公开(公告)号：US09329496B2

公开(公告)日：2016-05-03

申请号：US13552140

申请日：2012-07-18

申请人： Shinji Sato

发明人： Shinji Sato

IPC分类号： G03B27/32 ,  G03B27/52 ,  G03B27/58 ,  H02K41/02 ,  G03F7/20 ,  H01L21/68

CPC分类号： G03F7/70716 ,  G03F7/70341 ,  H01L21/682

摘要： An exposure apparatus exposing a substrate with exposure light through liquid, including: an optical member having an emitting surface from which exposure light is emitted; a substrate holding apparatus that includes: a first holding portion holding a lower surface of substrate so that lower surface of substrate can be released, and a first member that defines an opening where substrate can be arranged, and that has an upper surface which is arranged at a vicinity of an upper surface of the substrate in a state which the substrate is held by the first holding portion; and a porous member of which at least a part is arranged at a gap between the substrate and the first member, and which has an upper surface liquid-repellent with respect to the liquid, wherein at least a part of the liquid which flows into the gap is recovered through the porous member.

摘要翻译： 一种曝光装置，其中曝光光通过液体曝光，包括：具有发射曝光光的发射表面的光学构件; 一种基板保持装置，包括：第一保持部，其保持基板的下表面，使得可以释放基板的下表面;以及第一构件，其限定可以布置基板的开口，并且具有布置的上表面 在所述基板被所述第一保持部保持的状态下，在所述基板的上表面的附近; 以及多孔部件，其至少一部分配置在所述基板和所述第一部件之间的间隙处，并且具有相对于所述液体的上表面防水性，其中流入所述液体的至少一部分液体 间隙通过多孔构件回收。

公开(公告)号：US09290670B2

公开(公告)日：2016-03-22

申请号：US13266032

申请日：2010-04-21

申请人： Fabinia H. Romero ,  Yoshiko Nishijima ,  Haruo Hamaki ,  Shinji Sato ,  Taro Niki ,  Yasunori Motegi

发明人： Fabinia H. Romero ,  Yoshiko Nishijima ,  Haruo Hamaki ,  Shinji Sato ,  Taro Niki ,  Yasunori Motegi

IPC分类号： C09D5/24 ,  H01B1/22 ,  C09D5/10

CPC分类号： C09D5/24 ,  C09D5/103 ,  H01B1/22

摘要： Provided is a highly versatile conductive metallic coating material which is free from the limitation related to a facility without handling complication, and which can maintain its anticorrosive action for a long period. Specifically provided is a conductive metallic coating material which has an organic resin component and a metal component containing aluminum and magnesium and which exhibits a sacrificial anticorrosive reaction on iron. A content ratio of the metal component and the organic resin component is desirably 98:2 to 80:20 in terms of weight ratio. The conductive metallic coating material according to the present invention is usable for preventing corrosion of a building structure or a civil engineering structure and for repairing a corrosion proof treated surface of an existing building structure or a civil engineering structure.

摘要翻译： 提供了一种高度通用的导电金属涂层材料，其不受处理并不适用于设备的限制，并且可长期保持其防腐蚀作用。 具体地提供了一种导电金属涂层材料，其具有有机树脂组分和含有铝和镁的金属组分，并且在铁上表现出牺牲性防腐蚀反应。 金属成分和有机树脂成分的含有比优选为98:2〜80:20（重量比）。 根据本发明的导电金属涂层材料可用于防止建筑结构或土木工程结构的腐蚀，以及用于修复现有建筑结构或土木工程结构的防腐处理表面。

