Dry non-plasma treatment system and method of using
    1.
    发明授权
    Dry non-plasma treatment system and method of using 有权
    干式非等离子体处理系统及其使用方法

    公开(公告)号:US07718032B2

    公开(公告)日:2010-05-18

    申请号:US11425883

    申请日:2006-06-22

    IPC分类号: C23F1/00

    摘要: A dry non-plasma treatment system and method for removing oxide material is described. The treatment system is configured to provide chemical treatment of one or more substrates, wherein each substrate is exposed to a gaseous chemistry, including HF and optionally NH3, under controlled conditions including surface temperature and gas pressure. Furthermore, the treatment system is configured to provide thermal treatment of each substrate, wherein each substrate is thermally treated to remove the chemically treated surfaces on each substrate.

    摘要翻译: 描述了干燥的非等离子体处理系统和用于去除氧化物材料的方法。 处理系统被配置为提供一个或多个基底的化学处理,其中每个基底在包括表面温度和气体压力的受控条件下暴露于包括HF和任选的NH 3的气态化学物质。 此外,处理系统被配置为提供每个基板的热处理,其中每个基板被热处理以去除每个基板上的经化学处理的表面。

    TEMPERATURE CONTROLLED SUBSTRATE HOLDER WITH NON-UNIFORM INSULATION LAYER FOR A SUBSTRATE PROCESSING SYSTEM
    2.
    发明申请
    TEMPERATURE CONTROLLED SUBSTRATE HOLDER WITH NON-UNIFORM INSULATION LAYER FOR A SUBSTRATE PROCESSING SYSTEM 有权
    用于基板加工系统的非均匀绝缘层的温度控制基板支架

    公开(公告)号:US20100078424A1

    公开(公告)日:2010-04-01

    申请号:US12631278

    申请日:2009-12-04

    IPC分类号: H05B1/02 H05B3/68 G05D23/30

    摘要: A substrate holder for supporting a substrate in a processing system includes a temperature controlled support base having a first temperature, and a substrate support opposing the temperature controlled support base and configured to support the substrate. Also included is one or more heating elements coupled to the substrate support and configured to heat the substrate support to a second temperature above the first temperature, and a thermal insulator disposed between the temperature controlled support base and the substrate support. The thermal insulator includes a non-uniform spatial variation of the heat transfer coefficient (W/m2-K) through the thermal insulator between the temperature controlled support base and the substrate support.

    摘要翻译: 用于在处理系统中支撑衬底的衬底保持器包括具有第一温度的温度控制的支撑基座和与温度受控的支撑基座相对并且被配置为支撑衬底的衬底支撑件。 还包括一个或多个加热元件,其耦合到衬底支撑件并且被配置为将衬底支撑件加热到高于第一温度的第二温度,以及设置在温度受控支撑基底和衬底支撑件之间的热绝缘体。 热绝缘体包括通过温度控制的支撑基底和基底支撑件之间的热绝缘体的传热系数(W / m 2 -K)的不均匀的空间变化。

    Directed gas injection apparatus for semiconductor processing
    3.
    发明授权
    Directed gas injection apparatus for semiconductor processing 有权
    用于半导体加工的定向气体注入装置

    公开(公告)号:US07217336B2

    公开(公告)日:2007-05-15

    申请号:US10482210

    申请日:2002-06-20

    申请人: Eric J. Strang

    发明人: Eric J. Strang

    摘要: A method and system (1) for utilizing shaped orifices (e.g., sonic and simple orifices, and divergent nozzles) in the gas inject system (20) as part of a plasma process system. By utilizing the shaped orifices, directionality of gas flow (25) can be improved. This improvement is especially beneficial in high aspect ratio processing.

    摘要翻译: 一种用于在气体注入系统(20)中利用成形孔(例如,声音和简单孔和发散喷嘴)作为等离子体处理系统的一部分的方法和系统(1)。 通过利用成形孔,可以提高气流(25)的方向性。 这种改进在高纵横比处理中特别有益。

    Method and system for electron density measurement
    4.
    发明授权
    Method and system for electron density measurement 有权
    电子密度测量方法和系统

    公开(公告)号:US07177781B2

    公开(公告)日:2007-02-13

    申请号:US10521118

    申请日:2003-07-23

    IPC分类号: G06F11/30

    摘要: The present invention provides a diagnostic system for plasma processing, wherein the diagnostic system comprises a multi-modal resonator, a power source, a detector, and a controller. The controller is coupled to the power source and the detector and it is configured to provide a man-machine interface for performing several monitoring and controlling functions associated with the diagnostic system including: a Gunn diode voltage monitor, a Gunn diode current monitor, a varactor diode voltage monitor, a detector voltage monitor, a varactor voltage control, a varactor voltage sweep control, a resonance lock-on control, a graphical user control, and an electron density monitor. The diagnostic system can further provide a remote controller coupled to the controller and configured to provide a remote man-machine interface. The remote man-machine interface. The remote man-machine interface can provide a graphical user interface in order to permit remote control of the diagnostic system by an operator. In addition, the present invention provides several methods of controlling the diagnostic system in order to perform both monitor and control functions.

