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173 条记录 (耗时 0.025 秒)

    PIPE JOINT STRUCTURE
    1.
    发明申请
    PIPE JOINT STRUCTURE 审中-公开
    管接头结构

    公开(公告)号：US20120098250A1

    公开(公告)日：2012-04-26

    申请号：US12908094

    申请日：2010-10-20

    申请人： YEO-SHAN CHANG ,  Wen-Shan Chang

    发明人： YEO-SHAN CHANG ,  Wen-Shan Chang

    IPC分类号： F16L55/00

    CPC分类号： F16L37/0915

    摘要： A pipe joint structure for an upright valve includes a pipe joint, a resilient ring, a connection cylinder and an inner sleeve. The pipe joint includes a first chamber to receive a positioning ring and a seal ring. The resilient ring, the connection cylinder and the inner sleeve are inserted in the pipe joint in sequence. When a connection pipe is inserted in the pipe joint, the connection pipe will be inserted in a one-way direction and fastened by fastening talons of the resilient ring. To disengage the connection pipe, top push flanges of resilient claws of the inner sleeve are pushed to an inner limit inclined surface of the positioning ring to disengage the connection pipe from the fastening talons, such that the connection pipe can be pulled out. The present invention provides a quick connection and can prevent the connection pipe from being pulled out unexpectedly.

    摘要翻译： 用于直立阀的管接头结构包括管接头，弹性环，连接圆筒和内套筒。 管接头包括用于接收定位环和密封环的第一室。 弹性环，连接筒和内套筒依次插入管接头。 当连接管插入管接头时，连接管将以单向方向插入，并通过紧固弹性环的爪来紧固。 为了使连接管脱离，内套筒的弹性爪的顶推法兰被推动到定位环的内限倾斜面，以使连接管与紧固爪分离，从而可以将连接管拉出。 本发明提供快速连接并且可以防止连接管意外拉出。

    Ankle-spinning exercise apparatus
    2.
    发明授权
    Ankle-spinning exercise apparatus 有权

    公开(公告)号：US12090364B2

    公开(公告)日：2024-09-17

    申请号：US17944194

    申请日：2022-09-14

    申请人： Sung-Shan Chang Chien

    发明人： Sung-Shan Chang Chien

    IPC分类号： A63B23/08

    CPC分类号： A63B23/08

    摘要： An ankle-spinning exercise apparatus includes a casing unit, a power unit arranged in an interior of the casing unit, and a support unit drivable by the power unit to perform a rotation motion. A user may place an ankle on the support unit, and the power unit drives the support unit to perform rightward and leftward rotation motions, so that the entire lower limb (leg) of the user is driven to do a spinning like rotating motion, to thereby exercise the muscles and the meridian system of the entire lower limb of the user by which an effect of body building and heath care can be achieved.

    MOBILE APPARATUS WITH OPTICAL INDEXER, AND METHOD FOR INDEXING USING THE SAME
    4.
    发明申请
    MOBILE APPARATUS WITH OPTICAL INDEXER, AND METHOD FOR INDEXING USING THE SAME 审中-公开
    具有光学指示器的移动设备，以及使用其的索引的方法

    公开(公告)号：US20150193019A1

    公开(公告)日：2015-07-09

    申请号：US14147681

    申请日：2014-01-06

    申请人： YUN-SHAN CHANG ,  DA-WEI LIN

    发明人： YUN-SHAN CHANG

    IPC分类号： G06F3/038 ,  G06F3/041 ,  G06F3/03 ,  G01B11/14 ,  G06F3/0354

    CPC分类号： G06F3/0383 ,  G06F3/0325 ,  G06F3/03543 ,  G06F3/041

    摘要： Disclosure is to a mobile apparatus having an optical indexer, and a method for performing indexing. The mobile apparatus includes an optical indexing module for sensing a movement. A control interface is generated in simulation and displayed on the mobile apparatus as it apparatus operates as a computer mouse. In the method, the simulated control interface is initiated in the beginning. The optical indexing module is activated to perform a tracing process, in which the optical indexing module emits a light and receives, especially by the multiple sensing cells arranged in an array, the reflected light. The photo energy received by the every sensing cell within a time slot can be computed. The energy difference in the time slot is used to determine a moving direction. An indexing signal is generated by converting movement signal made by optical indexing module and control signal from the simulated control interface.

