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公开(公告)号：US4913768A
公开(公告)日：1990-04-03
申请号：US293261
申请日：1989-01-04
CPC分类号： C23C2/02 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/426 , H05K2201/0344 , H05K2201/0347 , H05K2203/072 , H05K2203/0723 , H05K2203/1152 , Y10T29/49165
摘要： Conductor boards with well adhering conductor tracks are obtained if the substrates, which are clad on both sides with copper foils, have said cladding removed chemically or mechanically, are activated, if necessary sensitized, and are provided with a 0.05-2.0 .mu.m thick layer of nickel, cobalt, manganese, a nickel/iron or nickel/cobalt mixture in an electroless metallizing bath, a 0.5-5.0 .mu.m thick copper layer is applied in a subsequent copper bath and the conductor pattern is then built up by the standard semi-additive methods.
摘要翻译： 如果需要增敏的情况下，如果需要增敏的情况下，如果用铜箔包覆的基片具有化学或机械去除的所述包层被激活，并且设置有0.05-2.0μm厚的层，则获得具有良好粘附的导体轨迹的导体板 的镍，钴，锰，镍/铁或镍/钴混合物，在随后的铜浴中加入0.5-5.0μm厚的铜层，然后将导体图案由标准半 加法方法。
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2.发明授权
公开(公告)号：US4764401A
公开(公告)日：1988-08-16
申请号：US7706
申请日：1987-01-28
CPC分类号： C23C18/28
摘要： A mild and simple process of activating substrate surfaces for the purpose of currentless metallization comprises using organometallic compounds of elements of the groups 1B and 8 of the Periodic System of Elements whose organic moiety has at least one functional group over and above the groups required for binding the metal are used for activation.
摘要翻译： 为了无电流金属化的目的，激活底物表面的温和和简单的方法包括使用元素周期表的元素组1B和8元素的有机金属化合物，其有机部分具有超过结合所需基团的至少一个官能团 金属用于激活。
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3.发明授权
公开(公告)号：US4493861A
公开(公告)日：1985-01-15
申请号：US449043
申请日：1982-12-13
CPC分类号： C23C18/28
摘要： A simple and mild method of activating substrate surfaces for currentless metallization involves activating by means of organometallic compounds of elements of the 1st and 8th sub-Groups of the Periodic Table of Elements in which the organic moiety consists of oligomeric, prepolymeric or polymeric compounds containing double bonds.
摘要翻译： 用于无电镀金属化的活化底物表面的简单和温和的方法包括通过元素周期表第1和第8族的元素的有机金属化合物进行活化，其中有机部分由含双键的低聚预聚物或聚合物组成 债券。
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公开(公告)号：US5378268A
公开(公告)日：1995-01-03
申请号：US788957
申请日：1991-11-07
申请人： Gerhard D. Wolf , Kirkor Sirinyan , Wolfgang Henning , Rudolf Merten , Ulrich V. Gizycki , Bruce Benda
发明人： Gerhard D. Wolf , Kirkor Sirinyan , Wolfgang Henning , Rudolf Merten , Ulrich V. Gizycki , Bruce Benda
IPC分类号： C08J7/04 , C09D5/38 , C09D175/00 , C09D175/04 , C23C18/18 , C23C18/28 , G12B17/02 , H05K9/00
CPC分类号： C23C18/28
摘要： Primers, essentially consisting of a film former or matrix former, an additive, an ionic and/or colloidal noble metal, a filler and a solvent, are suitable for coating substrate surfaces for subsequent chemical metallization.
摘要翻译： 基本上由成膜剂或基体成型剂，添加剂，离子和/或胶体贵金属，填料和溶剂组成的引物适用于涂覆基材表面用于随后的化学金属化。
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公开(公告)号：US4542074A
公开(公告)日：1985-09-17
申请号：US618973
申请日：1984-06-11
申请人： Kirkor Sirinyan , Rudolf Merten , Gerhard D. Wolf , Henning Giesecke , Uwe Claussen , Harold Ebneth
发明人： Kirkor Sirinyan , Rudolf Merten , Gerhard D. Wolf , Henning Giesecke , Uwe Claussen , Harold Ebneth
IPC分类号： H01L31/04 , H01L21/288 , H01L21/445 , B32B15/04 , B05D5/12
CPC分类号： H01L21/445 , H01L21/288 , H01L2924/0002 , Y10T428/31678
摘要： The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the I and VIII Secondary Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallization without current.
摘要翻译： 通过用元素周期表的I和VIII二级元素的金属的有机金属化合物进行活化，半导体表面的牢固粘合的金属化，特别是部分金属化是可能的，而不会酸洗，然后以常规 方式和金属化没有电流。
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公开(公告)号：US4847139A
公开(公告)日：1989-07-11
申请号：US89095
申请日：1987-08-25
CPC分类号： H05K3/381 , H05K3/181 , H05K1/0393 , H05K2203/1105 , H05K2203/1152 , H05K3/108 , H05K3/184 , Y10S428/901 , Y10T428/24917 , Y10T428/249958 , Y10T428/24996 , Y10T428/266 , Y10T428/31
摘要： Flexible circuits are obtained in an elegant manner, without the customary etching methods, wet-chemically in accordance with the principles of semiadditive or fully additive technology by using for the activation noble metal activators and, as base material, films or flexible boards whose surface has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3/ m.sup.2, (b) an average pore diameter of 0.05-5.0 .mu.m and (c) an average pore depth of 0.05-4.0 .mu.m.
