公开(公告)号：US20200150409A1

公开(公告)日：2020-05-14

申请号：US16745273

申请日：2020-01-16

Applicant: SUSS MicroTec Photonic Systems Inc.

Inventor： Yanrong Yuan ,  John Bjorkman ,  Paul Ferrari ,  Jeff Hansen

IPC: G02B17/08 ,  H01L21/68 ,  G02B7/10 ,  G03F7/20 ,  G02B17/00 ,  G02B7/09

Abstract: Techniques are disclosed for magnification compensation and/or beam steering in optical systems. An optical system may include a lens system to receive first radiation associated with an object and direct second radiation associated with an image of the object toward an image plane. The lens system may include a set of lenses, and an actuator system to selectively adjust the set of lenses to adjust a magnification associated with the image symmetrically along a first and a second direction. The lens system may also include a beam steering lens to direct the first radiation to provide the second radiation. In some examples, the lens system may also include a second set of lenses, where the actuator system may also selectively adjust the second set of lenses to adjust the magnification along the first or the second direction. Related methods are also disclosed.

公开(公告)号：US20160204028A1

公开(公告)日：2016-07-14

申请号：US15072685

申请日：2016-03-17

Applicant: International Business Machines Corporation ,  SUSS MicroTec Photonic Systems Inc.

Inventor： Yuri M. Brovman ,  Brian M. Erwin ,  Nicholas A. Polomoff ,  Jennifer D. Schuler ,  Matthew E. Souter ,  Christopher L. Tessler

IPC: H01L21/768

CPC classification number: H01L21/76841 ,  H01L21/76825 ,  H01L21/76837 ,  H01L21/7684 ,  H01L21/76849 ,  H01L21/7685 ,  H01L21/76852 ,  H01L21/76865 ,  H01L21/76877 ,  H01L21/76883 ,  H01L21/76885 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03614 ,  H01L2224/03632 ,  H01L2224/0381 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05187 ,  H01L2224/05647 ,  H01L2224/1182 ,  H01L2224/13007 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13687 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/04941 ,  H01L2924/00012

Abstract: A method of selectively locating a barrier layer on a substrate includes forming a barrier layer on a surface of the substrate. The barrier layer comprises of a metal element and a non-metal element. The barrier layer may also be formed from a metal element and non-metal element. The method further includes forming an electrically conductive film layer on the barrier layer, and forming a metallic portion in the electrically conductive film layer. The method further includes selectively ablating portions of the barrier layer from the dielectric layer to selectively locate place the barrier layer on the substrate.

公开(公告)号：US20160074968A1

公开(公告)日：2016-03-17

申请号：US14483321

申请日：2014-09-11

Applicant: SUSS MicroTec Photonic Systems Inc. ,  International Business Machines Corporation

Inventor： Matthew E. Souter ,  Brian M. Erwin ,  Nicholas A. Polomoff ,  Christopher L. Tessler

IPC: B23K26/36 ,  B23K26/06 ,  G03F1/48 ,  B23K26/00

CPC classification number: B23K26/009 ,  B23K26/066 ,  B23K26/361 ,  B23K2103/56

Abstract: A laser etching system includes a laser source configured to generate a plurality of laser pulses during an etching pass. A workpiece is aligned with respect to the laser source. The workpiece includes an etching material that is etched in response to receiving the plurality of laser pulses. A mask reticle is interposed between the laser source and the workpiece. The mask reticle includes at least one mask pattern configured to regulate the fluence or a number of laser pulses realized by the workpiece such that a plurality of features having different depths with respect to one another are etched in the etching material.

Abstract translation: 激光蚀刻系统包括被配置为在蚀刻通过期间产生多个激光脉冲的激光源。 工件相对于激光源对准。 工件包括蚀刻材料，其被蚀刻以响应于接收多个激光脉冲。 掩模掩模布置在激光源和工件之间。 掩模掩模版包括至少一个掩模图案，其被配置为调节由工件实现的注量或多个激光脉冲，使得在蚀刻材料中蚀刻具有彼此不同深度的多个特征。

公开(公告)号：US11209635B2

公开(公告)日：2021-12-28

申请号：US16745273

申请日：2020-01-16

Applicant: SUSS MicroTec Photonic Systems Inc.

