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公开(公告)号：US20080131997A1
公开(公告)日：2008-06-05
申请号：US12015985
申请日：2008-01-17
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/71
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译： 本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。
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公开(公告)号：US07345359B2
公开(公告)日：2008-03-18
申请号：US10795072
申请日：2004-03-05
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L23/02
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译： 本发明的实施例包括用于在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。
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公开(公告)号：US07110263B2
公开(公告)日：2006-09-19
申请号：US10797753
申请日：2004-03-09
申请人： Jiangqi He , Joong-ho Kim , Hyunjun Kim , Dong-ho Han , Ping Sun
发明人： Jiangqi He , Joong-ho Kim , Hyunjun Kim , Dong-ho Han , Ping Sun
IPC分类号： H05K1/11
CPC分类号： H01P3/085 , H01P3/081 , H05K1/0253 , H05K2201/09236 , H05K2201/093 , H05K2201/09318 , H05K2201/09663 , H05K2201/09727
摘要： An apparatus comprises a signal layer including a first and second signal trace. The apparatus also comprises a first reference plane including a first slot substantially parallel to the first and second signal traces. Further, the apparatus includes a dielectric layer having at least a portion disposed between the signal layer and the first reference plane.
摘要翻译： 一种装置包括包括第一和第二信号迹线的信号层。 该装置还包括第一参考平面，该第一参考平面包括基本上平行于第一和第二信号迹线的第一槽。 此外，该装置包括具有设置在信号层和第一参考平面之间的至少一部分的电介质层。
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公开(公告)号：US20050194669A1
公开(公告)日：2005-09-08
申请号：US10795072
申请日：2004-03-05
申请人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
发明人： Joong-Ho Kim , Dong-Ho Han , Hyunjun Kim , Jiangqi He
IPC分类号： H01L21/60 , H01L23/02 , H01L23/498 , H01L23/538 , H01L23/552 , H05K1/14
CPC分类号： H01L21/00 , H01L23/49833 , H01L23/5387 , H01L23/552 , H01L24/81 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2224/8121 , H01L2224/81815 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/3011 , H05K1/147 , H05K2201/10492 , H05K2201/10734 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
摘要翻译： 本发明的实施例包括在封装结构的芯片侧上具有信号连接的集成电路封装的装置，方法和/或系统。
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公开(公告)号：US20050128041A1
公开(公告)日：2005-06-16
申请号：US10736336
申请日：2003-12-15
申请人： Hyunjun Kim , Jiangqi He
发明人： Hyunjun Kim , Jiangqi He
IPC分类号： H01F17/00 , H01F27/36 , H01F41/04 , H01L23/498 , H01L23/552 , H01L23/64 , H01F5/00
CPC分类号： H01L23/645 , H01F17/0006 , H01F17/0013 , H01F27/362 , H01F41/041 , H01F2017/008 , H01L23/49822 , H01L23/49838 , H01L23/552 , H01L2224/16 , H01L2924/15311 , H01L2924/3025 , Y10T29/4902
摘要： Some embodiments provide a first portion of an inductor disposed in a first layer of a multilayer substrate, a second portion of the inductor disposed in a second layer of the multilayer substrate, the second portion coupled to the first portion, and a shielding plane disposed between the first portion and the second portion.
摘要翻译： 一些实施例提供了设置在多层基板的第一层中的电感器的第一部分，电感器的第二部分设置在多层基板的第二层中，第二部分耦合到第一部分，以及屏蔽平面， 第一部分和第二部分。
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公开(公告)号：US20050063137A1
公开(公告)日：2005-03-24
申请号：US10669678
申请日：2003-09-24
申请人： Hyunjun Kim , Jiangqi He , Joong-Ho Kim , Dong-Ho Han
发明人： Hyunjun Kim , Jiangqi He , Joong-Ho Kim , Dong-Ho Han
CPC分类号： H01G4/228 , H01G2/06 , H01G4/30 , H01G4/40 , Y10T29/435
摘要： An apparatus and system, as well as fabrication methods therefor, may include a plurality of vertically-oriented plates separated by dielectric layers, wherein the vertically-oriented plates include a plurality of terminals coupled to a bottom side of the plates.