公开(公告)号：USD736440S1

公开(公告)日：2015-08-11

申请号：US29482956

申请日：2014-02-24

申请人： Shinji Sato ,  Shin Miyata ,  Yuri Kim

设计人： Shinji Sato ,  Shin Miyata ,  Yuri Kim

公开(公告)号：US09036438B2

公开(公告)日：2015-05-19

申请号：US13486305

申请日：2012-06-01

申请人： Gerrit Jan Hemink ,  Shinji Sato

发明人： Gerrit Jan Hemink ,  Shinji Sato

IPC分类号： G11C7/04 ,  G11C11/56

CPC分类号： G11C16/26 ,  G11C7/04 ,  G11C11/5642

摘要： Data is programmed into and read from a set of target memory cells. When reading the data, temperature compensation is provided. The temperature compensation is based on temperature information and the state of one or more neighbor memory cells. In one embodiment, when data is read from set of target memory cells, the system senses the current temperature and determines the differences in temperature between the current temperature and the temperature at the time the data was programmed. If the difference in temperature is greater than a threshold, then the process of reading the data includes providing temperature compensation based on temperature information and neighbor state information. In one alternative, the decision to provide the temperature compensation can be triggered by conditions other than a temperature differential.

摘要翻译： 数据被编程到一组目标存储器单元中并从其读取。 读取数据时，提供温度补偿。 温度补偿基于温度信息和一个或多个相邻存储单元的状态。 在一个实施例中，当从目标存储器单元的集合读取数据时，系统感测当前温度并确定当前温度与数据编程时的温度之间的温度差。 如果温度差大于阈值，则读取数据的过程包括基于温度信息和邻近状态信息提供温度补偿。 在一个替代方案中，提供温度补偿的决定可以由温差以外的条件触发。

公开(公告)号：US08953143B2

公开(公告)日：2015-02-10

申请号：US12765410

申请日：2010-04-22

申请人： Shinji Sato

发明人： Shinji Sato

IPC分类号： G03B27/52 ,  G03F7/20

CPC分类号： G03F7/70341

摘要： A liquid immersion member is disposed around an optical member having an emergent surface from at least part of which exposure light is emitted and which holds a liquid between itself and an object opposing the emergent surface so that an optical path of exposure light between the emergent surface and the object is filled with a liquid to form an immersion space. The liquid immersion member comprises: an opening that recovers a liquid on the object with a gas; a space into which the liquid and the gas from the opening are entered; a recovery passageway into which only a liquid in the space is entered; an inner side surface that opposes at least part of a side surface of the optical member with a gap therebetween; and a recovery port that recovers at least part of a liquid in the gap.

摘要翻译： 液浸部件设置在具有从出射表面的至少一部分的出射表面的光学部件的周围，其中，至少部分曝光光被发射并且在其自身与与出射表面相对的物体之间保持液体，使得在出射表面 并且物体充满液体以形成浸没空间。 液浸部件包括：用气体回收物体上的液体的开口; 从开口进入液体和气体的空间; 一个进入该空间的液体的回收通道; 与所述光学构件的侧面的至少一部分相对的内侧面，其间具有间隙; 以及恢复所述间隙中的液体的至少一部分的回收口。

公开(公告)号：US08937703B2

公开(公告)日：2015-01-20

申请号：US13180978

申请日：2011-07-12

申请人： Shinji Sato

发明人： Shinji Sato

IPC分类号： G03F7/20

CPC分类号： G03F7/709 ,  G03F7/70341

摘要： A liquid immersion member is disposed inside an immersion exposure apparatus and at least partly around an optical member and around an optical path of exposure light that passes through a liquid between the optical member and an object. The liquid immersion member comprises: a first member, which has a first surface, a second surface that faces a direction other than that faced by the first surface, and a plurality of holes that connects the first surface and the second surface, that recovers at least some of the liquid from the space above the object opposing the first surface via the holes; a recovery passageway, wherethrough the liquid recovered via the holes of the first member flows; and a discharge part, which separately discharges a liquid and a gas from the recovery passageway. The first member comprises a first portion and a second portion. The second portion hinders a gas flowing from a space between the object and the first surface into the recovery passageway via the holes more than the first portion does.