Inventor： Yanrong Yuan ,  John Bjorkman ,  Paul Ferrari ,  Jeff Hansen

IPC: G03F7/20 ,  G02B17/08 ,  G02B7/09 ,  G02B17/00 ,  G02B7/10 ,  H01L21/68 ,  G02B13/26

Abstract: Techniques are disclosed for magnification compensation and/or beam steering in optical systems. An optical system may include a lens system to receive first radiation associated with an object and direct second radiation associated with an image of the object toward an image plane. The lens system may include a set of lenses, and an actuator system to selectively adjust the set of lenses to adjust a magnification associated with the image symmetrically along a first and a second direction. The lens system may also include a beam steering lens to direct the first radiation to provide the second radiation. In some examples, the lens system may also include a second set of lenses, where the actuator system may also selectively adjust the second set of lenses to adjust the magnification along the first or the second direction. Related methods are also disclosed.

公开(公告)号：US20200225454A1

公开(公告)日：2020-07-16

申请号：US16831730

申请日：2020-03-26

Applicant: SUSS MicroTec Photonic Systems Inc.

Inventor： Paul Ferrari ,  Yanrong Yuan ,  Jeff Hansen ,  Gerrad Killion

IPC: G02B17/08 ,  G02B7/09 ,  G02B17/00 ,  G03F7/20 ,  G02B7/10 ,  H01L21/68

Abstract: Techniques are disclosed for optical distortion reduction in projection systems for scanning projection and/or lithography. A projection system includes an illumination system configured to generate illumination radiation for generating an image of an object to be projected onto an image plane of the projection system. The illumination system includes a field omitting illumination condenser configured to receive the illumination radiation from a radiation source and provide a patterned illumination radiation beam to generate the image of the object, wherein the patterned illumination radiation beam comprises an omitted illumination portion corresponding to a ridge line of a roof prism disposed within an optical path of the projection system.

公开(公告)号：US09748135B2

公开(公告)日：2017-08-29

申请号：US14828608

申请日：2015-08-18

Applicant: International Business Machines Corporation ,  SUSS MicroTec Photonic Systems Inc.

Inventor： Yuri M. Brovman ,  Brian M. Erwin ,  Nicholas A. Polomoff ,  Jennifer D. Schuler ,  Matthew E. Souter ,  Christopher L. Tessler

IPC: H01L21/768

CPC classification number: H01L21/76841 ,  H01L21/76825 ,  H01L21/76837 ,  H01L21/7684 ,  H01L21/76849 ,  H01L21/7685 ,  H01L21/76852 ,  H01L21/76865 ,  H01L21/76877 ,  H01L21/76883 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03614 ,  H01L2224/03632 ,  H01L2224/0381 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05187 ,  H01L2224/05647 ,  H01L2224/1182 ,  H01L2224/13007 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13687 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/04941 ,  H01L2924/00012

Abstract: A method of selectively locating a barrier layer on a substrate includes forming a barrier layer on a surface of the substrate. The barrier layer comprises of a metal element and a non-metal element. The barrier layer may also be formed from a metal element and non-metal element. The method further includes forming an electrically conductive film layer on the barrier layer, and forming a metallic portion in the electrically conductive film layer. The method further includes selectively ablating portions of the barrier layer from the dielectric layer to selectively locate place the barrier layer on the substrate.

公开(公告)号：US20150357235A1

公开(公告)日：2015-12-10

申请号：US14828608

申请日：2015-08-18

Applicant: International Business Machines Corporation ,  SUSS MicroTec Photonic Systems Inc.

Inventor： Yuri M. Brovman ,  Brian M. Erwin ,  Nicholas A. Polomoff ,  Jennifer D. Schuler ,  Matthew E. Souter ,  Christopher L. Tessler

IPC: H01L21/768

CPC classification number: H01L21/76841 ,  H01L21/76825 ,  H01L21/76837 ,  H01L21/7684 ,  H01L21/76849 ,  H01L21/7685 ,  H01L21/76852 ,  H01L21/76865 ,  H01L21/76877 ,  H01L21/76883 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03614 ,  H01L2224/03632 ,  H01L2224/0381 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05187 ,  H01L2224/05647 ,  H01L2224/1182 ,  H01L2224/13007 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13687 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/04941 ,  H01L2924/00012

Abstract: A method of selectively locating a barrier layer on a substrate includes forming a barrier layer on a surface of the substrate. The barrier layer comprises of a metal element and a non-metal element. The barrier layer may also be formed from a metal element and non-metal element. The method further includes forming an electrically conductive film layer on the barrier layer, and forming a metallic portion in the electrically conductive film layer. The method further includes selectively ablating portions of the barrier layer from the dielectric layer to selectively locate place the barrier layer on the substrate.