    摘要翻译： 披露的是具有光学分度器的移动设备和用于执行索引的方法。 移动装置包括用于感测运动的光学分度模块。 仿真中产生控制接口并显示在移动设备上，因为该设备作为计算机鼠标操作。 在该方法中，模拟控制接口在开始时启动。 光学分度模块被激活以执行跟踪过程，其中光学分度模块发射光，并且特别地由布置在阵列中的多个感测单元接收反射光。 可以计算在时隙内由每个感测单元接收的光能。 使用时隙中的能量差来确定移动方向。 通过转换由光学分度模块产生的运动信号和来自模拟控制界面的控制信号产生分度信号。

    OPTICAL SENSOR ARRAY APPARATUS
    5.
    发明申请
    OPTICAL SENSOR ARRAY APPARATUS 有权
    光传感器阵列设备

    公开(公告)号：US20150085298A1

    公开(公告)日：2015-03-26

    申请号：US14036233

    申请日：2013-09-25

    申请人： YUN-SHAN CHANG ,  DA WEI LIN

    发明人： YUN-SHAN CHANG

    IPC分类号： G06F3/0354 ,  G01B9/02

    CPC分类号： G01D5/347 ,  G06F3/0317 ,  G06F3/03541 ,  G06F3/03543

    摘要： Disclosure is related to an optical sensor array apparatus. According to one embodiment of the invention, multiple sensor pixels are arranged as an array and forming a sensor array. Every comparator circuit is connected to one sensor pixel so as to calculate its energy state. A light source such as laser is installed in the apparatus. A control circuit is provided to recognize the sensor pixels' energy states for determining the spatial interference difference made by the reflected ray. The sensor array apparatus may be adapted to various surfaces since the light intensity and exposure time is able to be modulated as a compensation mechanism.

    摘要翻译： 公开涉及光传感器阵列装置。 根据本发明的一个实施例，多个传感器像素被布置为阵列并形成传感器阵列。 每个比较器电路连接到一个传感器像素，以便计算其能量状态。 在设备中安装诸如激光的光源。 提供控制电路以识别传感器像素的能量状态，以确定由反射光线产生的空间干涉差异。 传感器阵列装置可以适用于各种表面，因为光强度和曝光时间能够作为补偿机制进行调制。

    Semiconductor device with a plurality of mark through substrate vias
    7.
    发明授权
    Semiconductor device with a plurality of mark through substrate vias 有权
    具有多个通过衬底通孔的标记的半导体器件

    公开(公告)号：US08390129B2

    公开(公告)日：2013-03-05

    申请号：US12945134

    申请日：2010-11-12

    申请人： Chi-Chih Shen ,  Jen-Chuan Chen ,  Hui-Shan Chang ,  Chung-Hsi Wu ,  Meng-Jen Wang

    发明人： Chi-Chih Shen ,  Jen-Chuan Chen ,  Hui-Shan Chang ,  Chung-Hsi Wu ,  Meng-Jen Wang

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L23/544 ,  H01L23/481 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/16146

    摘要： The present invention relates to a semiconductor device with a plurality of mark through substrate vias, including a semiconductor substrate, a plurality of original through substrate vias and a plurality of mark through substrate vias. The original through substrate vias and the mark through substrate vias are disposed in the semiconductor substrate and protrude from the backside surface of the semiconductor substrate. The mark through substrate vias are added at a specific position and/or in a specific pattern and serve as a fiducial mark, which facilitates identifying the position and direction on the backside surface. Thus, the redistribution layer (RBL) or the special equipment for achieving the backside alignment (BSA) is not necessary.

