摘要:
A service system includes a mobile terminal and an information processing device capable of communication via a network. The mobile terminal includes a first transmission unit that transmits spherical images taken in respective imaging locations and positional information about the imaging locations to the information processing device. The information processing device includes a reception unit that receives the spherical images transmitted by the first transmission unit; a map data obtaining unit that obtains map data from a map data storage, the map data including the imaging locations of the spherical images; a path information creation unit that creates information about a path made by connecting the imaging locations in the map data obtained by the map data obtaining unit; and a content providing unit that makes content available for a request through the network, the content including the map data, the information about the path, and the spherical images.
摘要:
An object of the invention is to provide an illumination device that can make it easy to detect a disorder of a light emitting element, and a liquid crystal display apparatus including the illumination device. Each light emitting element array (S) is constituted by light emitting elements (T) which are connected in series. To the light emitting elements (T) are individually connected in parallel current bypass elements (U) that are changed from a disconnected state where no current flows to a connected state where current flows when a predetermined voltage higher than that applied to the light emitting elements in an lighting state is applied thereto. Each power source unit (P) is connected to each light emitting element array (S) in series, and supplies constant current to each light emitting element (T). Terminal units for voltage detection (11) are connected to an anode (A) of each light emitting element (T).
摘要:
An object of the invention is to provide a boundary scan controller that allows a boundary scan to be executed and also allows a semiconductor apparatus to be manufactured in such a manner that the same type of semiconductor circuit chips are stacked. When identification data stored in memory means (85) is compared with fixed data held in fixed-data holding means (87) by comparison means (88) and the identification data is coincident with the fixed data, a data derivation section (89) outputs the same data as data which is outputted from an output section (86). In a boundary scan test, a data derivation section (89) of a boundary controller (80) provided for each semiconductor circuit chip is connected to the same bus line. When the identification data is not coincident with the fixed data, the data derivation section (89) can be substantially disconnected from the bus line. In this way, the same type of semiconductor circuit chips for which the boundary controller (80) is provided can be stacked, thereby manufacturing the semiconductor apparatus.
摘要:
A memory chip includes a main memory cell; a row-wise redundant memory cell and a column-wise redundant memory cell for relieving a defect existing in the main memory; an identification number designation terminal for storing an identification number corresponding to the main memory cell; an address terminal for receiving the identification number; and a redundant row selector circuit and a redundant column selector circuit for performing allocation so as to replace a defective memory space of the main memory cell with a memory space of the redundant memory cells. The redundant selector circuits allocate a memory space corresponding to the defect of the main memory cell to the redundant memory cells when the identification number received from the address terminal coincides with the identification number of the identification number specification terminal.
摘要:
A method for manufacturing a semiconductor device can prevent defective products resulting from a plating liquid when surfaces of protruded portions of penetration electrodes are subjected to plating. An organic insulation film (14) is formed on one surface of a substrate proper (10), and a support member (16) is adhered to the organic insulation film (adhesion step). A rear side of the substrate proper is removed until protruded portions (6) of penetration electrodes (7) are exposed, thereby to form a semiconductor substrate (5). Plating films (8) are formed on the surfaces of the protruded portions (6), and the support member and the organic insulation film are removed from the semiconductor substrate. The organic insulation film has an adhesive property and chemical resistance to chemical substances used in respective steps after the adhesion step, and it is at least dissolved in or peeled off from a chemical substance used in the removal step.
摘要:
A printing device into which data conversion functionality may be installed is disclosed. According to one aspect, the printing device receives, through a first module, a command that is intended to cause the printing device to perform an action that is indicated by the command. The printing device determines whether a translation module, which contains logic for translating the command, is installed in the printing device. If the translation module is not installed in the printing device, then the printing device sends data, which indicates the command, directly from the first module to a second module If the translation module is installed in the printing device, then the printing device invokes the logic to translate the command into one or more translated commands that will cause the printing device to perform the intended action, and sends the one or more translated commands to the second module.
摘要:
A method for producing an electronic circuit device includes a repair step in which, in a case where a semiconductor device once mounted on a wiring board is defective, the defective semiconductor device is removed from the wiring board and a new semiconductor device is mounted on the wiring board. The repair step includes the steps of: removing an excessive residue of a brazing metal residue remaining on lands of the wiring board from which the defective semiconductor device has been removed and leaving a uniform amount of the brazing metal residue on the lands; aligning the new semiconductor device with the wiring board; and melting the brazing metal residue which is made uniform and remains on the lands and projecting electrodes of the new semiconductor device by heating, thereby connecting the new semiconductor device to the wiring board.
摘要:
An image projection apparatus includes a projection unit configured to project an image onto a projection target; a recognition unit configured to recognize an instruction action for the image being projected by the projection unit; a storage control unit configured to store correspondence information in which multiple instruction actions are associated with image output controls, respectively, for each type of image in a storage device; a determination unit configured to determine, on the basis of the type of the image being projected by the projection unit, correspondence information for image output control; and a projection control unit configured to perform, on the basis of the correspondence information determined by the determination unit and the instruction action recognized by the recognition unit, image projection control corresponding to the image output control that is associated with the instruction action.
摘要:
An image projection apparatus includes a projection unit configured to project an image onto a projection target; a recognition unit configured to recognize an instruction action for the image being projected by the projection unit; a storage control unit configured to store correspondence information in which multiple instruction actions are associated with image output controls, respectively, for each type of image in a storage device; a determination unit configured to determine, on the basis of the type of the image being projected by the projection unit, correspondence information for image output control; and a projection control unit configured to perform, on the basis of the correspondence information determined by the determination unit and the instruction action recognized by the recognition unit, image projection control corresponding to the image output control that is associated with the instruction action.
摘要:
An object of the invention is to provide a boundary scan controller that allows a boundary scan to be executed and also allows a semiconductor apparatus to be manufactured in such a manner that the same type of semiconductor circuit chips are stacked. When identification data stored in memory means (85) is compared with fixed data held in fixed-data holding means (87) by comparison means (88) and the identification data is coincident with the fixed data, a data derivation section (89) outputs the same data as data which is outputted from an output section (86). In a boundary scan test, a data derivation section (89) of a boundary controller (80) provided for each semiconductor circuit chip is connected to the same bus line. When the identification data is not coincident with the fixed data, the data derivation section (89) can be substantially disconnected from the bus line. In this way, the same type of semiconductor circuit chips for which the boundary controller (80) is provided can be stacked, thereby manufacturing the semiconductor apparatus.