摘要:
A peelable heat-conductive and pressure-sensitive adhesive is disclosed, which comprises: (a) 100 parts by weight of a polymer produced from a monomer mixture comprising from 70 to 100% by weight of one or more alkyl (meth)acrylates in which the alkyl groups on the average have 2 to 14 carbon atoms and from 0 to 30% by weight of one or more monoethylenic monomers copolymerizable therewith, each based on the amount of the monomer mixture; (b) from 20 to 400 parts by weight of a plasticizer having a boiling point of 150° C. or higher; and (c) from 10 to 1,000 parts by weight of a heat-conductive filler. Also disclosed is an adhesive sheet comprising a substrate and, formed on one or each side thereof, a layer of the adhesive. The pressure-sensitive adhesive can exhibit tight adhesion during use and easy peeling after use.
摘要:
A pressure-sensitive adhesive excellent in the heat resistance and the heat-conductivity comprising a photopolymerization product of a composition containing a) 100 parts by weight of an acrylic monomer mixture or the partial polymerized product thereof, b) from 0.01 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) from 10 to 300 parts by weight of a ceramic powder made up of a covalent bond substance having the total valence electron number of 8 and having a wurtzite type or zincblende type crystal structure or a substance of a hexagonal system or a graphite structure, and d) from 0.01 to 5 parts by weight of a photopolymerization initiator; an adhesive sheet using the pressure-sensitive adhesive; and a fixing method of electronic parts and heat-radiating members using them. By using the adhesive materials, electronic parts and heat-radiating members can be easily fixed by adhesion without requiring much time and large labor, and there is no fear that peeling and deterioration occur, even when they are subjected to a heat cycle of quick heating and quick cooling.
摘要:
The present invention provides a double-sided pressure-sensitive adhesive tape or sheet including a bubble-containing pressure-sensitive adhesive layer; and a releasable liner protecting a pressure-sensitive adhesive surface of the bubble-containing pressure-sensitive adhesive layer, said releasable liner comprising at least a releasably treated layer formed by an ionizing radiation-curable silicone type releasing agent, in which the releasably treated layer formed by the ionizing radiation-curable silicone type releasing agent is employed onto a pressure-sensitive adhesive surface on the heavier releasable side. The double-sided pressure-sensitive adhesive tape or sheet may employ a bubble-containing pressure-sensitive adhesive layer formed by a bubble-containing pressure-sensitive adhesive composition in the form in which a gas component is mixed in a pressure-sensitive adhesive composition.
摘要:
A thermosetting pressure-sensitive adhesive comprising a photopolymerization product of a composition containing a) 100 parts by weight of a (meth) acrylic acid alkyl ester wherein the average carbon atom number of the alkyl group is from 2 to 14 and from 30 to 1% by weight of a monoethylenically unsaturated acid copolymerizable with the ester, b) from 0.02 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) from 0.01 to 4 parts by weight of a photopolymerization initiator, and d) from 5 to 30 parts by weight of an epoxy resin, and not substantially containing a curing agent for the epoxy resin, and an adhesive sheet using the thermosetting type pressure-sensitive adhesive.
摘要:
Heat-conductive and pressure-sensitive adhesive sheets which are excellent in heat resistance, scarcely undergo anchoring fracture between the base material and the adhesive layer and, therefore, are usable in fixing electronic parts to heat-radiating members or fixing members in various fields including constructive materials, vehicles, aircrafts and ships. the heat-conductive and pressure-sensitive adhesive sheets are in the form of sheets, tapes, etc. wherein a layer of a heat-conductive and pressure-sensitive adhesive composition, which contains an alkyl (meth)acrylate polymer having hydrophilic groups, is formed on the high frequency sputter-etched surface(s) of a plastic film containing 2 to 50% by volume of a heat-conductive, electrical insulating filler.
摘要:
The present invention relates to a moisture-proof material having a polyurethane film substrate and an adhesive layer formed on at least one surface of the substrate, which material shows a tensile strength of not less than 7500 psi, and an elongation at break of not less than 550%.
摘要:
The present invention relates to a moisture-proof material having a polyurethane film substrate and an adhesive layer formed on at least one surface of the substrate, which material shows a tensile strength of not less than 7500 psi, and an elongation at break of not less than 550%.
摘要:
The present invention provides a double-sided pressure-sensitive adhesive tape or sheet including a bubble-containing pressure-sensitive adhesive layer; and a releasable liner protecting a pressure-sensitive adhesive surface of the bubble-containing pressure-sensitive adhesive layer, said releasable liner comprising at least a releasably treated layer formed by an ionizing radiation-curable silicone type releasing agent, in which the releasably treated layer formed by the ionizing radiation-curable silicone type releasing agent is employed onto a pressure-sensitive adhesive surface on the heavier releasable side. The double-sided pressure-sensitive adhesive tape or sheet may employ a bubble-containing pressure-sensitive adhesive layer formed by a bubble-containing pressure-sensitive adhesive composition in the form in which a gas component is mixed in a pressure-sensitive adhesive composition.
摘要:
In order to provide a heat-conductive pressure-sensitive adhesive which is excellent in heat conductivity and adhesive property, in particular, shows a large adhesive force in a high temperature (heat resisting shear retention force), does not show an extreme viscosity increase during or after the preparation thereof, and is excellent in the stability, the present invention provides a heat-conductive pressure-sensitive adhesive comprising a) 100 parts by weight of a copolymer of a monomer mixture comprising from 70 to 99% by weight of a monomer made up of a (meth) acrylic acid alkyl ester having an alkyl group having from 2 to 14 carbon atoms on an average as the main constituent and from 30 to 1% by weight of a copolymerizable monomer having an acidic or basic polar group in the molecule and b) from 10 to 300 parts by weight of a heat-conductive filler having the same polarity as the polar group of the above-described copolymerizable monomer and having a purity of at least 95% by weight, an adhesive sheet comprising the layer of the heat-conductive pressure-sensitive adhesive on a substrate, and a method of fixing by adhesion an electronic part and a heat-radiating member which comprises fixing by adhering an electronic part and a heat-radiating member by the use of the heat-conductive pressure-sensitive adhesive or the adhesive sheet.
摘要:
A first release liner of the present invention comprises a single- or multilayered film having a releasable layer in which the peel strength in application to an acrylic plate (23 DEG C.) is 0.02-0.5 N/20 mm. Also provided is a second release liner which comprises a single- or multilayered film having a releasable layer comprising an ethylene/vinyl acetate resin. The release liners each may be a multilayered film composed of a substrate and a releasable layer. When each of the release liners is used as a release liner in winding a pressure-sensitive adhesive tape on a bobbin, the tape winding operation is free from troubles that the release liner undesirably peels off, tape shifting occurs, and air inclusion occurs between tape layers. When the pressure-sensitive adhesive tape is used, the release liner can be easily peeled from the pressure-sensitive adhesive layer.