摘要:
There are disclosed a nanocomposite powder for an inner electrode of a multilayer ceramic electronic device and a manufacturing method thereof. The nanocomposite powder for an inner electrode of a multilayer ceramic electronic device includes a first metal particle having electrical conductivity, and a second metal coating layer formed on a top surface or a bottom surface of the first metal particle and having a higher melting point than that of the first metal particle.
摘要:
There are provided an apparatus and method for manufacturing a board for the production of a metal flake. The apparatus includes: a base board supplying part; a patterning part forming a pattern layer on a base board supplied from the base board supplying part; a coating part forming a sacrificial layer on the base board having the pattern layer formed thereon, the sacrificial layer being decomposable by a solvent; and a base board recovering part recovering the base board having the sacrificial layer formed thereon.
摘要:
There is provided a probe card. A probe card according to an aspect of the invention may include: a printed circuit board; a horizontal regulator passing through the printed circuit board and having an insertion portion having a horizontal regulation bolt and an insertion portion having a curved portion provided on an end portion of the horizontal regulation bolt; a probe substrate electrically connected to the printed circuit board; and a connection member mounted on the probe circuit, engaged with the horizontal regulation portion, and having an insertion recess therein so that the insertion portion is rotated within the insertion recess.
摘要:
There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.
摘要:
There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.
摘要:
Disclosed herein is a multi-layer chip directional coupler. The multi-layer chip directional coupler has a first ground pattern, a coupling signal line, a main signal line, a second ground pattern, and a plurality of ports. The first ground pattern is formed on the upper surface of a first dielectric layer. The coupling signal line is formed of a conduction pattern on the upper surface of a second dielectric layer. The main signal line is formed of a conduction pattern on the upper surface of a third dielectric layer formed over the second dielectric layer. The second ground pattern formed on the upper surface of a fourth dielectric layer formed over the third dielectric layer. A plurality of ports is formed on the side surfaces of the first to fourth dielectric layers.
摘要:
A substrate and a method for manufacturing the same, and a probe card employing the substrate as a space transformer. The substrate includes: a substrate body; a key forming groove formed in one surface of the substrate body; and an alignment key formed on the key forming groove. The recognition rate of the alignment key formed on the substrate can be increased, resulting in improved accuracy in a micro electro mechanical system (MEMS) process for forming micro probes on the substrate, thereby improving productivity and reliability of the substrate and the probe card including the same.
摘要:
Disclosed herein are a member for adjusting horizontality and a probe card with the same. The member for adjusting horizontality according to the present invention horizontally couples a micro probe head to a probe substrate with an adhesive layer therebetween, and the member for adjusting horizontality which is coupled to the micro probe head does not have an edge of the coupling portion and an edge of the adhesive layer. Therefore, according to the member for adjusting horizontality and the probe card with the same of the present invention, it is possible to prevent the coupling portions of the micro probe head from being broken, by reducing stress applied to the micro probe head during the process of horizontally coupling the micro probe head to the probe substrate.
摘要:
Disclosed is a dual band coupler, in which a dielectric layer having a coupling signal line is positioned between dielectric layers having a first main signal line and a second main signal line. Coupling coefficients of first and second signal lines can be independently controlled by laminating different numbers of dielectric layers between the coupling signal line and main signal lines, respectively. A shielding pattern for excluding mutual electromagnetic interference between the first and second main signal lines is formed on the dielectric layer having the coupling signal line to improve an isolation, and a small sized-dual band coupler can be provided because the dielectric layer having a ground pattern can be omitted.
摘要:
In a method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter, when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, and so that costs are reduced and so that a workability improvement can be realized, and so that the sealing can be made more secure. The first sealing is carried out on a step that is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.