    摘要翻译: 本发明提供了一种用于等离子体处理的诊断系统,其中诊断系统包括多模谐振器,电源,检测器和控制器。 控制器耦合到电源和检测器,并且其被配置为提供用于执行与诊断系统相关联的多个监视和控制功能的人机接口,包括:耿氏二极管电压监视器,耿氏二极管电流监视器,变容二极管 二极管电压监视器,检测器电压监视器,变容二极管电压控制,变容二极管电压扫描控制,共振锁定控制,图形用户控制和电子密度监视器。 诊断系统还可以提供耦合到控制器并被配置为提供远程人机界面的遥控器。 远程人机界面。 远程人机界面可以提供图形用户界面,以便允许操作者对诊断系统进行远程控制。 此外,本发明提供了几种控制诊断系统以便执行监视和控制功能的方法。

    Method and apparatus for improved plasma processing uniformity
    5.
    发明授权
    Method and apparatus for improved plasma processing uniformity 有权
    改善等离子体处理均匀性的方法和装置

    公开(公告)号:US07164236B2

    公开(公告)日:2007-01-16

    申请号:US10793253

    申请日:2004-03-05

    IPC分类号: H05B31/26 C23F1/00

    摘要: A method and apparatus for generating and controlling a plasma (130) formed in a capacitively coupled plasma system (100) having a plasma electrode (140) and a bias electrode in the form of a workpiece support member (170), wherein the plasma electrode is unitary and has multiple regions (Ri) defined by a plurality of RF power feed lines (156) and the RF power delivered thereto. The electrode regions may also be defined as electrode segments (420) separated by insulators (426). A set of process parameters A={n, τi, Φi, Pi, S; Li} is defined; wherein n is the number of RF feed lines connected to the electrode upper surface at locations Li, τi is the on-time of the RF power for the ith RF feed line, Φi is the phase of the ith RF feed line relative to a select one of the other RF feed lines, Pi is the RF power delivered to the electrode through the ith RF feed line at location Li, and S is the sequencing of RF power to the electrode through the RF feed lines. One or more of these parameters are adjusted so that operation of the plasma system results in a workpiece (176) being processed with a desired amount or degree of process uniformity.

    摘要翻译: 一种用于产生和控制形成在电容耦合等离子体系统(100)中的等离子体(130)的方法和装置,其具有工件支撑构件(170)形式的等离子体电极(140)和偏置电极,其中等离子体电极 是单一的并且具有由多个RF馈电线(156)限定的多个区域(RF)和传递给其的RF功率。 电极区域也可以被定义为由绝缘体(426)分离的电极段(420)。 一组过程参数A = {n,τi,i,P i, 被定义; 其中n是在位置L i1处连接到电极上表面的RF馈送线的数量,τi是针对i 是相对于其他RF馈线中选择的一个RF馈线的第i个RF馈线的相位,P < SUB> i 是通过位置L i i处的第i个RF馈线传送到电极的RF功率,S是RF功率到 电极通过RF馈线。 调整这些参数中的一个或多个,使得等离子体系统的操作导致以期望的量或程度的均匀度处理工件(176)。

    Method and apparatus for determining consumable lifetime
    6.
    发明授权
    Method and apparatus for determining consumable lifetime 有权
    用于确定消耗寿命的方法和装置

    公开(公告)号:US07108751B2

    公开(公告)日:2006-09-19

    申请号:US10739126

    申请日:2003-12-19

    申请人: Eric J. Strang

    发明人: Eric J. Strang

    CPC分类号: H01J37/3244 H01J37/32935

    摘要: A plasma processing device comprising a gas injection system is described, wherein the gas injection system comprises a gas injection assembly body, a consumable gas inject plate coupled to the gas injection assembly body, and a pressure sensor coupled to a gas injection plenum formed by the gas injection system body and the consumable gas inject plate. The gas injection system is configured to receive a process gas from at least one mass flow controller and distribute the process gas to the processing region within the plasma processing device, and the pressure sensor is configured to measure a gas injection pressure within the gas injection plenum. A controller, coupled to the pressure sensor, is configured to receive a signal from the pressure sensor and to determine a state of the consumable gas inject plate based upon the signal. A method of determining the state of the consumable gas inject plate comprises: measuring a change in the gas injection pressure associated with either a change in the process gas mass flow rate or the processing pressure; determining a response time for the change in pressure; and comparing the response time during erosion to a response time during no erosion.

