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    LED PACKAGE WITH PHOSPHOR PLATE AND REFLECTIVE SUBSTRATE
    1.
    发明申请
    LED PACKAGE WITH PHOSPHOR PLATE AND REFLECTIVE SUBSTRATE 审中-公开
    LED包装与磷酸盐和反射基板

    公开(公告)号：US20110049545A1

    公开(公告)日：2011-03-03

    申请号：US12552328

    申请日：2009-09-02

    申请人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

    IPC分类号： H01L33/00

    CPC分类号： H01L24/97 ,  H01L33/005 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00

    摘要： After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO2 powder, by weight, is then spun over or molded over the wafer to cover the phosphor plates and the sides of the LEDs. The top surface of the reflective material is then etched using microbead blasting to expose the top of the phosphor plates and create a substantially planar reflective layer over the wafer surface. Lenses may then be formed over the LEDs. The wafer is then singulated. The reflective material reflects all side light back into the LED and phosphor plate so that virtually all light exits the top of the phosphor plate to improve the light emission characteristics.

    摘要翻译： 在将倒装芯片LED安装在底座晶片上并且移除其生长衬底之后，将磷光体板固定到每个LED的暴露的顶表面。 然后将反射材料，例如含有至少5重量％TiO 2的硅氧烷的硅酮在晶片上旋转或模制，以覆盖荧光体板和LED的侧面。 然后使用微珠喷射来蚀刻反射材料的顶表面以暴露荧光体板的顶部并在晶片表面上形成基本上平面的反射层。 然后可以在LED上形成透镜。 然后将晶片切片。 反射材料将所有侧光反射回LED和磷光体板，使得几乎所有的光离开荧光体板的顶部以改善发光特性。

    Underfill process for flip-chip LEDs
    2.
    发明授权
    Underfill process for flip-chip LEDs 有权
    倒装芯片LED的底部填充工艺

    公开(公告)号：US08273587B2

    公开(公告)日：2012-09-25

    申请号：US13115475

    申请日：2011-05-25

    申请人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

    发明人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

    IPC分类号： H01L21/00

    CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

    摘要： An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

    摘要翻译： 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从所有LED管芯去除暴露的生长衬底，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分离。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

    REFLECTIVE SUBSTRATEFOR LEDS
    3.
    发明申请
    REFLECTIVE SUBSTRATEFOR LEDS 有权
    反射基板LED

    公开(公告)号：US20110012149A1

    公开(公告)日：2011-01-20

    申请号：US12503951

    申请日：2009-07-16

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/60 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012

    摘要： An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.

    摘要翻译： 用于LED的底部填充形成技术模制反射底部填充材料以封装安装在底座晶片上的LED管芯，同时在底座晶片上形成底部填充材料的反射层。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷射除去在LED管芯顶部的固化的底部填充材料，同时将反射层留在底座表面上。 然后将曝光的生长衬底从所有的LED管芯移除，并且在暴露的LED表面上模制荧光体层。 然后将透镜模制在LED上并在反射层的一部分上方。 然后将底座晶片分离。 反射层通过减少副安装座的光吸收而没有任何额外的处理步骤来增加LED器件的效率。

    Reflective substrate for LEDS
    6.
    发明授权
    Reflective substrate for LEDS 有权
    LEDS反光基板

    公开(公告)号：US08431423B2

    公开(公告)日：2013-04-30

    申请号：US12503951

    申请日：2009-07-16

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/60 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012

    摘要： An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.

    摘要翻译： 用于LED的底部填充形成技术模制反射底部填充材料以封装安装在底座晶片上的LED管芯，同时在底座晶片上形成底部填充材料的反射层。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷射除去在LED管芯顶部的固化的底部填充材料，同时将反射层留在底座表面上。 然后将曝光的生长衬底从所有的LED管芯移除，并且在暴露的LED表面上模制荧光体层。 然后将透镜模制在LED上并在反射层的一部分上方。 然后将底座晶片分离。 反射层通过减少副安装座的光吸收而没有任何额外的处理步骤来增加LED器件的效率。

    UNDERFILL PROCESS FOR FLIP-CHIP LEDS
    7.
    发明申请
    UNDERFILL PROCESS FOR FLIP-CHIP LEDS 有权
    FLIP-CHIP LED的底层工艺

    公开(公告)号：US20110223696A1

    公开(公告)日：2011-09-15

    申请号：US13115475

    申请日：2011-05-25

    申请人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

    发明人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

    IPC分类号： H01L33/52

    CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

    摘要： An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

    摘要翻译： 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从所有LED管芯去除暴露的生长衬底，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分离。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

    Light emitting device with molded wavelength converting layer
    9.
    发明授权
    Light emitting device with molded wavelength converting layer 有权
    具有模制波长转换层的发光器件

    公开(公告)号：US08771577B2

    公开(公告)日：2014-07-08

    申请号：US12706149

    申请日：2010-02-16

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： B29C43/18

    CPC分类号： H01L33/504 ,  B29C43/18 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/0075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.

    摘要翻译： 包括波长转换材料的柔性膜位于光源上。 柔性膜符合预定的形状。 在一些实施例中，光源是安装在支撑衬底上的发光二极管。 二极管与模具中的压痕对准，使得柔性膜设置在支撑基板和模具之间。 透明成型材料设置在支撑基板和模具之间。 将支撑基板和模具压在一起以使模制材料填充凹陷。 柔性膜符合光源或模具的形状。

    LED WITH SILICONE LAYER AND LAMINATED REMOTE PHOSPHOR LAYER
    10.
    发明申请
    LED WITH SILICONE LAYER AND LAMINATED REMOTE PHOSPHOR LAYER 审中-公开
    LED与硅胶层和层压式远距离磷酸盐层

    公开(公告)号：US20110031516A1

    公开(公告)日：2011-02-10

    申请号：US12537909

    申请日：2009-08-07

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： H01L33/00 ,  H01L21/56

    CPC分类号： H01L33/507 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/16 ,  H01L2933/0041

    摘要： A method for fabricating a light emitting device is described where an array of flip-chip light emitting diode (LED) dies are mounted on a submount wafer. Over each of the LED dies is simultaneously molded a hemispherical first silicone layer. A preformed flexible phosphor layer, comprising phosphor powder infused in silicone, is laminated over the first silicone layer to conform to the outer surface of the hemispherical first silicone layer. A silicone lens is then molded over the phosphor layer. By preforming the phosphor layer, the phosphor layer may be made to very tight tolerances and tested. By separating the phosphor layer from the LED die by a molded hemispherical silicone layer, color vs. viewing angle is constant, and the phosphor is not degraded by heat. The flexible phosphor layer may comprise a plurality of different phosphor layers and may comprise a reflector or other layers.

    摘要翻译： 描述了一种用于制造发光器件的方法，其中倒装芯片发光二极管（LED）管芯的阵列安装在基座晶片上。 在每个LED管芯上同时模制半球形的第一硅氧烷层。 将预先形成的柔性荧光体层，包括注入硅氧烷的荧光体粉末层压在第一硅氧烷层上，以符合半球形第一硅氧烷层的外表面。 然后在荧光体层上模制硅树脂透镜。 通过预处理荧光体层，可以使荧光体层具有非常严格的公差并进行测试。 通过模制的半球状硅氧烷层将荧光体层与LED芯片分开，颜色与视角是恒定的，并且荧光体不会被热降解。 柔性荧光体层可以包括多个不同的荧光体层，并且可以包括反射器或其它层。