheng Chen ,  Ching-Liang Weng

    发明人： Uei-Ming Jow ,  Ying-Jiunn Lai ,  Chun-Kun Wu ,  Pel-Shen Wei ,  Chang-Sheng Chen ,  Ching-Liang Weng

    IPC分类号： H01G4/005 ,  H01G4/012 ,  H05K1/00 ,  H05K1/16

    CPC分类号： H01G4/012 ,  H05K1/0298 ,  H05K1/162 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09672

    摘要： The present invention describes an intermediate for use in a capacitive printed circuit board (PCB), which relates to a capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode used to reduce inaccuracy of the error compression alignment on laminates. The invention employs a plurality of different sized metal laminates stacked for a built-in capacitor to achieve a high-precise capacitor PCB. More particularly, the invention can raise the capability of noise-immunity of a capacitive PCB applied to high frequency/speed modules and systems, and also provides precise capacitance to regular circuit design for the need of compact package and high-precise capacitance in the future.

    摘要翻译： 本发明描述了一种用于电容式印刷电路板（PCB）的中间体，其涉及一种用于具有非对称电极的内置电容器的电容性装置和制造方法，所述非对称电极用于减少层压板上的误差压缩对准的不准确性 。 本发明采用多个不同尺寸的金属层压板，其堆叠用于内置电容器以实现高精度电容器PCB。 更具体地，本发明可以提高应用于高频/速度模块和系统的电容PCB的抗噪声能力，并且为将来需要紧凑封装和高精度电容的​​常规电路设计提供精确的电容 。

    Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication
    6.
    发明授权
    Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication 有权
    具有接地屏蔽层的嵌入式微电子电容器及其制造方法

    公开(公告)号：US06969912B2

    公开(公告)日：2005-11-29

    申请号：US10713804

    申请日：2003-11-14

    申请人： Uei-Ming Jow ,  Pei-Shen Wei ,  Ching-Liang Weng ,  Chun-Kun Wu ,  Chang-Sheng Chen ,  Ying-Jiunn Lai

    发明人： Uei-Ming Jow ,  Pei-Shen Wei ,  Ching-Liang Weng ,  Chun-Kun Wu ,  Chang-Sheng Chen ,  Ying-Jiunn Lai

    IPC分类号： H01L21/4763 ,  H01L23/053 ,  H01L23/48 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46

    CPC分类号： H05K1/162 ,  H05K1/0218 ,  H05K1/0219 ,  H05K3/4602 ,  H05K2201/0723 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09672

    摘要： An embedded microelectronic capacitor incorporating at least one ground shielding layer is provided which includes an upper ground shielding layer that has an aperture therethrough; an electrode plate positioned spaced-apart from the upper ground shielding layer that has a via extending upwardly away from the electrode plate through the aperture in the upper ground shielding layer providing electrical communication to the electrode plate without shorting to the upper ground shielding layer; a middle ground shielding layer positioned in the same plane of the electrode plate, surrounding while spaced-apart from the electrode plate at a predetermined distance; a lower ground shielding layer positioned spaced-apart from the electrode plate in an opposing relationship to the upper ground shielding layer; and a dielectric material embedding the upper ground shielding layer; the middle ground shielding layer and the lower ground shielding layer.

    摘要翻译： 提供了包括至少一个接地屏蔽层的嵌入式微电子电容器，其包括具有穿过其中的孔的上接地屏蔽层; 与所述上接地屏蔽层间隔开的电极板，所述电极板具有通过所述上接地屏蔽层中的孔向上远离所述电极板延伸的通孔，所述通孔提供与所述电极板的电连通而不与所述上接地屏蔽层短路; 位于电极板的同一平面中的中间屏蔽层，以与预定距离的电极板隔开间隔开; 与所述上接地屏蔽层相对的位置与所述电极板隔开定位的下接地屏蔽层; 以及嵌入上接地屏蔽层的电介质材料; 中间接地屏蔽层和下部接地屏蔽层。