摘要翻译： 柔性电路以优雅的方式获得，没有常规的蚀刻方法，根据半辅助或全添加技术的原理湿法化学，通过使用活化贵金属活化剂和作为基材的膜或柔性板，其表面具有 （a）每单位面积的特定总孔体积为0.015-0.045dm 3 / m 2，（b）平均孔径为0.05-5.0μm，（c）平均孔深为0.05-4.0μm。
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公开(公告)号：US4804475A
公开(公告)日：1989-02-14
申请号：US47241
申请日：1987-05-07
申请人： Kirkor Sirinyan , Karlheinz Hildenbrand , Ulrich von Gizycki , Rudolf Merten , Hermann Perrey , Gerhard D. Wolf
发明人： Kirkor Sirinyan , Karlheinz Hildenbrand , Ulrich von Gizycki , Rudolf Merten , Hermann Perrey , Gerhard D. Wolf
CPC分类号： C23C18/28
摘要： Polymer membranes metallized by wet chemistry are highly suitable, for example, for the separation of inert, reactive and fermentation gases.The metallization is carried out after activation with noble-metal complex compounds which have at least two functional groups.Preferred metal coatings are those of Cu, Co and Ni.
摘要翻译： 通过湿化学金属化的聚合物膜是非常适合的，例如用于分离惰性，反应性和发酵气体。 金属化在具有至少两个官能团的贵金属络合物活化后进行。 优选的金属涂层是Cu，Co和Ni的金属涂层。
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8.发明授权
公开(公告)号：US4661384A
公开(公告)日：1987-04-28
申请号：US746913
申请日：1985-06-20
申请人： Kirkor Sirinyan , Rudolf Merten , Gerhard D. Wolf
发明人： Kirkor Sirinyan , Rudolf Merten , Gerhard D. Wolf
IPC分类号： C23C18/30 , C07D269/00 , C07D323/00 , C07F1/00 , C07F15/00 , C23C18/28
CPC分类号： C23C18/28
摘要： Activation baths containing an organometallic compound based on elements of sub-group 1 or 8 of the periodic table with a "guest/host" interrelationship are outstandingly suitable for electroless metallization of preferably non-metallic substrates. Activators of palladium compounds and cyclic crown ethers are particularly suitable.
摘要翻译： 含有基于元素周期表第1或第8组元素的有机金属化合物的活化浴具有“客体/主体”相互关系，优选非优选非金属基材的无电镀金属化。 钯化合物和环冠醚的活化剂是特别合适的。
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9.发明授权Process for the adhesion-activation of polyamide substrates for electroless metallization 失效用于化学镀金属化的聚酰胺基材的粘附活化方法
公开(公告)号：US4568571A
公开(公告)日：1986-02-04
申请号：US665242
申请日：1984-10-26
CPC分类号： C08J7/12 , C23C18/28 , C08J2377/00 , H05K1/0346 , H05K3/181 , H05K3/381
摘要： A mild activation process for the adhesion-activation of polyamide mouldings for electroless metallization comprises treating the substrates, successively or simultaneously, with the solution of a mixture of CaCl.sub.2, LiCl and/or MgCl.sub.2 with AlCl.sub.3, FeCl.sub.3 and/or TiCl.sub.4 in a lower alcohol and with an activator solution based on inorganic complex compounds of the formulaM.sup.n+ [E.sup.m+ Hal.sub.z.sup.- ]in whichM represents two hydrogen or alkali metal atoms or one alkaline earth metal atom,Hal represents a halogen, preferably Cl, andE represents a noble metal atom of the 1st or 8th subgroup of the periodic table, having the valency m and the coordination number z (z-m=n),or with customary colloidal or ionic systems of these noble metals.
摘要翻译： 用于无电镀金属化的聚酰胺模制品的粘合活化的温和活化方法包括用CaCl 2，LiCl和/或MgCl 2的混合物与AlCl 3，FeCl 3和/或TiCl 4在低级醇中的溶液连续或同时地处理底物 和基于式Mn + [Em + Halz-]的无机络合物的活化剂溶液，其中M表示两个氢或碱金属原子或一个碱土金属原子，Hal表示卤素，优选Cl，E表示贵金属 具有化合价m和配位数z（zm = n）的元素周期表第1或第8族的金属原子，或与这些贵金属的常规胶体或离子体系。
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公开(公告)号：US4830714A
公开(公告)日：1989-05-16
申请号：US41037
申请日：1987-04-22
CPC分类号： H05K3/184 , C23C18/1605 , C23C18/1653 , C23C18/2006 , C23C18/204 , C23C18/208 , C23C18/24 , C23C18/26 , C23C18/30 , H05K3/181 , H05K2203/0716 , H05K2203/1407
摘要： An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.
摘要翻译： 用于生产具有良好电气和机械性能的印刷电路板的优雅方法包括用元素周期表第I或VIII族元素的复合化合物溶液活化底板，然后施加抗蚀剂层，根据 抗蚀剂图案，用溶剂去除抗蚀剂层的被覆盖部分，并且在没有电流的情况下在湿化学金属浴中对裸露部分进行金属化。
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