公开(公告)号：US20210308827A1

公开(公告)日：2021-10-07

申请号：US14755838

申请日：2015-06-30

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/017 ,  B24D3/00

摘要： A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

公开(公告)号：US10267564B2

公开(公告)日：2019-04-23

申请号：US13813270

申请日：2011-02-01

申请人： Byung Sook Kim ,  Min Sung Kim ,  Kyoung Hoon Chai

发明人： Byung Sook Kim ,  Min Sung Kim ,  Kyoung Hoon Chai

IPC分类号： F27B14/04 ,  F27B5/04 ,  F27B5/06 ,  F27D5/00 ,  F27B14/10

摘要： A heat treatment container for a vacuum heat treatment apparatus according to an exemplary embodiment includes a bottom portion and a sidewall, and a support protruding inward.

公开(公告)号：US20190091832A1

公开(公告)日：2019-03-28

申请号：US15926901

申请日：2018-03-20

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/017 ,  H01L21/306 ,  B24D18/00 ,  H01L21/768 ,  H01L21/3105 ,  H01L21/321

摘要： CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a composite conditioner can include a base plate and a plurality of polishing units secured to a surface of the base plate by an adhesive layer, where each polishing unit includes a plurality of polishing tips secured in a binding layer. Additionally, a height difference between a first highest polishing tip and a second highest polishing tip is less than or equal to about 10 μm, a height difference between the first highest polishing tip and a tenth highest polishing tip is less than or equal to about 20 μm, and a height difference between the first highest polishing tip and a 100th highest polishing tip is less than or equal to about 40 μm. Furthermore, the first highest polishing tip protrudes from the binding layer to a height of greater than or equal to about 50 μm.

公开(公告)号：US20180044185A1

公开(公告)日：2018-02-15

申请号：US15444226

申请日：2017-02-27

申请人： Chien-Min Sung ,  Shao Chung Hu ,  I-Chiao Lin ,  Chien-Pei Yu

发明人： Chien-Min Sung ,  Shao Chung Hu ,  I-Chiao Lin ,  Chien-Pei Yu

IPC分类号： H01L21/02 ,  B82Y40/00 ,  C04B35/653 ,  C04B35/622 ,  C23C14/06 ,  B82Y30/00 ,  C04B35/583

CPC分类号： C01B32/184 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/20 ,  C04B35/583 ,  C04B35/62218 ,  C04B35/653 ,  C04B2235/3203 ,  C23C14/0605 ,  H01L21/0242 ,  H01L21/02425 ,  H01L21/02491 ,  H01L21/02527 ,  H01L21/0254 ,  H01L21/02573 ,  H01L21/02612 ,  H01L21/02625 ,  Y10S977/734 ,  Y10S977/842 ,  Y10S977/932 ,  Y10T428/24612 ,  Y10T428/31678

摘要： Graphene layers made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, for example, a method of forming a graphite film can include heating a solid substrate under vacuum to a solubilizing temperature that is less than a melting point of the solid substrate, solubilizing carbon atoms from a graphite source into the heated solid substrate, and cooling the heated solid substrate at a rate sufficient to form a graphite film from the solubilized carbon atoms on at least one surface of the solid substrate. The graphite film is formed to be substantially free of lattice defects.

公开(公告)号：US20170232577A1

公开(公告)日：2017-08-17

申请号：US15362464

申请日：2016-11-28

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/017 ,  B24D18/00

CPC分类号： B24B53/017 ,  B24D18/0072 ,  H01L21/30625 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/7684

摘要： CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a composite conditioner can include a base plate and a plurality of polishing units secured to a surface of the base plate by an adhesive layer, where each polishing unit includes a plurality of polishing tips secured in a binding layer. Additionally, a height difference between a first highest polishing tip and a second highest polishing tip is less than or equal to about 10 μm, a height difference between the first highest polishing tip and a tenth highest polishing tip is less than or equal to about 20 μm, and a height difference between the first highest polishing tip and a 100th highest polishing tip is less than or equal to about 40 μm. Furthermore, the first highest polishing tip protrudes from the binding layer to a height of greater than or equal to about 50 μm.

公开(公告)号：US09463552B2

公开(公告)日：2016-10-11

申请号：US13113779

申请日：2011-05-23

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/017 ,  B24D11/00 ,  B24B53/02 ,  B24D3/06 ,  B01J3/06

CPC分类号： B24B53/017 ,  B01J3/062 ,  B01J2203/061 ,  B01J2203/062 ,  B01J2203/0645 ,  B01J2203/0655 ,  B01J2203/066 ,  B01J2203/068 ,  B24B53/02 ,  B24D3/06 ,  B24D11/005 ,  Y10T428/24893

摘要： A superabrasive tools having uniformly leveled superabrasive particles and associated methods are provided. In one aspect, for example, a superabrasive can include a metal matrix configured for bonding superabrasive particles and a plurality of superabrasive particles held in the metal matrix at specific positions according to a predetermined pattern, wherein tips of each of the plurality of the superabrasive particles protrude from the metal matrix to a uniform height.

