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9 条记录 (耗时 0.013 秒)

    Method for producing contactless chip cards and corresponding contactless chip card
    3.
    发明授权
    Method for producing contactless chip cards and corresponding contactless chip card 失效
    非接触式芯片卡及相应的非接触式芯片卡的制造方法

    公开(公告)号：US06651891B1

    公开(公告)日：2003-11-25

    申请号：US09530339

    申请日：2000-06-28

    申请人： Elke Zakel ,  Rolf Aschenbrenner ,  Frank Ansorge ,  Paul Kasulke

    发明人： Elke Zakel ,  Rolf Aschenbrenner ,  Frank Ansorge ,  Paul Kasulke

    IPC分类号： G06K1900

    CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L2224/16225 ,  H01L2224/16227

    摘要： The present invention relates to a method of producing a contactless chip card. In a first step of the method, a card body with one or a plurality of recesses on one card body side is produced from a theremoplastic material, preferably by injection moulding. Bumps being formed on the base surface of the recesses. Subsequently, conductor tracks corresponding to a coil as a conductor track pattern are impressed directly onto surface areas of the card body side including the recesses using a hot impressing technique. The conductor tracks are impressed especially also onto surface areas inside the recesses such that same extends across the bumps. One or a plurality of chips are then aligned in the recesses and contacted with the conductor tracks in the recesses which extend across the bumps. The method according to the present invention is advantageous insofar as it permits a simple production of a chip card, which requires only a few method steps and is therefore also economical. Furthermore, such a chip card is both mechanically stable and reliable, since it comprises very few individual layers and since the conductor tracks of the coil are applied directly to the card body.

    摘要翻译： 本发明涉及无接触芯片卡的制造方法。 在该方法的第一步中，优选地通过注射成型从一个塑料材料制造具有一个卡体侧上的一个或多个凹部的卡体。 凸起形成在凹部的基面上。 随后，使用热压技术将对应于作为导体轨迹图案的线圈的导体轨迹直接印刷到包括凹部的卡体侧的表面区域上。 导体轨迹特别地也压在凹槽内的表面区域上，使得它们延伸穿过凸块。 然后将一个或多个芯片对准凹槽，并与延伸穿过凸块的凹槽中的导体轨迹相接触。 根据本发明的方法是有利的，只要它允许简单地生产芯片卡，这仅需要少量的方法步骤，因此也是经济的。 此外，这样的芯片卡机械稳定和可靠，因为它包括非常少的单独的层，并且由于线圈的导体轨迹直接施加到卡体。

    Solder bump for flip chip assembly and method of its fabrication
    6.
    发明授权
    Solder bump for flip chip assembly and method of its fabrication 失效
    用于倒装芯片组装的焊接凸块及其制造方法

    公开(公告)号：US5906312A

    公开(公告)日：1999-05-25

    申请号：US849035

    申请日：1997-07-02

    申请人： Elke Zakel ,  Rolf Aschenbrenner

    发明人： Elke Zakel ,  Rolf Aschenbrenner

    IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/485 ,  H01R4/02

    CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19043 ,  H01L2924/351 ,  H01R4/02

    摘要： The invention relates to a solder bump for flip-chip assembly and consist of a core containing a high proportion of a soft and electrically well conducting metal, particularly gold, and a diffusion barrier layer deposited on the solder bump core. As is known, the diffusion barrier layer functions to prevent intermetallic compounds between the gold of the solder bump core and the solder material, especially tin-lead solder material, which would otherwise reduce the mechanical stability of the solder connection. A pre-treatment with a cleaning solvent or in a nucleation bath has hitherto been necessary. to provide a good bond between the diffusion barrier layer, usually nickel, and the solder bump core. With the invention, this pretreatment process step is no longer necessary, since small amounts of a material are added to the solder bump core which acts as a nucleation material for the diffusion barrier layer. Such solder bump cores may, for instance, very easily and cost-efficiently be fabricated mechanically as ball bumps (with 98% of gold and 2% of palladium).

    摘要翻译： PCT No.PCT / DE95 / 01590 Sec。 371日期1997年7月2日 102（e）日期1997年7月2日PCT提交1995年11月10日PCT公布。 出版物WO96 / 17382 日期1996年6月6日本发明涉及一种用于倒装芯片组装的焊料凸块，其由包含高比例的导电软导电金属，特别是金的芯体和沉积在焊料凸点芯上的扩散阻挡层组成。 众所周知，扩散阻挡层的作用是防止焊料凸起芯的金和焊料材料（尤其是锡铅焊料）之间的金属间化合物，否则会降低焊料连接的机械稳定性。 迄今为止，用清洁溶剂或成核浴进行预处理是必要的。 以在扩散阻挡层（通常为镍）和焊料凸点芯之间提供良好的结合。 利用本发明，由于少量的材料被添加到作为扩散阻挡层的成核材料的焊料凸块中，因此不再需要该预处理工艺步骤。 例如，这种焊料凸点芯可以非常容易且经济高效地机械地制造为球凸点（具有98％的金和2％的钯）。