公开(公告)号：US20050218529A1

公开(公告)日：2005-10-06

申请号：US11099823

申请日：2005-04-06

申请人： Silvia Gohlke ,  Thomas Munch

发明人： Silvia Gohlke ,  Thomas Munch

IPC分类号： H01L21/52 ,  H01L21/58 ,  H01L23/12 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L24/32 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/27013 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.

摘要翻译： 具有由绝缘材料制成的衬底的半导体芯片的电路支撑件具有芯片安装区域和围绕芯片安装区域的多个焊盘。 芯片可以应用在芯片安装区域的中心区域。 围绕中心区域的周边区域限定了芯片安装区域的边界，并且其长度大于待安装芯片的侧边缘的长度。

公开(公告)号：US06570320B1

公开(公告)日：2003-05-27

申请号：US09701894

申请日：2000-12-04

申请人： Klaus Burkhardt ,  Wolfgang Eckhardt ,  Silvia Gohlke ,  Ruth Männer ,  Wolfram Wersing

发明人： Klaus Burkhardt ,  Wolfgang Eckhardt ,  Silvia Gohlke ,  Ruth Männer ,  Wolfram Wersing

IPC分类号： H01J6304

CPC分类号： H01J9/18 ,  H01J37/12 ,  H01J2237/06375 ,  H01J2237/1205

摘要： The invention is directed to an extremely low-capacitance device for shaping an electron beam. The device is based on a ceramic body having a monolithic multi-layer structure. The manufacture of the ceramic body ensues with the assistance of LTCC technology, whereby this method is designationally modified. The body is constructed of pre-sintered ceramic layers whose lateral shrinkage is suppressed. The through apertures of the electrodes for the electron beam are thus arranged exactly coaxially, and the tolerances of the electrode dimensions are decoupled from the shrinkage during sintering. The electron beam of an electron gun is focused and the intensity thereof is modulated with the assistance of such a device.

摘要翻译： 本发明涉及用于成形电子束的极低电容器件。 该装置基于具有单片多层结构的陶瓷体。 在LTCC技术的帮助下，陶瓷体的制造是由这种方法进行的。 本体由预烧结的陶瓷层构成，其横向收缩被抑制。 因此，用于电子束的电极的通孔精确地同轴布置，并且电极尺寸的公差与烧结期间的收缩率分离。 聚焦电子枪的电子束，并借助这种装置调制其强度。

公开(公告)号：US20070235732A1

公开(公告)日：2007-10-11

申请号：US11675962

申请日：2007-02-16

申请人： Silvia Gohlke ,  Sieglinde Kraus ,  Hans Rappl ,  Gunther Rauscher

发明人： Silvia Gohlke ,  Sieglinde Kraus ,  Hans Rappl ,  Gunther Rauscher

IPC分类号： H01L29/06

CPC分类号： H01L24/48 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L41/0475 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/78301 ,  H01L2224/83801 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/83205

摘要： An electrical arrangement has a first electrically conductive contact point (10) and a second electrically conductive contact point (20), the first and the second contact point being arranged at a distance (x) from one another and being electrically connected to one another via a wire connection arrangement (30), the wire connection arrangement (30) being formed by at least two wire connections (31-1, 31-2, . . . , 31-n-1, 31-n) which have respectively a first end (32-1, 32-1, 32-n-1, 32-n) and a second end (33-1, 33-2, . . . , 33-n-1, 33-3), and the first end of a wire connection (30-2, . . . , 30-n) and the second end of a preceding wire connection (30-1, . . . , 30-n-1) being in direct contact with one another.

摘要翻译： 电气布置具有第一导电接触点（10）和第二导电接触点（20），所述第一和第二接触点彼此间隔（x）设置并彼此电连接通过 电线连接装置（30），所述电线连接装置（30）由至少两个电线连接（31-1,31-2，...，31-n，31-n）形成，所述电线连接装置分别具有 第一端（32-1,32-1,32-n-1，32-n）和第二端（33-1,33-2，...，33-n-1,33-3）和 电线连接（30-2，...，30-n）的第一端和前一线连接（30-1，...，30-n-1）的第二端与一个 另一个。

公开(公告)号：US07256504B2

公开(公告)日：2007-08-14

申请号：US11099823

申请日：2005-04-06

申请人： Silvia Gohlke ,  Thomas Münch

发明人： Silvia Gohlke ,  Thomas Münch

IPC分类号： H01L23/48

CPC分类号： H01L24/32 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/27013 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.

摘要翻译： 具有由绝缘材料制成的衬底的半导体芯片的电路支撑件具有芯片安装区域和围绕芯片安装区域的多个焊盘。 芯片可以应用在芯片安装区域的中心区域。 围绕中心区域的周边区域限定了芯片安装区域的边界，并且其长度大于待安装芯片的侧边缘的长度。