摘要:
Roughly described, an antenna diode is formed at least partially within the exclusion zone around a TSV, and is connected to the TSV by way of a metal 1 layer conductor at the same time that the TSV is connected to either the gate poly or a diffusion region of one or more transistors placed outside the exclusion zone.
摘要:
One embodiment of the invention provides a system that facilitates designing an integrated circuit using a mask-programmable fabric, which contains both mask-programmable logic and a mask-programmable interconnect. During operation, the system receives a description of a mask-programmable cell, wherein instances of the mask-programmable cell are repeated to form the mask-programmable fabric. The system uses this description of the mask-programmable cell to generate a derived library containing cells that can be obtained by programming the mask-programmable cell. Next, the system receives a high-level design for the integrated circuit. The system then performs a synthesis operation on the high-level design to generate a preliminary netlist for the high-level design, wherein the preliminary netlist contains references to cells in the derived library. Finally, the system converts the preliminary netlist into a netlist that contains references to the mask-programmable cell with the logic appropriately programmed. The netlist is then placed and routed with the mask programmable constraints on the mask programmable fabric. The design, thus implemented on the programmable fabric, can be changed to accommodate logic revisions and bug fixes by changing only a few masks required for its fabrication.
摘要:
In one well bias arrangement, no well bias voltage is applied to the n-well, and no well bias voltage is applied to the p-well. Because no external well bias voltage is applied, the n-well and the p-well are floating, even during operation of the devices in the n-well and the p-well. In another well bias arrangement, the lowest available voltage is not applied to the p-well, such as a ground voltage, or the voltage applied to the n+-doped source region of the n-type transistor in the p-well. This occurs even during operation of the n-type transistor in the p-well. In yet another well bias arrangement, the highest available voltage is not applied to the n-well, such as a supply voltage, or the voltage applied to the p+-doped source region of the p-type transistor in the n-well. This occurs even during operation of the p-type transistor in the n-well.
摘要:
Roughly described, an integrated circuit device has a conductor extending entirely through the substrate, connected on one end to the substrate topside surface and on the other end to the substrate backside surface. In various embodiments the conductor is insulated from all RDL conductors on the backside of the substrate, and/or is insulated from all conductors and device features on any below-adjacent chip in a 3D integrated circuit structure. Methods of fabrication are also described.
摘要:
A finFET block architecture includes a first set of semiconductor fins having a first conductivity type, and a second set of semiconductor fins having a second conductivity type. An inter-block insulator is placed between outer fins of the first and second sets. A patterned gate conductor layer includes a first plurality of gate traces extending across the set of fins in the first block without crossing the inter-block insulator, and a second plurality of gate traces extending across the set of fins in the second block without crossing the inter-block insulator. Patterned conductor layers over the gate conductor layer are arranged in orthogonal layout patterns, and include an inter-block connector arranged to connect gate traces in the first and second blocks.
摘要:
One embodiment of the present invention provides a system that computes dummy feature density for a CMP (Chemical-Mechanical Polishing) process. Note that the dummy feature density is used to add dummy features to a layout to reduce the post-CMP topography variation. During operation, the system discretizes a layout of an integrated circuit into a plurality of panels. Next, the system computes a feature density and a slack density for the plurality of panels. The system then computes a dummy feature density for the plurality of panels by, iteratively, (a) calculating an effective feature density for the plurality of panels using the feature density and a function that models the CMP process, (b) calculating a filling amount for a set of panels in the plurality of panels using a target feature density, the effective feature density, and the slack density, and (c) updating the feature density, the slack density, and the dummy feature density for the set of panels using the filling amount. In one embodiment of the present invention, the iterative process is guided by a variance-minimizing heuristic to efficiently select the set of panels and assign/remove dummy density to the set of panels to decrease the effective feature density variation.
摘要:
Embodiments of an interface circuit are described. This interface circuit includes an input pad, a control node and a transistor, which has three terminals. A first terminal is electrically coupled to the input pad and a second terminal is electrically coupled to the control node. Moreover, the interface circuit includes a micro-electromechanical system (MEMS) switch, which is electrically coupled to the input pad and the control node, where the MEMS switch is in parallel with the transistor. In the absence of a voltage applied to a control terminal of the MEMS switch, the MEMS switch is closed, thereby electrically coupling the input pad and the control node. Furthermore, when the voltage is applied to the control terminal of the MEMS switch, the MEMS switch is open, thereby electrically decoupling the input pad and the control node.
摘要:
A method and system for minimizing sub-threshold leakage in a logic block is disclosed. An NDR isolation device is coupled between the logic block and ground to form a virtual ground node. To put the logic block into sleep mode, the virtual ground control device raises the voltage at the virtual ground node above an isolation voltage, which causes NDR isolation device isolates the virtual ground node from ground. The virtual ground control device can then raise the voltage at the virtual ground node to the positive supply voltage to eliminate sub-threshold leakage currents the logic block. Alternatively, the virtual ground control device can raise the voltage at the virtual ground node to the positive supply voltage minus a retention voltage so that storage elements in the logic block can retain state information while still greatly reducing sub-threshold leakage current.
摘要:
A method and system for minimizing sub-threshold leakage in a logic block is disclosed. An NDR isolation device is coupled between the logic block and ground to form a virtual ground node. To put the logic block into sleep mode, the virtual ground control device raises the voltage at the virtual ground node above an isolation voltage, which causes NDR isolation device isolates the virtual ground node from ground. The virtual ground control device can then raise the voltage at the virtual ground node to the positive supply voltage to eliminate sub-threshold leakage currents the logic block. Alternatively, the virtual ground control device can raise the voltage at the virtual ground node to the positive supply voltage minus a retention voltage so that storage elements in the logic block can retain state information while still greatly reducing sub-threshold leakage current.
摘要:
Slew-rate control is implemented in input/output device structures where MOSFETs are employed to switch the output signal. These MOSFETs each have a substrate, an insulating layer adjacent to the substrate and a strip of semiconductor material separated from the substrate by the insulating layer. The strip of semiconductor material functions as the gate of the MOSFET. The strip of semiconductor material does not form a closed loop. One end of the strip of a first transistor is connected to one end of the strip of the second transistor. Thus, the gates of the two transistors are placed in series so that they are not switched on at the same time. A delay is thereby automatically introduced between the switching on of the two transistors. The delay is controlled by placing metal straps across selected transistor gates to effectively bypass the delays caused by the current propagating through the gates. Further control of the delay is gained by use of a feedback signal to increase or decrease the current in the gates.