摘要翻译： 浸液构件设置在浸没曝光装置的内部，并且至少部分地围绕光学构件并围绕通过光学构件和物体之间的液体的曝光光的光路。 液浸构件包括：第一构件，其具有第一表面，面向除了由第一表面面对的方向的第二表面;以及多个孔，其连接第一表面和第二表面，其在 通过所述孔从所述物体上方的与所述第一表面相对的空间中的至少一些液体; 回收通道，通过第一构件的孔回收的液体流过; 以及排出部，其从回收通路分别排出液体和气体。 第一构件包括第一部分和第二部分。 第二部分阻止气体从物体和第一表面之间的空间经由多于第一部分的孔流入回收通道。

公开(公告)号：US08921998B2

公开(公告)日：2014-12-30

申请号：US14236236

申请日：2012-08-24

申请人： Yusuke Zushi ,  Yoshinori Murakami ,  Satoshi Tanimoto ,  Shinji Sato ,  Kohei Matsui

发明人： Yusuke Zushi ,  Yoshinori Murakami ,  Satoshi Tanimoto ,  Shinji Sato ,  Kohei Matsui

IPC分类号： H01L23/10 ,  H01L23/34 ,  H01L23/538 ,  H01L23/373 ,  H01L23/00 ,  H01L25/07 ,  H01L23/498 ,  H01L25/18

CPC分类号： H01L23/5384 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/48091 ,  H01L2224/48132 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module has a pair of semiconductor devices, a heat sink, a first electrode, an output electrode and a second electrode. The semiconductor devices are connected in series with each other and have first terminals that are electrically connected to a first power system and a second terminal that is electrically connected to a second power system. The first electrode is electrically connected both to one of the first terminal and to an electrode of one of the semiconductor devices. The output electrode is electrically connected both to the second terminal and to an electrode of the other of the semiconductor device. The second electrode is electrically connected to the other of the first terminals. The second electrode is connected to the heat sink via a first insulating member. The output electrode is connected to the second electrode via a second insulating member.

摘要翻译： 半导体模块具有一对半导体器件，散热器，第一电极，输出电极和第二电极。 半导体器件彼此串联连接并且具有电连接到第一电力系统的第一端子和电连接到第二电力系统的第二端子。 第一电极电连接到第一端子中的一个和半导体器件中的一个的电极。 输出电极与第二端子和半导体器件的另一个的电极电连接。 第二电极与第一端子中的另一个电连接。 第二电极通过第一绝缘构件连接到散热器。 输出电极经由第二绝缘构件与第二电极连接。

公开(公告)号：US08916882B2

公开(公告)日：2014-12-23

申请号：US14116890

申请日：2012-05-11

申请人： Yusuke Zushi ,  Yoshinori Murakami ,  Satoshi Tanimoto ,  Shinji Sato ,  Kohei Matsui

发明人： Yusuke Zushi ,  Yoshinori Murakami ,  Satoshi Tanimoto ,  Shinji Sato ,  Kohei Matsui

IPC分类号： H03K17/16 ,  H01L27/06 ,  H02M1/08

CPC分类号： H01L27/0629 ,  H01L27/0682 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49111 ,  H01L2924/19105 ,  H02M1/08 ,  H03K17/04123 ,  H03K17/166 ,  H01L2924/00014

摘要： A switching circuit includes: a first switching element (Q1); a resistor (11) inserted between a control electrode (G) of the first switching element (Q1) and a control circuit (13) switching the first switching element (Q1); and a first capacitor (15) and a second switching element (14) connected in series between the control electrode (G) of the first switching element (Q1) and a low potential-side electrode (S) of the first switching element (Q1). A high potential-side electrode of the second switching element (14) is connected to the control electrode (G) of the first switching element (Q1). An electrode of the first capacitor (15) is connected to the low potential-side electrode (S) of the first switching element (Q1). A control electrode of the second switching element (14) is connected to an electrode of the resistor (11) connected to the control circuit (13).

