公开(公告)号：US06624523B2

公开(公告)日：2003-09-23

申请号：US09882012

申请日：2001-06-15

申请人： Shin-Hua Chao ,  Kuan-Neng Liao

发明人： Shin-Hua Chao ,  Kuan-Neng Liao

IPC分类号： H01L2348

CPC分类号： H01L24/32 ,  H01L23/24 ,  H01L23/3677 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A structure of a heat spreader substrate. A first heat spreader has a first upper surface, a corresponding first lower surface and an opening. A second heat spreader has a second upper surface and a corresponding second lower surface. The second heat spreader is fit tightly into the opening. The second lower surface and the first lower surface are coplanar. A thickness of the second heat spreader is smaller than that of the first heat spreader. A chip is located on the second upper surface. A substrate is located on the first upper surface of the first heat spreader, and the opening is exposed by the substrate.

公开(公告)号：US06483187B1

公开(公告)日：2002-11-19

申请号：US09638262

申请日：2000-08-11

申请人： Shin-Hua Chao ,  Kuan-Neng Liao ,  Yao-Hsin Feng ,  Hou-Chang Kuo

发明人： Shin-Hua Chao ,  Kuan-Neng Liao ,  Yao-Hsin Feng ,  Hou-Chang Kuo

IPC分类号： H01L2334

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L23/585 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A heat-spread substrate consisting of a metal heat spreader and a substrate is disclosed. The metal heat spreader has a surface with a cavity, which is adapted for supporting a die. Such surface further includes a ground ring arranged at the periphery of the cavity; a substrate-supporting surface surrounding the periphery of the ground ring; a plurality of first ground pads arranged at the periphery of the substrate-supporting surface; and a plurality of second ground pads arranged on the substrate-supporting surface and protruding it. The substrate is provided on the substrate-supporting surface having a plurality of through holes. The through holes corresponds to the first ground pad so as to make it be located therein, respectively. The substrate further includes a plurality of mounting pads and a plurality of ball pads, in which the mounting pads are close to the cavity, and the first ground pad, the second ground pads and the ball pads are formed in the form of ball grid array and are coplanar roughly.

摘要翻译： 公开了一种由金属散热器和基板组成的散热基板。 金属散热器具有一个具有空腔的表面，其适于支撑模具。 这种表面还包括布置在空腔周边的接地环; 围绕所述接地环的周边的衬底支撑表面; 布置在所述基板支撑表面的周边的多个第一接地焊盘; 以及布置在基板支撑表面上并突出的多个第二接地焊盘。 基板设置在具有多个通孔的基板支撑表面上。 通孔对应于第一接地焊盘，以使其分别位于其中。 衬底还包括多个安装焊盘和多个焊盘，其中安装焊盘靠近腔体，并且第一接地焊盘，第二接地焊盘和球焊盘以球栅阵列的形式形成 并且大致共面。

公开(公告)号：US06429049B1

公开(公告)日：2002-08-06

申请号：US09874154

申请日：2001-06-05

申请人： Chun-Chi Lee ,  Jaw-Shiun Hsieh ,  Yao-Hsin Feng ,  Shyh-Ing Wu ,  Kuan-Neng Liao ,  Chin-Pei Tien

发明人： Chun-Chi Lee ,  Jaw-Shiun Hsieh ,  Yao-Hsin Feng ,  Shyh-Ing Wu ,  Kuan-Neng Liao ,  Chin-Pei Tien

IPC分类号： H01L2144

CPC分类号： H01L21/486 ,  H01L21/4846 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H05K3/0061 ,  H05K3/3478 ,  H05K3/3489 ,  H05K3/3494 ,  H05K3/386 ,  H05K3/4038 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/063 ,  H05K2203/107 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A laser method for forming vias comprises: providing a heat sink; locally oxidizing a surface of the heat sink into a copper oxide film; bonding a substrate onto the heat sink at the copper oxide layer locations, wherein the substrate comprises at least a patterned trace layer and an insulating layer to which is bonded the heat sink, the insulating layer comprising a plurality of through holes that expose the portions of the copper oxide film; removing the copper oxide exposed through the through holes by laser beam; disposing a plurality of solder balls respectively in the through holes; and reflowing the solder balls to form a plurality of vias.

摘要翻译： 用于形成通孔的激光方法包括：提供散热器; 将散热器的表面局部氧化成氧化铜膜; 在铜氧化物层位置将衬底接合到散热器上，其中衬底包括至少图案化的迹线层和与散热片接合的绝缘层，绝缘层包括多个通孔，其暴露部分 氧化铜膜; 通过激光束去除通过通孔暴露的氧化铜; 将多个焊球分别设置在通孔中; 并且回流焊球以形成多个通孔。

公开(公告)号：US06918178B2

公开(公告)日：2005-07-19

申请号：US10345929

申请日：2003-01-17

申请人： Shin-Hua Chao ,  Shyh-Ing Wu ,  Kuan-Neng Liao ,  Gin-Nan Yeh

发明人： Shin-Hua Chao ,  Shyh-Ing Wu ,  Kuan-Neng Liao ,  Gin-Nan Yeh

IPC分类号： H01L21/56 ,  H01L23/34 ,  H01L23/433 ,  H05K3/30

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49798 ,  Y10T83/0457 ,  Y10T83/0538 ,  Y10T83/2079 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC packages abutting each other in a matrix arrangement. The IC package matrix and the heat sink matrix attached thereto are then simultaneously cut by means of a machine tool into a plurality of individually formed IC packages each with a heat sink attached; thereby, thermal conductivity of a conventional IC package is enhanced.

摘要翻译： 一种将散热器整体地连接到IC封装上以提高封装的导热性的改进方法。 可分离成多个单独的散热器的散热器矩阵被附接到IC封装矩阵，IC封装矩阵由多个单独的IC封装组成，以矩阵方式彼此邻接。 然后，通过机床将IC封装矩阵和附接到其上的散热器矩阵同时切割成多个单独形成的IC封装，每个IC封装均附着有散热片; 从而提高了传统IC封装的导热性。