摘要翻译： 一种装置和系统及其制造方法可以包括由电介质层分开的多个垂直取向的板，其中垂直定向的板包括联接到板的底侧的多个端子。
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公开(公告)号：US07209025B2
公开(公告)日：2007-04-24
申请号：US10736336
申请日：2003-12-15
申请人： Hyunjun Kim , Jiangqi He
发明人： Hyunjun Kim , Jiangqi He
CPC分类号： H01L23/645 , H01F17/0006 , H01F17/0013 , H01F27/362 , H01F41/041 , H01F2017/008 , H01L23/49822 , H01L23/49838 , H01L23/552 , H01L2224/16 , H01L2924/15311 , H01L2924/3025 , Y10T29/4902
摘要： Some embodiments provide a first portion of an inductor disposed in a first layer of a multilayer substrate, a second portion of the inductor disposed in a second layer of the multilayer substrate, the second portion coupled to the first portion, and a shielding plane disposed between the first portion and the second portion.
摘要翻译： 一些实施例提供了设置在多层基板的第一层中的电感器的第一部分，电感器的第二部分设置在多层基板的第二层中，第二部分耦合到第一部分，以及屏蔽平面， 第一部分和第二部分。
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公开(公告)号：US07123466B2
公开(公告)日：2006-10-17
申请号：US11202248
申请日：2005-08-12
申请人： Jiangqi He , Ping Sun , Hyunjun Kim , Xiang Yin Zeng
发明人： Jiangqi He , Ping Sun , Hyunjun Kim , Xiang Yin Zeng
IPC分类号： H01G4/228
CPC分类号： H01G4/228 , H01L23/49827 , H01L23/49833 , H01L23/50 , H01L2224/16225 , H01L2924/01019 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/19103 , H05K1/0306 , H05K1/162 , H05K2201/0187 , H05K2201/0394 , H05K2201/09581 , H05K2201/10378 , H05K2201/10674
摘要： Extending high k material of a second dielectric layer to surround at least one thru-via designed to provide a signal other than a power signal to a die may eliminate discrete AC coupling capacitors to reduce cost and improve performance of the package.
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公开(公告)号：US07027289B2
公开(公告)日：2006-04-11
申请号：US10808489
申请日：2004-03-25
申请人： Jiangqi He , Ping Sun , Hyunjun Kim , Xiang Yin Zeng
发明人： Jiangqi He , Ping Sun , Hyunjun Kim , Xiang Yin Zeng
IPC分类号： H01G4/228
CPC分类号： H01G4/228 , H01L23/49827 , H01L23/49833 , H01L23/50 , H01L2224/16225 , H01L2924/01019 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/19103 , H05K1/0306 , H05K1/162 , H05K2201/0187 , H05K2201/0394 , H05K2201/09581 , H05K2201/10378 , H05K2201/10674
摘要： Extending high k material of a second dielectric layer to surround at least one thru-via designed to provide a signal other than a power signal to a die may eliminate discrete AC coupling capacitors to reduce cost and improve performance of the package.
摘要翻译： 扩展第二电介质层的高k材料以围绕设计成向芯片提供除了功率信号之外的信号的至少一个通孔可以消除离散AC耦合电容器以降低成本并提高封装的性能。
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公开(公告)号：US20050285695A1
公开(公告)日：2005-12-29
申请号：US10880637
申请日：2004-06-29
申请人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
发明人： Hyunjun Kim , Joong-Ho Kim , Dong-Ho Han , Jiangqi He
摘要： Transmission line impedance matching is described for matching an impedance discontinuity on a transmission signal trace. The apparatus includes a transmission signal trace and a non-transmission trace. The transmission signal trace has an impedance discontinuity, a first length, and a predetermined first width. The non-transmission trace is disposed near the transmission signal trace at a region corresponding to the impedance discontinuity. The non-transmission trace has a second length that is substantially less than the first length of the transmission signal trace. Additionally, the non-transmission trace is configured to be electromagnetically coupled to the transmission signal trace in the presence of a current on the transmission signal trace to provide a matched impedance on the transmission signal trace.
摘要翻译： 描述传输线阻抗匹配以匹配传输信号迹线上的阻抗不连续性。 该装置包括发送信号跟踪和非传输迹线。 发送信号迹线具有阻抗不连续性，第一长度和预定的第一宽度。 在与阻抗不连续性对应的区域处，将非传输迹线布置在发射信号迹线附近。 非透射迹线具有基本上小于发射信号迹线的第一长度的第二长度。 此外，非传输轨迹被配置为在存在传输信号迹线上的电流的情况下电磁耦合到传输信号迹线，以在传输信号迹线上提供匹配的阻抗。
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