Abstract:
This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; a first light-emitting stack comprising a first active layer; a bonding interface formed between the substrate and the first light-emitting stack; and a contact structure formed on the first light-emitting stack and comprising first, second and third contact layers. Each of the first, second and third contact layers comprises a doping material.
Abstract:
A light-emitting element, comprises: a first active layer, generating a first light comprising a first dominant wavelength, wherein the first active layer comprises a first quantum well comprising a first quantum-well band gap and a second quantum well comprising a second quantum-well band gap, and the first quantum well and the second quantum well are alternately stacked to form the first active layer, wherein a difference between the first quantum-well band gap and the second quantum-well band gap is between 0.06eV and 0.1eV, and each of the first quantum-well and the second quantum-well is devoid of a barrier; and a second active layer on the first active layer, generating a second light comprising a second dominant wavelength; wherein a difference between the first dominant wavelength and the second dominant wavelength is 150nm to 220nm.
Abstract:
This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; a first light-emitting stack comprising a first active layer; a bonding interface formed between the substrate and the first light-emitting stack; and a contact structure formed on the first light-emitting stack and comprising first, second and third contact layers. Each of the first, second and third contact layers comprises a doping material.
Abstract:
This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; a first light-emitting stack comprising a first active layer; a bonding interface formed between the substrate and the first light-emitting stack; and a contact structure formed between the first light-emitting stack and the bonding interface and comprising a first contact layer and a second contact layer closer to the bonding interface than the first contact layer; wherein the first contact layer and the second contact layer comprises the same material and the first contact layer has an impurity concentration lower than that of the second contact layer.
Abstract:
A wireless transceiver apparatus is provided. The wireless transceiver apparatus includes a signal transmitting circuit, a circuit unit, and a signal receiving circuit. The signal transmitting circuit includes a first output port and is utilized for outputting a first transmission signal via the first output port in a transmission mode. The circuit unit is coupled to the first output port of the signal transmitting circuit. The signal receiving circuit includes a first receiving port and is utilized for receiving a first wireless communication signal via the first receiving port in a reception mode. The first output port is coupled to the first receiving port at a first node. The circuit unit forms a frequency resonance mode to increase an impedance value of the signal transmitting circuit seen by a signal at the first node.
Abstract:
A multi junction solar cell device includes a substrate having a first lattice constant, a first optoelectronic conversion layer having a second lattice constant, and a second optoelectronic conversion layer having a third lattice constant wherein the value of the first lattice constant is between that of the second lattice constant and the third lattice constant.
Abstract:
Disclosed is a solar cell including a first base layer, a second base layer on the first base layer, and an emitter layer on the second base layer. Furthermore, a window layer may be disposed on the emitter, and/or a back surface field (BSF) layer may be disposed under the first base layer.
Abstract:
This invention discloses a GaN semiconductor device comprising a substrate; a metal-rich nitride compound thin film on the substrate; a buffer layer formed on the metal-rich nitride compound thin film, and a semiconductor stack layer on the buffer layer wherein the metal-dominated nitride compound thin film covers a partial upper surface of the substrate. Because metal-rich nitride compound is amorphous, the epitaxial growth direction of the buffer layer grows upwards in the beginning and then turns laterally, and the epitaxy defects of the buffer layer also bend with the epitaxial growth direction of the buffer layer. Therefore, the probability of the epitaxial defects extending to the semiconductor stack layer is reduced and the reliability of the GaN semiconductor device is improved.
Abstract:
A wireless transceiver apparatus is provided. The wireless transceiver apparatus includes a signal transmitting circuit, a circuit unit, and a signal receiving circuit. The signal transmitting circuit includes a first output port and is utilized for outputting a first transmission signal via the first output port in a transmission mode. The circuit unit is coupled to the first output port of the signal transmitting circuit. The signal receiving circuit includes a first receiving port and is utilized for receiving a first wireless communication signal via the first receiving port in a reception mode. The first output port is coupled to the first receiving port at a first node. The circuit unit forms a frequency resonance mode to increase an impedance value of the signal transmitting circuit seen by a signal at the first node.
Abstract:
This invention discloses a GaN semiconductor device comprising a substrate; a metal-rich nitride compound thin film on the substrate; a buffer layer formed on the metal-rich nitride compound thin film, and a semiconductor stack layer on the buffer layer wherein the metal-dominated nitride compound thin film covers a partial upper surface of the substrate. Because metal-rich nitride compound is amorphous, the epitaxial growth direction of the buffer layer grows upwards in the beginning and then turns laterally, and the epitaxy defects of the buffer layer also bend with the epitaxial growth direction of the buffer layer. Therefore, the probability of the epitaxial defects extending to the semiconductor stack layer is reduced and the reliability of the GaN semiconductor device is improved.