    摘要翻译： 本发明涉及具有多个标记通过衬底通孔的半导体器件，包括半导体衬底，多个原始通过衬底通孔和多个通过衬底通孔的标记。 原始通过衬底通孔和通过衬底通孔的标记设置在半导体衬底中并从半导体衬底的背面突出。 通过基板通孔的标记在特定位置和/或特定图案上添加，并且用作基准标记，这有助于识别背面上的位置和方向。 因此，不需要再分配层（RBL）或用于实现背侧对准（BSA）的专用设备。

    PACKAGING STRUCTURE
    8.
    发明申请
    PACKAGING STRUCTURE 审中-公开
    包装结构

    公开(公告)号：US20120205800A1

    公开(公告)日：2012-08-16

    申请号：US13448706

    申请日：2012-04-17

    申请人： Chi-Chih Shen ,  Jen-Chuan Chen ,  Hui-Shan Chang ,  Wen-Hsiung Chang

    发明人： Chi-Chih Shen ,  Jen-Chuan Chen ,  Hui-Shan Chang ,  Wen-Hsiung Chang

    IPC分类号： H01L23/498

    CPC分类号： H01L23/3135 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3128 ,  H01L25/0657 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2225/06548 ,  H01L2924/15311

    摘要： A package structure and a package process are proposed in using pillar bumps to connect an upper second chip and through silicon vias of a lower first chip, wherein a gap between the first chip and the second chip can be controlled by adjusting a height of the pillar bumps. In other words, the pillar bumps compensate the height difference between the first chip and a molding compound surrounding the first chip so as to ensure the bondibility between the pillar bumps and the corresponding through silicon vias and improve the process yield. Furthermore, the pillar bumps maintain the gap between the second chip and the molding compound for allowing an underfill being properly filled into the space between the first chip and the second chip.

    摘要翻译： 提出了一种封装结构和封装工艺，其中使用柱状突起来连接上部第二芯片和通过下部第一芯片的硅导通孔，其中第一芯片和第二芯片之间的间隙可以通过调节支柱的高度来控制 颠簸 换句话说，支柱凸块补偿第一芯片和围绕第一芯片的模塑料之间的高度差，以确保柱状凸块与相应的通过硅通孔之间的结合性，并提高工艺产量。 此外，支柱凸块保持第二芯片和模塑料之间的间隙，以使底部填充物适当地填充到第一芯片和第二芯片之间的空间中。

    Multifunctional antistatic non-woven fabric and fabrication method thereof
    9.
    发明授权
    Multifunctional antistatic non-woven fabric and fabrication method thereof 有权
    多功能抗静电无纺布及其制造方法

    公开(公告)号：US08163663B2

    公开(公告)日：2012-04-24

    申请号：US12463565

    申请日：2009-05-11

    申请人： Wei-Jen Lai ,  Sheng-Shan Chang

    发明人： Wei-Jen Lai ,  Sheng-Shan Chang

    IPC分类号： B32B5/02

    CPC分类号： H01B1/24 ,  D01F1/09 ,  D01F6/62 ,  D04H1/4334 ,  D04H1/435 ,  D04H1/4382 ,  D04H3/007 ,  D04H3/009 ,  D04H3/011 ,  D04H3/147 ,  D04H3/153 ,  D04H3/16 ,  Y10T442/2418 ,  Y10T442/655 ,  Y10T442/68

    摘要： The invention provides a conductive powder composite including a bamboo charcoal powder pre-processed with a pulverizing procedure and a refining procedure of 900 to 1500° C. and a conductive carbon black powder, wherein the bamboo charcoal powder and the conductive carbon black powder are blended by a high speed mechanical granulating machine to form the conductive powder composite. The conductive powder composite can simultaneously and effectively improve the poor conductivity of the bamboo charcoal powder and the embrittlement characteristic of the conductive carbon black powder in the conventional technology. The invention also provides a conductive masterbatch and a fabrication method thereof, and a multifunctional antistatic non-woven fabric and a fabrication method thereof.

    摘要翻译： 本发明提供一种导电性粉末复合体，其包括预粉碎的竹炭粉末和900〜1500℃的精制工序和导电炭黑粉末，其中将竹炭粉末和导电性炭黑粉末混合 通过高速机械造粒机形成导电粉末复合材料。 导电粉末复合材料可以同时有效地改善传统技术中竹炭粉的导电性差和导电性炭黑粉末的脆化特性。 本发明还提供导电母料及其制造方法，以及多功能抗静电无纺布及其制造方法。