公开(公告)号：US07445754B2

公开(公告)日：2008-11-04

申请号：US10671490

申请日：2003-09-29

申请人： Kwang Hyo Chung ,  Jong Soo Ko ,  Hyun Chul Yoon ,  Hae Sik Yang ,  Hyeon Bong Pyo ,  Sung Jin Kim ,  Yun Tae Kim

发明人： Kwang Hyo Chung ,  Jong Soo Ko ,  Hyun Chul Yoon ,  Hae Sik Yang ,  Hyeon Bong Pyo ,  Sung Jin Kim ,  Yun Tae Kim

IPC分类号： B01L3/02

CPC分类号： B01L3/5027 ,  B01J2219/00837 ,  B01L3/502738 ,  B01L3/502746 ,  B01L2200/0621 ,  B01L2200/0684 ,  B01L2400/0688 ,  B33Y70/00 ,  B33Y80/00 ,  Y10T137/2076 ,  Y10T436/2575

摘要： Disclosed is to a device for exchanging minimum amount of the fluid only by using surface tension of the fluid instead of external force like a pump. According to the device, an additional pump and power supply is not needed, thereby the device can be small sized and portable, and not only manufacturing cost decreases and yield increases but the device is hardly out of order.

摘要翻译： 公开了仅通过使用流体的表面张力而不是像泵这样的外力来交换最小量的流体的装置。 根据该装置，不需要附加的泵和电源，因此该装置可以小型化且便于携带，不仅制造成本降低并且产量增加，而且装置几乎不会出现故障。

公开(公告)号：US20120291275A1

公开(公告)日：2012-11-22

申请号：US13337650

申请日：2011-12-27

申请人： Jong-Joo RHA ,  Kee-Seok NAM ,  Jung-Dae KWON ,  Kyu-Hwan LEE ,  Jong-Soo BAE ,  Joo-Yul LEE ,  Jong-Soo KO

发明人： Jong-Joo RHA ,  Kee-Seok NAM ,  Jung-Dae KWON ,  Kyu-Hwan LEE ,  Jong-Soo BAE ,  Joo-Yul LEE ,  Jong-Soo KO

IPC分类号： H05K3/10

CPC分类号： H05K3/107 ,  H05K3/002 ,  H05K3/0041 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/09036 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/095 ,  Y10T29/49155

摘要： Provided is a method of forming a metal interconnection line on a flexible substrate, wherein the method includes: coating a hard mask layer on at least one surface of the flexible substrate, followed by performing photolithography thereon to form a predetermined hard mask pattern; etching a portion of the flexible substrate by using the hard mask pattern as a mask to form a trench; plasma treating the inside of the trench by using a treatment gas for pre-treating the flexible substrate; coating a seed layer inside the trench; removing the hard mask pattern; and filling the inside of the trench coated with the seed layer with metal. A metal interconnection line formed by using the method may have a strong adhesion force with respect to the flexible substrate.

摘要翻译： 提供了一种在柔性基板上形成金属互连线的方法，其中所述方法包括：在柔性基板的至少一个表面上涂覆硬掩模层，然后对其进行光刻以形成预定的硬掩模图案; 通过使用硬掩模图案作为掩模蚀刻柔性基板的一部分以形成沟槽; 通过使用用于预处理柔性基板的处理气体等离子体处理沟槽的内部; 在沟槽内涂覆种子层; 去除硬掩模图案; 并用金属填充种子层涂覆的沟槽的内部。 通过使用该方法形成的金属互连线可以具有相对于柔性基板的强粘附力。

公开(公告)号：US06987435B2

公开(公告)日：2006-01-17

申请号：US10185654

申请日：2002-06-27

申请人： Jong Soo Ko ,  Dae Sik Lee ,  Myung Lae Lee ,  Chi Hoon Jun ,  Youn Tae Kim

发明人： Jong Soo Ko ,  Dae Sik Lee ,  Myung Lae Lee ,  Chi Hoon Jun ,  Youn Tae Kim

IPC分类号： H01H51/22

CPC分类号： H01H53/06 ,  B81B3/0021 ,  B81B2201/038 ,  B81B2203/0109 ,  B81B2203/051 ,  B81B2203/056 ,  B81B2203/058 ,  G02B6/266 ,  G02B6/3546 ,  G02B6/3572 ,  H01H1/0036 ,  H01H2001/0078

摘要： The present invention relates to a micro-electromechanical actuator. An electromagnetic-type micro-electromechanical actuator of the present invention has a conductive beam formed in a micro electronic substrate on an upper side of a magnetic substance, so that the conductive beam can be moved toward an in-plane mode in parallel to the micro electronic substrate depending on a direction that current flows. Therefore, the micro-electromechanical actuator can be applied to most of electromagnetic micro-electromechanical systems that require an in-plane mode.

公开(公告)号：US07238324B2

公开(公告)日：2007-07-03

申请号：US10615441

申请日：2003-07-07

申请人： Jong Soo Ko ,  Hyun Chul Yoon ,  Hae Sik Yang ,  Dae-Sik Lee ,  Kwang Hyo Chung ,  Hyeon Bong Pyo ,  Sung Jin Kim ,  Yun Tae Kim

发明人： Jong Soo Ko ,  Hyun Chul Yoon ,  Hae Sik Yang ,  Dae-Sik Lee ,  Kwang Hyo Chung ,  Hyeon Bong Pyo ,  Sung Jin Kim ,  Yun Tae Kim

IPC分类号： B01L3/02

CPC分类号： B01L3/502707 ,  B01L3/50273 ,  B01L3/502746 ,  B01L2200/16 ,  B01L2300/0645 ,  B01L2300/0867 ,  B01L2400/0406 ,  B01L2400/0442 ,  B01L2400/0487 ,  B01L2400/0688 ,  B01L2400/086 ,  B01L2400/088 ,  B33Y70/00 ,  B33Y80/00 ,  Y10T436/25

摘要： A microfluidic device for controlling the flow of a micro amount of fluid is provided. The microfluidic device is manufactured by binding a sensing substrate including a sensing electrode, an electrode interconnect, and a electrode pad, with a channel substrate including at least two fluid inlet ports, a chamber, and a channel, wherein a first fluid injected via one of the fluid inlet ports flows by natural capillary force, and a second fluid injected via another fluid inlet port is forced to flow by an external pump. The microfluidic device controls fluid flow and flow stoppage by a combination of natural capillary flow and an externally applied pressure as a result of the action of a pump.

摘要翻译： 提供了用于控制微量流体流动的微流体装置。 微流体装置通过将包括感测电极，电极互连和电极焊盘的感测衬底与包括至少两个流体入口端口，腔室和通道的通道衬底结合来制造，其中通过一个注入的第一流体 的流体入口端口通过天然毛细管力流动，并且通过另一流体入口喷射的第二流体被迫使外部泵流动。 由于泵的作用，微流体装置通过天然毛细管流动和外部施加的压力的组合来控制流体流动和流动停止。