摘要翻译： 开关电路包括：第一开关元件（Q1）; 插入在第一开关元件（Q1）的控制电极（G）和切换第一开关元件（Q1）的控制电路（13）之间的电阻器（11）; 以及串联连接在第一开关元件（Q1）的控制电极（G）和第一开关元件（Q1）的低电位侧电极（S）之间的第一电容器（15）和第二开关元件（14） ）。 第二开关元件（14）的高电位侧电极连接到第一开关元件（Q1）的控制电极（G）。 第一电容器（15）的电极与第一开关元件（Q1）的低电位侧电极（S）连接。 第二开关元件（14）的控制电极连接到与控制电路（13）连接的电阻器（11）的电极。

公开(公告)号：US20140191250A1

公开(公告)日：2014-07-10

申请号：US14234476

申请日：2012-07-27

申请人： Satoshi Tanimoto ,  Yusuke Zushi ,  Yoshinori Murakami ,  Takashi Iseki ,  Masato Takamori ,  Shinji Sato ,  Kohei Matsui

发明人： Satoshi Tanimoto ,  Yusuke Zushi ,  Yoshinori Murakami ,  Takashi Iseki ,  Masato Takamori ,  Shinji Sato ,  Kohei Matsui

IPC分类号： H01L23/00 ,  H01L29/16 ,  H01L29/20

CPC分类号： H01L29/1602 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K1/206 ,  B23K35/007 ,  B23K35/025 ,  B23K35/282 ,  B23K35/286 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2101/42 ,  C22C18/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L29/1608 ,  H01L29/2003 ,  H01L2224/29118 ,  H01L2224/32225 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01322 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device is carried out by readying each of a semiconductor element, a substrate having Cu as a principal element at least on a surface, and a ZnAl solder chip having a smaller shape than that of the semiconductor element; disposing the semiconductor element and the substrate so that respective bonding surfaces face each other, and sandwiching the ZnAl eutectic solder chip between the substrate and the semiconductor element; increasing the temperature of the ZnAl solder chip sandwiched between the substrate and the semiconductor element while applying a load to the ZnAl solder chip such that the ZnAl solder chip melts to form a ZnAl solder layer; and reducing the temperature of the ZnAl solder layer while applying a load to the ZnAl solder layer.

摘要翻译： 半导体器件的制造方法是通过将半导体元件，至少具有表面的Cu作为主要元素的基板和比半导体元件的形状小的ZnAl焊料芯片进行准位来进行的。 将所述半导体元件和所述基板配置为使得各个接合面彼此面对，并将所述ZnAl共晶焊料夹在所述基板和所述半导体元件之间; 在向ZnAl焊料芯片施加负载的同时，增加夹在基板和半导体元件之间的ZnAl焊料芯片的温度，使得ZnAl焊料芯片熔化形成ZnAl焊料层; 并且在向ZnAl焊料层施加负载的同时降低ZnAl焊料层的温度。

公开(公告)号：US08760890B2

公开(公告)日：2014-06-24

申请号：US12967882

申请日：2010-12-14

申请人： Shinji Sato

发明人： Shinji Sato

IPC分类号： H02M7/5387

CPC分类号： H02M7/5387 ,  H02M2001/0087

摘要： A current source inverter includes an inverter having arm units and AC terminals, the numbers of the arm units and AC terminals being adapted to an AC load connected to the AC terminals. An upper arm is connected between a positive DC terminal and the corresponding AC terminal and has an upper arm switch Q7 (Q2, Q3) and an upper arm diode. A lower arm is connected between a negative DC terminal 5 and the corresponding AC terminal and has a lower arm switch Q8 (Q5, Q6) and a lower arm diode. The apparatus also includes a smoothing reactor and a DC power source that are connected in series between the positive DC terminal and the negative DC terminal, and includes drivers to control ON/OFF of the upper and lower aim switches to output AC power. The switches Q7 and Q8 are each a normally-ON switch.

摘要翻译： 电流源逆变器包括具有臂单元和AC端子的逆变器，臂单元和AC端子的数量适用于连接到AC端子的AC负载。 上臂连接在正直流端子和相应的交流端子之间，并具有上臂开关Q7（Q2，Q3）和上臂二极管。 下臂连接在负DC端子5和相应的AC端子之间，并具有下臂开关Q8（Q5，Q6）和下臂二极管。 该装置还包括串联连接在正直流端子和负直流端子之间的平滑电抗器和直流电源，并且包括用于控制上，下目标开关的接通/断开以输出交流电力的驱动器。 开关Q7和Q8均为常开开关。