    摘要翻译: 描述了包括气体注入系统的等离子体处理装置,其中气体注入系统包括气体注入组件主体,联接到气体注入组件主体的可消耗气体注入板,以及耦合到气体注入系统 气体注入系统体和消耗气体注入板。 气体注入系统被配置为从至少一个质量流量控制器接收处理气体并将处理气体分配到等离子体处理装置内的处理区域,并且压力传感器被配置成测量气体注入气室内的气体注入压力 。 耦合到压力传感器的控制器被配置为从压力传感器接收信号并且基于该信号来确定可消耗气体注入板的状态。 确定可消耗气体注入板的状态的方法包括:测量与处理气体质量流量或处理压力的变化相关联的气体注入压力的变化; 确定压力变化的响应时间; 并将侵蚀期间的响应时间与不侵蚀期间的响应时间进行比较。

    Directed gas injection apparatus for semiconductor processing
    7.
    发明授权
    Directed gas injection apparatus for semiconductor processing 有权
    用于半导体加工的定向气体注入装置

    公开(公告)号:US07103443B2

    公开(公告)日:2006-09-05

    申请号:US10482341

    申请日:2002-06-20

    申请人: Eric J. Strang

    发明人: Eric J. Strang

    IPC分类号: G06F19/00

    CPC分类号: H01J37/3244 H01L21/67017

    摘要: A method and system for utilizing a gas injection plate comprising a number of shaped orifices (e.g., sonic and simple orifices, and divergent nozzles) in the gas inject system as part of a plasma processing system. By utilizing the shaped orifices, directionality of gas flow can be improved. This improvement is especially beneficial in high aspect ratio processing.

    摘要翻译: 作为等离子体处理系统的一部分,在气体注入系统中利用包括多个成形孔(例如,声音和简单孔和发散喷嘴)的气体注射板的方法和系统。 通过利用成形孔,可以改善气流的方向性。 这种改进在高纵横比处理中特别有益。

    Multi-zone resistance heater
    8.
    发明授权
    Multi-zone resistance heater 失效
    多区电阻加热器

    公开(公告)号:US06740853B1

    公开(公告)日:2004-05-25

    申请号:US10088504

    申请日:2002-09-17

    IPC分类号: H05B368

    摘要: A substrate holder for holding a substrate (e.g., a wafer or an LCD panel) during plasma processing. The substrate holder is a stack of processing elements which each perform at least one function. The elements include an electrostatic chuck (102), an He gas distribution system (122), multi-zone heating plates (132), and multi-zone cooling system (152). Each element is designed to match the characteristic of the processing system, e.g., by applying heat based on a heat loss characteristic of the substrate during normal processing. The integrated design allows for precise control of the operating conditions, including, but not limited to, fast heating and fast cooling of a substrate.

    摘要翻译: 用于在等离子体处理期间保持衬底(例如,晶片或LCD面板)的衬底保持器。 衬底保持器是一堆处理元件,每个处理元件执行至少一个功能。 这些元件包括静电卡盘(102),He气体分配系统(122),多区域加热板(132)和多区域冷却系统(152)。 每个元件被设计成与处理系统的特性匹配,例如通过在正常处理期间基于衬底的热损失特性施加热量。 集成设计允许对操作条件的精确控制,包括但不限于快速加热和快速冷却基板。

    Method and apparatus for atomic layer deposition
    9.
    发明授权
    Method and apparatus for atomic layer deposition 有权
    用于原子层沉积的方法和装置

    公开(公告)号:US08562743B2

    公开(公告)日:2013-10-22

    申请号:US13098991

    申请日:2011-05-02

    申请人: Eric J. Strang

    发明人: Eric J. Strang

    IPC分类号: C23C16/00 C23F1/00 H01L21/306

    摘要: A high pressure processing system including a chamber configured to house a substrate. A fluid introduction system includes at least one composition supply system configured to supply a first composition and a second composition, and at least one fluid supply system configured to supply a fluid. The fluid supply system is configured to alternately and discontinuously introduce the first composition and the second composition to the chamber within the fluid.

    摘要翻译: 一种高压处理系统,包括被构造成容纳基板的室。 流体引入系统包括配置成供应第一组合物和第二组合物的至少一种组合物供应系统,以及配置成供应流体的至少一个流体供应系统。 流体供应系统被配置为交替地和不连续地将第一组合物和第二组合物引入流体内的室。

    THERMALLY ZONED SUBSTRATE HOLDER ASSEMBLY
    10.
    发明申请
    THERMALLY ZONED SUBSTRATE HOLDER ASSEMBLY 审中-公开
    热隔离的基座支架组件

    公开(公告)号:US20120067866A1

    公开(公告)日:2012-03-22

    申请号:US13307176

    申请日:2011-11-30

    IPC分类号: H05B3/02 F25B21/02

    CPC分类号: H01L21/67103 Y10T279/23

    摘要: A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature control elements. The insulator is made from an insulting material having a lower coefficient of thermal conductivity than the base (e.g., a gas- or vacuum-filled chamber).

    摘要翻译: 一种热分区衬底保持器,其包括基本上圆柱形的基部,其具有构造成支撑衬底的顶表面和底表面。 多个温度控制元件设置在基座内。 绝缘体将温度控制元件热分离。 绝缘体由具有比基底(例如,气体或真空填充的室)更低的导热系数的绝缘材料制成。