摘要:
The Si waveguide 305 includes a first conductivity-type Si layer 301 and an intrinsic Si layer 302, and a second conductivity-type light-absorption layer 303 is partially formed on an area thereof. During operation, a reverse bias is applied between the first conductivity-type Si layer 301 and the light-absorption layer 303. Since the light-absorption layer 303 has a conductivity type, it is not depleted when a voltage is applied, but the intrinsic Si layer 302 forming the Si waveguide 305 is depleted. Therefore, it is possible to reduce a CR time constant. Furthermore, since the intrinsic Si layer 302 can be formed on the first conductivity-type Si layer 301 in a continuous manner, it is possible to reduce lattice defects. As a result, it is possible to suppress the dark current generated in the light-receiving element.
摘要:
According to the present invention, there is provided an electrode structure which includes: a nitride semiconductor layer; an electrode provided over the nitride semiconductor layer; and an electrode protective film provided over the electrode, wherein the nitride semiconductor layer contains a metal nitride containing Nb, Hf or Zr as a constitutive element, the electrode has a portion having a metal oxide containing Ti or V as a constitutive element formed therein, and the electrode protective film covers at least a portion of the electrode, and contains a protective layer having Au or Pt as a constitutive element.
摘要:
A light receiving element 1 has a semiconductor substrate 101; a first mesa 11 provided over the semiconductor substrate 101, and having an active region and a first electrode (p-side electrode 111) provided over the active region; a second mesa 12 provided over the semiconductor substrate 101, and having a semiconductor layer and a second electrode (n-side electrode 121) provided over the semiconductor layer; and a third mesa 13 provided over the semiconductor substrate 101, and having a semiconductor layer, wherein the third mesa 13 is arranged so as to surround the first mesa 11.
摘要:
A feed velocity of a control axis and acceleration thereof do not exceed a maximum feed velocity and a maximum acceleration defined in mechanical specifications even if a radial operation is carried out for the purpose of a cut-in or escape operation in a contour describing control. A radial permissible maximum velocity (Vnp) and a radial permissible maximum acceleration (&agr;np) in a contour describing control using a circular interpolation is set separately from a setting value of a maximum feed velocity (Vm) of a control axis and that of a maximum acceleration (&agr;m) thereof set as mechanical specifications, and when a command of the circular interpolation is given, limitations are given to a radial velocity (Vn) and acceleration (&agr;n) so that the radial velocity (Vn) and acceleration (&agr;n) do not exceed the radial permissible maximum velocity (Vnp) and permissible maximum acceleration (&agr;np).
摘要:
According to the present invention, there is provided an electrode structure which includes: a nitride semiconductor layer; an electrode provided over the nitride semiconductor layer; and an electrode protective film provided over the electrode, wherein the nitride semiconductor layer contains a metal nitride containing Nb, Hf or Zr as a constitutive element, the electrode has a portion having a metal oxide containing Ti or V as a constitutive element formed therein, and the electrode protective film covers at least a portion of the electrode, and contains a protective layer having Au or Pt as a constitutive element.
摘要:
A light receiving element 1 has a semiconductor substrate 101; a first mesa 11 provided over the semiconductor substrate 101, and having an active region and a first electrode (p-side electrode 111) provided over the active region; a second mesa 12 provided over the semiconductor substrate 101, and having a semiconductor layer and a second electrode (n-side electrode 121) provided over the semiconductor layer; and a third mesa 13 provided over the semiconductor substrate 101, and having a semiconductor layer, wherein the third mesa 13 is arranged so as to surround the first mesa 11.
摘要:
One aspect of the invention provides a substrate position detecting method for charged particle beam photolithography apparatus in order to be able to measure accurately and simply a substrate position on a stage. The substrate position detecting method for charged particle beam photolithography apparatus includes placing a substrate on a stage that can be moved in an X-direction and a Y-direction; measuring a position in the X-direction of the stage while moving the stage in the X-direction, and illuminating obliquely an upper surface of the substrate with a laser beam to receive light reflected from the substrate with a position sensing device; computing a barycentric position of the reflected light when the stage is moved in the X-direction; measuring a position in the Y-direction of the stage while moving the stage in the Y-direction, and illuminating obliquely the upper surface of the substrate with the laser beam to receive light reflected from the substrate with the position sensing device; computing a barycentric position of the reflected light when the stage is moved in the Y-direction; and computing the positions of the substrate from the position measurement results of the stage and the computed barycentric position.
摘要:
A first layer containing Ti as a constituent element, a second layer containing Nb as a constituent element, and a third layer containing Au as a constituent element are formed on a GaN substrate 11. Thereafter, the GaN substrate 11 and the first to third layers are kept at 700° C. or higher and at 1300° C. or lower. This allows a metal oxide of Ti to be distributed to extend from the interface between the GaN substrate 11 and the electrode 14 over to the inside of the electrode 14. Further, a metal nitride of Nb is formed in the inside of the GaN substrate 11. The metal nitride of Nb will be distributed to extend from the inside of the electrode 14 over to the inside of the GaN substrate 11.
摘要:
According to the present invention, there is provided an electrode structure which includes: a nitride semiconductor layer; an electrode provided over the nitride semiconductor layer; and an electrode protective film provided over the electrode, wherein the nitride semiconductor layer contains a metal nitride containing Hb, Hf or Zr as a constitutive element, the electrode has a portion having a metal oxide containing Ti or V as a constitutive element formed therein, and the electrode protective film covers at least a portion of the electrode, and contains a protective layer having Au or Pt as a constitutive element.
摘要:
Input ports (103a, 103b) formed from fundamental mode waveguides are provided at one end of a multimode waveguide (104). Further, an output port (105) formed from a fundamental mode waveguide is provided at the other end of the multimode waveguide (104). The multimode waveguide (104) has a width wider than those of the input ports (103a, 103b) and the output port (105), and provides modes including multimode to the waveguide. The multimode waveguide (104) is embedded with a buried layer (200). Both of the end faces of the multimode waveguide (104) are made to be planes equivalent to a (100) plane or planes inclined from these planes. In a case of inclined planes, the planes are made to be planes inclined to a direction that the waveguide region spreads toward a stacked direction of the semiconductor layers.