摘要翻译： 提供了具有均匀平整的超研磨颗粒和相关方法的超级磨料工具。 一方面，例如，超级磨料可以包括金属基体，其被配置为根据预定图案将超研磨颗粒和保持在特定位置处的金属基体中的多个超研磨颗粒结合，其中多个超级磨料颗粒中的每一个的尖端 从金属基体突出到均匀的高度。

公开(公告)号：US20160211379A1

公开(公告)日：2016-07-21

申请号：US14983904

申请日：2015-12-30

申请人： Jung-Gun You ,  Se-Wan Park ,  Baik-Min Sung ,  Bo-Cheol Jeong

发明人： Jung-Gun You ,  Se-Wan Park ,  Baik-Min Sung ,  Bo-Cheol Jeong

IPC分类号： H01L29/78 ,  H01L29/06 ,  H01L27/088

CPC分类号： H01L27/0886 ,  H01L21/823431 ,  H01L21/823481 ,  H01L29/0649 ,  H01L29/7851 ,  H01L29/7853 ,  H01L29/7854

摘要： Semiconductor devices are provided including a first fin-shaped pattern having first and second sidewalls facing one another and a field insulating film contacting at least a portion of the first fin-shaped pattern. The first fin-shaped pattern includes a lower portion of the first fin-shaped pattern contacting the field insulating film; an upper portion of the first fin-shaped pattern not contacting the field insulating film; a first boundary between the lower portion of the first fin-shaped pattern and the upper portion of the first fin-shaped pattern; and a first fin center line perpendicular to the first boundary and meeting the top of the upper portion of the first fin-shaped pattern. The first sidewall of the upper portion of the first fin-shaped pattern and the second sidewall of the upper portion of the first fin-shaped pattern are asymmetric with respect to the first fin center line.

摘要翻译： 提供半导体器件，其包括具有彼此面对的第一和第二侧壁的第一鳍状图案和与第一鳍状图案的至少一部分接触的场绝缘膜。 第一鳍状图案包括与场绝缘膜接触的第一鳍状图案的下部; 所述第一鳍状图案的上部不与所述场绝缘膜接触; 第一鳍状图案的下部与第一鳍状图案的上部之间的第一边界; 以及垂直于第一边界并且满足第一鳍状图案的上部的顶部的第一鳍中心线。 第一鳍状图案的上部的第一侧壁和第一鳍状图案的上部的第二侧壁相对于第一翅片中心线是不对称的。

公开(公告)号：US09283693B2

公开(公告)日：2016-03-15

申请号：US13813323

申请日：2011-07-27

申请人： Min Sung Kim ,  Myeong Jeong Kim ,  Young Nam Kim

发明人： Min Sung Kim ,  Myeong Jeong Kim ,  Young Nam Kim

IPC分类号： B28B3/02 ,  B22F3/14 ,  B28B3/08 ,  B30B11/00 ,  B30B15/06 ,  C04B35/565 ,  C04B35/634 ,  C04B35/645

CPC分类号： B28B3/025 ,  B22F3/14 ,  B28B3/08 ,  B30B11/007 ,  B30B15/067 ,  B30B15/068 ,  C04B35/565 ,  C04B35/63476 ,  C04B35/645 ,  C04B2235/48 ,  C04B2235/5436 ,  C04B2235/77

摘要： A hot press sintering apparatus according to the embodiment includes a chamber; a mold member located in the chamber and including a mold space section to be filled with a raw material; a press member for pressing and processing the raw material in the mold member; and a heating member for heating an interior of the chamber. The mold member includes a first mold part and a second mold part inserted into the first mold part and formed with the mold space section.

摘要翻译： 根据实施例的热压烧结装置包括：腔室; 模具构件，其位于所述室中并且包括要填充原料的模具空间部分; 用于对所述模具构件中的原料进行加压和加工的压制构件; 以及用于加热室内部的加热构件。 模具构件包括第一模具部件和插入到第一模具部件中并形成有模具空间部分的第二模具部件。

公开(公告)号：US20160003213A1

公开(公告)日：2016-01-07

申请号：US14790854

申请日：2015-07-02

申请人： Son-Cheol Yu ,  Han Gil Joe ,  Seok Min Wi ,  Hyeon Woo Cho ,  Jeong Hwe Gu ,  Min Sung Kim ,  Hee seung Kwon ,  Jason Seungjoo Lee ,  Ju Hyun Pyo

发明人： Son-Cheol Yu ,  Han Gil Joe ,  Seok Min Wi ,  Hyeon Woo Cho ,  Jeong Hwe Gu ,  Min Sung Kim ,  Hee seung Kwon ,  Jason Seungjoo Lee ,  Ju Hyun Pyo

IPC分类号： F03B13/18 ,  F03B13/22

CPC分类号： F03B13/183 ,  F05B2250/311 ,  F05B2250/315 ,  F05B2270/18 ,  Y02E10/38

摘要： A position-controlled wave power generating apparatus. A position-controlled wave power generating apparatus is included a floating part floatable on a body of water, a motion conversion unit coupled to a floating part, a power generating unit generating electricity using a generator connected to a motion conversion unit, and a position control unit positioned below a water surface to generate a thrust from the energy of waves.

摘要翻译： 位置控制波发电装置。 位置控制波发电装置包括浮动在水体上的浮动部分，耦合到浮动部分的运动转换单元，使用连接到运动转换单元的发电机发电的发电单元，以及位置控制波发电装置的位置控制 位于水面下方的单元以从波浪的能量产生推力。

公开(公告)号：US09221154B2

公开(公告)日：2015-12-29

申请号：US13633082

申请日：2012-10-01

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/017 ,  B24D18/00

CPC分类号： B24D18/0054 ,  B01J2203/061 ,  B01J2203/062 ,  B01J2203/0645 ,  B01J2203/0655 ,  B01J2203/066 ,  B01J2203/068 ,  B24B53/017

摘要： Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

摘要翻译： 公开和描述了超研磨工具及其制造方法。 在一个方面，超磨料颗粒通过钎焊合金根据预定图案化学键合到基质载体材料上。 钎焊合金可以提供为粉末，薄片或非晶合金片。 可以使用具有以预定图案布置的多个孔的模板来将超研磨颗粒放置在给定的基底或基质支撑材料上。