公开(公告)号：US09779932B2

公开(公告)日：2017-10-03

申请号：US14967121

申请日：2015-12-11

Applicant: SUSS MicroTec Photonic Systems Inc.

Inventor： Habib Hichri

IPC: H01L21/00 ,  H01L21/02 ,  B23K26/40 ,  H01L21/311 ,  B23K26/142 ,  B23K26/36 ,  H01L21/31

CPC classification number: H01L21/0206 ,  B23K26/0006 ,  B23K26/08 ,  B23K26/142 ,  B23K26/16 ,  B23K26/18 ,  B23K26/355 ,  B23K26/359 ,  B23K26/36 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/56 ,  H01L21/02096 ,  H01L21/02354 ,  H01L21/31 ,  H01L21/31105 ,  H01L21/31127 ,  H01L21/31144

Abstract: A method of removing post-laser debris from a wafer includes, for an embodiment, forming a sacrificial layer over a layer to be patterned, patterning the sacrificial layer and the layer to be patterned using laser ablation, and removing the sacrificial layer and debris deposited on the sacrificial layer with water. The sacrificial layer includes a water soluble binder and a water soluble ultraviolet (UV) absorbent. Systems for removing the post-laser debris are also described.

公开(公告)号：US09754823B2

公开(公告)日：2017-09-05

申请号：US14288840

申请日：2014-05-28

Applicant: International Business Machines Corporation ,  SUSS MicroTec Photonic Systems Inc.

Inventor： Yuri M. Brovman ,  Brian M. Erwin ,  Nicholas A. Polomoff ,  Jennifer D. Schuler ,  Matthew E. Souter ,  Christopher L. Tessler

IPC: H01L21/768

CPC classification number: H01L21/76841 ,  H01L21/76825 ,  H01L21/76837 ,  H01L21/7684 ,  H01L21/76849 ,  H01L21/7685 ,  H01L21/76852 ,  H01L21/76865 ,  H01L21/76877 ,  H01L21/76883 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03614 ,  H01L2224/03632 ,  H01L2224/0381 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05187 ,  H01L2224/05647 ,  H01L2224/1182 ,  H01L2224/13007 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13687 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/04941 ,  H01L2924/00012

Abstract: A method of selectively locating a barrier layer on a substrate includes forming a barrier layer on a surface of the substrate. The barrier layer comprises of a metal element and a non-metal element. The barrier layer may also be formed from a metal element and non-metal element. The method further includes forming an electrically conductive film layer on the barrier layer, and forming a metallic portion in the electrically conductive film layer. The method further includes selectively ablating portions of the barrier layer from the dielectric layer to selectively locate place the barrier layer on the substrate.

公开(公告)号：US20150348831A1

公开(公告)日：2015-12-03

申请号：US14288840

申请日：2014-05-28

Applicant: International Business Machines Corporation ,  SUSS MicroTec Photonic Systems Inc.

Inventor： Yuri M. Brovman ,  Brian M. Erwin ,  Nicholas A. Polomoff ,  Jennifer D. Schuler ,  Matthew E. Souter ,  Christopher L. Tessler

IPC: H01L21/768

CPC classification number: H01L21/76841 ,  H01L21/76825 ,  H01L21/76837 ,  H01L21/7684 ,  H01L21/76849 ,  H01L21/7685 ,  H01L21/76852 ,  H01L21/76865 ,  H01L21/76877 ,  H01L21/76883 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03614 ,  H01L2224/03632 ,  H01L2224/0381 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05187 ,  H01L2224/05647 ,  H01L2224/1182 ,  H01L2224/13007 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13687 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/04941 ,  H01L2924/00012

Abstract: A method of selectively locating a barrier layer on a substrate includes forming a barrier layer on a surface of the substrate. The barrier layer comprises of a metal element and a non-metal element. The barrier layer may also be formed from a metal element and non-metal element. The method further includes forming an electrically conductive film layer on the barrier layer, and forming a metallic portion in the electrically conductive film layer. The method further includes selectively ablating portions of the barrier layer from the dielectric layer to selectively locate place the barrier layer on the substrate.

Abstract translation: 在衬底上选择性地定位阻挡层的方法包括在衬底的表面上形成阻挡层。 阻挡层由金属元素和非金属元素组成。 阻挡层也可以由金属元素和非金属元素形成。 该方法还包括在阻挡层上形成导电膜层，并在导电膜层中形成金属部分。 该方法还包括从电介质层选择性地烧蚀阻挡层的部分，以选择性地将阻挡层定位在衬底上。